公开(公告)号：US20240152064A1

公开(公告)日：2024-05-09

申请号：US18372296

申请日：2023-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mincheol KWAK ,  Jeongjin LEE ,  Seungyoon LEE ,  Chan HWANG

IPC: G03F9/00 ,  G03F7/00 ,  H01L21/027

CPC classification number: G03F9/7073 ,  G03F7/70141 ,  H01L21/027 ,  H01L21/31144

Abstract: A photolithography system includes a light source, a photomask stage, a projection optical system and a wafer stage, and the projection optical system includes an anamorphic lens. In a photolithography method, a wafer and a photomask are mounted on the wafer stage and the photomask stage, respectively, and a first exposure process is performed using the photomask to transfer layouts of patterns included in the photomask to a first half field of the wafer. A relative position of the photomask with respect to the wafer is changed, and a second exposure process is performed to transfer the layouts of the patterns included in the photomask to a second half field of the wafer.

公开(公告)号：US11940737B2

公开(公告)日：2024-03-26

申请号：US17315087

申请日：2021-05-07

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Hsueh-Yi Chung ,  Yung-Cheng Chen ,  Fei-Gwo Tsai ,  Chi-Hung Liao ,  Shih-Chi Fu ,  Wei-Ti Hsu ,  Jui-Ping Chuang ,  Tzong-Sheng Chang ,  Kuei-Shun Chen ,  Meng-Wei Chen

IPC: G03F7/20 ,  G03F1/50 ,  G03F1/68 ,  G03F1/70 ,  G03F1/78 ,  G03F7/00 ,  H01L21/66

CPC classification number: G03F7/70433 ,  G03F1/50 ,  G03F1/68 ,  G03F1/70 ,  G03F1/78 ,  G03F7/20 ,  G03F7/70141 ,  G03F7/70158 ,  G03F7/70716 ,  H01L22/30

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

公开(公告)号：US11852979B2

公开(公告)日：2023-12-26

申请号：US17809566

申请日：2022-06-29

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yong-Ting Wu ,  Yu Kai Chen

IPC: G03F7/00 ,  G03F7/20

CPC classification number: G03F7/70141 ,  G03F7/203 ,  G03F7/2028

Abstract: An edge exposure tool may include a lens adjustment device that is capable of automatically adjusting various parameters of an edge exposure lens to account for changes in operating parameters of the edge exposure tool. In some implementations, the edge exposure tool may also include a controller that is capable of determining edge adjustment parameters for the edge exposure lens and exposure control parameters for the edge exposure tool using techniques such as big data mining, machine learning, and neural network processing. The lens adjustment device and the controller are capable of reducing and/or preventing the performance of the edge exposure tool from drifting out of tolerance, which may maintain the operation performance of the edge exposure tool and reduce the likelihood of wafer scratching, and may reduce the down-time of the edge exposure tool that would otherwise be caused by cleaning and calibration of the edge exposure lens.

公开(公告)号：US11799261B2

公开(公告)日：2023-10-24

申请号：US18020718

申请日：2021-08-10

Applicant: Cymer, LLC

Inventor： Hong Ye

IPC: H01S3/00 ,  G02B5/20 ,  G03F7/00 ,  G03F7/20

CPC classification number: H01S3/0057 ,  G02B5/208 ,  G03F7/7055 ,  G03F7/70141

Abstract: Apparatus for and method of aligning optical components such as mirrors to facilitate proper beam alignment using an image integration optical system is used to integrate images from multiple optical features such as from both left mirror bank and right mirror bank to present the images simultaneously to the camera system. A fluorescent material may be used to render a beam footprint visible and the relative positions of the footprint and an alignment feature may be used to align the optical feature.

公开(公告)号：US11669015B2

公开(公告)日：2023-06-06

申请号：US17593054

申请日：2021-04-16

Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.

Inventor： Xueyu Liang

IPC: G03F7/20 ,  H01L21/683

CPC classification number: G03F7/70141 ,  G03F7/70191 ,  G03F7/70733 ,  H01L21/6831

Abstract: A photolithography device includes: a fixed slot, configured to install and fix the light source; a sensing module, configured to sense the distance information between the light source and the fixed slot; a prompt module, configured to send prompt information according to the distance information; and a determination module, configured to determine the installation status of the light source according to the prompt information.

公开(公告)号：US20180364582A1

公开(公告)日：2018-12-20

申请号：US15994400

申请日：2018-05-31

Applicant: ASML Netherlands B.V.

Inventor： Daan Maurits SLOTBOOM ,  Peter Jacob Kramer ,  Martinus Henrikus Antonius Leenders ,  Bart Dinand Paarhuis

IPC: G03F7/20 ,  G03F9/00

CPC classification number: G03F7/70141 ,  G03F9/7046 ,  G03F9/7096

Abstract: An apparatus and method for performing a measurement operation on a substrate in accordance with one or more substrate alignment models. The one or more substrate alignment models are selected from a plurality of candidate substrate alignment models. The apparatus, which may be a lithographic apparatus, includes an external interface which enables selection of the substrate alignment model(s) and/or alteration of the substrate alignment model(s) prior to the measurement operation.

公开(公告)号：US10078269B2

公开(公告)日：2018-09-18

申请号：US15283669

申请日：2016-10-03

Applicant: NIKON CORPORATION

Inventor： Eric Peter Goodwin ,  Michael B. Binnard ,  Ruslan Kurdyumov

IPC: G03B27/52 ,  G03B27/54 ,  G03F7/20 ,  G01J1/04 ,  G01N21/47

CPC classification number: G03F7/70141 ,  G01J1/0414 ,  G01J1/0448 ,  G01J1/0477 ,  G01J1/08 ,  G01J1/4209 ,  G01N21/4788 ,  G01N21/4795 ,  G03F7/70775 ,  G03F9/7088

Abstract: System and method for accurately measuring alignment of every exposure field on a pre-patterned wafer without reducing wafer-exposure throughput. Diffraction grating disposed in scribe-lines of such wafer, used as alignment marks, and array of encoder-heads (each of which is configured to define positional phase(s) of at least one such alignment mark) are used. Determination of trajectory of a wafer-stage scanning during the wafer-exposure in the exposure tool employs determining in-plane coordinates of such spatially-periodic alignment marks by simultaneously measuring position-dependent phases of signals produced by these marks as a result of recombination of light corresponding to different diffraction orders produced by these marks. Measurements may be performed simultaneously at all areas corresponding to at least most of the exposure fields of the wafer, and/or with use of a homodyne light source, and/or in a wavelength-independent fashion, and/or with a pre-registration process allowing for accommodation of wafers with differently-dimensioned exposure fields.

公开(公告)号：US09997888B2

公开(公告)日：2018-06-12

申请号：US15295714

申请日：2016-10-17

Applicant: Cymer, LLC

Inventor： Willard Earl Conley ,  Eric Anders Mason ,  Joshua Jon Thornes

IPC: G03B27/54 ,  H01S3/136 ,  H01S3/11 ,  H01S3/00 ,  H01S3/08 ,  H01S3/106 ,  H01L21/3065 ,  H01L21/66 ,  G03F7/20

CPC classification number: H01S3/136 ,  G03F7/70041 ,  G03F7/70141 ,  G03F7/70191 ,  G03F7/70575 ,  G03F7/7085 ,  H01L21/3065 ,  H01L22/20 ,  H01S3/0071 ,  H01S3/08004 ,  H01S3/106 ,  H01S3/11

Abstract: A spectral feature of a pulsed light beam produced by an optical source is controlled by a method. The method includes producing a pulsed light beam at a pulse repetition rate; directing the pulsed light beam toward a substrate received in a lithography exposure apparatus to expose the substrate to the pulsed light beam; modifying a pulse repetition rate of the pulsed light beam as it is exposing the substrate. The method includes determining an amount of adjustment to a spectral feature of the pulsed light beam, the adjustment amount compensating for a variation in the spectral feature of the pulsed light beam that correlates to the modification of the pulse repetition rate of the pulsed light beam. The method includes changing the spectral feature of the pulsed light beam by the determined adjustment amount as the substrate is exposed to thereby compensate for the variation in the spectral feature.

公开(公告)号：US20180109068A1

公开(公告)日：2018-04-19

申请号：US15295714

申请日：2016-10-17

Applicant: Cymer, LLC

Inventor： Willard Earl Conley ,  Eric Anders Mason ,  Joshua Jon Thornes

IPC: H01S3/136 ,  H01S3/11 ,  H01S3/00 ,  H01S3/08 ,  H01S3/106 ,  H01L21/3065 ,  H01L21/66 ,  G03F7/20

CPC classification number: H01S3/136 ,  G03F7/70041 ,  G03F7/70141 ,  G03F7/70191 ,  G03F7/70575 ,  G03F7/7085 ,  H01L21/3065 ,  H01L22/20 ,  H01S3/0071 ,  H01S3/08004 ,  H01S3/106 ,  H01S3/11

Abstract: A spectral feature of a pulsed light beam produced by an optical source is controlled by a method. The method includes producing a pulsed light beam at a pulse repetition rate; directing the pulsed light beam toward a substrate received in a lithography exposure apparatus to expose the substrate to the pulsed light beam; modifying a pulse repetition rate of the pulsed light beam as it is exposing the substrate. The method includes determining an amount of adjustment to a spectral feature of the pulsed light beam, the adjustment amount compensating for a variation in the spectral feature of the pulsed light beam that correlates to the modification of the pulse repetition rate of the pulsed light beam. The method includes changing the spectral feature of the pulsed light beam by the determined adjustment amount as the substrate is exposed to thereby compensate for the variation in the spectral feature.

公开(公告)号：US09927710B2

公开(公告)日：2018-03-27

申请号：US14601929

申请日：2015-01-21

Applicant: SEIKO EPSON CORPORATION

Inventor： Akito Sato ,  Naoki Sudo

IPC: B41J2/165 ,  G03F7/20 ,  B41J2/21

CPC classification number: G03F7/70141 ,  B41J2/2139 ,  B41J2/2146

Abstract: An image forming device in which a plurality of nozzles are aligned in a designated alignment direction, wherein a plurality of pixels constituting a formed image includes dot omission pixels continuous in a scan direction by a defective nozzle included in the plurality of nozzles, and neighboring pixels within a designated distance in the alignment direction from the dot omission pixels, the image forming device comprising a pattern determining unit configured to determine a dot pattern after supplementation formed on neighboring pixels within designated range based on at least the number of dots to be formed on the pixels within the designated range including a portion of the dot omission pixels and a portion of the neighboring pixels according to recording data before supplementation of dots by the defective nozzle, and a pattern forming unit configured to form the dot pattern after supplementation.