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公开(公告)号:US11940737B2
公开(公告)日:2024-03-26
申请号:US17315087
申请日:2021-05-07
发明人: Hsueh-Yi Chung , Yung-Cheng Chen , Fei-Gwo Tsai , Chi-Hung Liao , Shih-Chi Fu , Wei-Ti Hsu , Jui-Ping Chuang , Tzong-Sheng Chang , Kuei-Shun Chen , Meng-Wei Chen
CPC分类号: G03F7/70433 , G03F1/50 , G03F1/68 , G03F1/70 , G03F1/78 , G03F7/20 , G03F7/70141 , G03F7/70158 , G03F7/70716 , H01L22/30
摘要: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.
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公开(公告)号:US10534272B2
公开(公告)日:2020-01-14
申请号:US16127017
申请日:2018-09-10
发明人: Hsueh-Yi Chung , Yung-Cheng Chen , Fei-Gwo Tsai , Chi-Hung Liao , Shih-Chi Fu , Wei-Ti Hsu , Jui-Ping Chuang , Tzong-Sheng Chang , Kuei-Shun Chen , Meng-Wei Chen
摘要: A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.
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公开(公告)号:US11150558B2
公开(公告)日:2021-10-19
申请号:US16849818
申请日:2020-04-15
发明人: Yi-Rem Chen , Ming-Shane Lu , Chung-Hao Chang , Jui-Ping Chuang , Li-Kong Turn , Fei-Gwo Tsai
摘要: A developing method is provided. The developing method includes rotating a wafer. The developing method also includes dispensing, through a first nozzle, a developer solution onto the rotated wafer through a first nozzle at a first rotating speed. The developing method further includes dispensing, through a second nozzle, a rinse solution onto the rotated wafer through a second nozzle at a second rotating speed. The second rotating speed is less than the first rotating speed. In addition, the developing method includes simultaneously moving the first nozzle and the second nozzle during either the dispensing of the developer solution or the dispensing of the rinse solution.
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公开(公告)号:US10101662B2
公开(公告)日:2018-10-16
申请号:US15676925
申请日:2017-08-14
发明人: Yi-Rem Chen , Ming-Shane Lu , Chung-Hao Chang , Jui-Ping Chuang , Li-Kong Turn , Fei-Gwo Tsai
摘要: A developing method includes rotating a wafer. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved from a first position to a second position. The first position and the second position are over the wafer and within a perimeter of the wafer when viewed from a top of the wafer. The developer solution is dispensed through the first nozzle when moving the first nozzle from the first position to the second position. The first nozzle is moved back from the second position to the first position immediately after the first nozzle is moved from the first position to the second position. The developer solution is dispensed through the first nozzle when moving the first nozzle from the second position to the first position.
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公开(公告)号:US10073354B2
公开(公告)日:2018-09-11
申请号:US14706871
申请日:2015-05-07
发明人: Hsueh-Yi Chung , Yung-Cheng Chen , Fei-Gwo Tsai , Chi-Hung Liao , Shih-Chi Fu , Wei-Ti Hsu , Jui-Ping Chuang , Tzong-Sheng Chang , Kuei-Shun Chen , Meng-Wei Chen
CPC分类号: G03F7/70433 , G03F1/50 , G03F1/68 , G03F1/70 , G03F1/78 , G03F7/20 , G03F7/70141 , G03F7/70158 , G03F7/70716 , H01L22/30
摘要: A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.
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公开(公告)号:US20150241786A1
公开(公告)日:2015-08-27
申请号:US14189169
申请日:2014-02-25
发明人: Yi-Rem Chen , Ming-Shane Lu , Chung-Hao Chang , Jui-Ping Chuang , Li-Kong Turn , Fei-Gwo Tsai
IPC分类号: G03F7/30
CPC分类号: G03F7/3021 , H01L21/67051 , H01L21/6715
摘要: A tool and a method of developing are provided. In various embodiments, the method of developing includes rotating a wafer at a first rotating speed. The method further includes dispensing a developer solution onto the wafer at the first rotating speed by a first nozzle above the wafer, wherein the first nozzle moves back and forth along a path during dispensing the developer solution. The method further includes rotating the wafer at a second rotating speed to spread the developer solution onto the wafer uniformly. The method further includes dispensing a rinse solution onto the wafer at the second rotating speed by a second nozzle above the wafer.
摘要翻译: 提供了一种工具和开发方法。 在各种实施例中,显影方法包括以第一旋转速度旋转晶片。 该方法还包括通过晶片上方的第一喷嘴以第一转速将显影剂溶液分配到晶片上,其中在分配显影剂溶液期间第一喷嘴沿着路径前后移动。 该方法还包括以第二转速旋转晶片以将显影剂溶液均匀地分散在晶片上。 该方法还包括通过晶片上方的第二喷嘴以第二转速将冲洗溶液分配到晶片上。
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公开(公告)号:US11003091B2
公开(公告)日:2021-05-11
申请号:US16740256
申请日:2020-01-10
发明人: Hsueh-Yi Chung , Yung-Cheng Chen , Fei-Gwo Tsai , Chi-Hung Liao , Shih-Chi Fu , Wei-Ti Hsu , Jui-Ping Chuang , Tzong-Sheng Chang , Kuei-Shun Chen , Meng-Wei Chen
摘要: A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.
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公开(公告)号:US09733568B2
公开(公告)日:2017-08-15
申请号:US14189169
申请日:2014-02-25
发明人: Yi-Rem Chen , Ming-Shane Lu , Chung-Hao Chang , Jui-Ping Chuang , Li-Kong Turn , Fei-Gwo Tsai
CPC分类号: G03F7/3021 , H01L21/67051 , H01L21/6715
摘要: A tool and a method of developing are provided. In various embodiments, the method of developing includes rotating a wafer at a first rotating speed. The method further includes dispensing a developer solution onto the wafer at the first rotating speed by a first nozzle above the wafer, wherein the first nozzle moves back and forth along a path during dispensing the developer solution. The method further includes rotating the wafer at a second rotating speed to spread the developer solution onto the wafer uniformly. The method further includes dispensing a rinse solution onto the wafer at the second rotating speed by a second nozzle above the wafer.
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