Invention Grant
US08976355B2 Method of applying a pattern to a substrate, device manufacturing method and lithographic apparatus for use in such methods
有权
将图案应用于基板的方法，用于这种方法的器件制造方法和光刻设备
- Patent Title: Method of applying a pattern to a substrate, device manufacturing method and lithographic apparatus for use in such methods
- Patent Title (中): 将图案应用于基板的方法，用于这种方法的器件制造方法和光刻设备
-
Application No.: US13597806Application Date: 2012-08-29
-
Publication No.: US08976355B2Publication Date: 2015-03-10
- Inventor: Stefan Cornelis Theodorus Van Der Sanden , Richard Johannes Franciscus Van Haren , Hubertus Johannes Gertrudus Simons , Remi Daniel Marie Edart , Xiuhong Wei , Michael Kubis , Irina Lyulina
- Applicant: Stefan Cornelis Theodorus Van Der Sanden , Richard Johannes Franciscus Van Haren , Hubertus Johannes Gertrudus Simons , Remi Daniel Marie Edart , Xiuhong Wei , Michael Kubis , Irina Lyulina
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: G01B11/00
- IPC: G01B11/00 ; G03F9/00 ; G03C5/00 ; G03F7/20
Abstract:
A substrate is loaded onto a substrate support of a lithographic apparatus, after which the apparatus measures locations of substrate alignment marks. These measurements define first correction information allowing the apparatus to apply a pattern at one or more desired locations on the substrate. Additional second correction information is used to enhance accuracy of pattern positioning, in particular to correct higher order distortions of a nominal alignment grid. The second correction information may be based on measurements of locations of alignment marks made when applying a previous pattern to the same substrate. The second correction information may alternatively or in addition be based on measurements made on similar substrates that have been patterned prior to the current substrate.
Public/Granted literature
Information query
