公开(公告)号：US20240361704A1

公开(公告)日：2024-10-31

申请号：US18768476

申请日：2024-07-10

Applicant: Carl Zeiss SMT GmbH

Inventor： Klaus Gwosch ,  Markus Koch ,  Renzo Capelli ,  Matthias Roesch ,  Lars Stoppe ,  Manuel Decker

IPC: G03F7/00

CPC classification number: G03F7/70666 ,  G03F7/70625 ,  G03F7/70641 ,  G03F7/706849

Abstract: When simulating illumination and imaging properties of an optical production system when illuminating and imaging an object by use of an optical measurement system of a metrology system, the optical measurement system having an illumination optical unit for illuminating the object and a pupil stop, in particular a displaceable pupil stop, and having an imaging optical unit for imaging the object into an image plane is initially provided. When simulating the properties of the optical production system with the optical measurement system, a plurality of pupil stops are initially provided. Measurement aerial images are then recorded by use of the plurality of pupil stops. A complex mask transfer function is reconstructed from the recorded measurement aerial images and a 3-D aerial image is determined from this function and the illumination setting of the optical production system. This yields an improved simulation method.

公开(公告)号：US12124173B2

公开(公告)日：2024-10-22

申请号：US17790344

申请日：2020-12-08

Applicant: ASML Netherlands B.V. ,  ASML Holding N.V.

Inventor： Marinus Petrus Reijnders ,  Mohamed Swillam

IPC: G03F7/00

CPC classification number: G03F7/70625 ,  G03F7/70141 ,  G03F7/70633

Abstract: A system includes an illumination system, an optical element, and a detector. The optical system is implemented on a substrate. The illumination system includes first and second sources and first and second generators. The illumination system generates a beam of radiation. The first and second sources generate respective first and second different wavelength bands. The first and second resonators are optically coupled to respective ones of the first and second sources and narrow respective ones of the first and second wavelength bands. The optical element directs the beam toward a target structure. The detector receives radiation from the target structure and to generate a measurement signal based on the received radiation.

公开(公告)号：US20240310738A1

公开(公告)日：2024-09-19

申请号：US18571118

申请日：2022-06-15

Applicant: ASML NETHERLANDS B.V.

Inventor： Roy WERKMAN ,  Sarathi ROY

IPC: G03F7/00 ,  G03F9/00

CPC classification number: G03F7/706837 ,  G03F7/705 ,  G03F7/70525 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/70641 ,  G03F7/706841 ,  G03F9/7073

Abstract: A method and associated computer program and apparatuses for determining a correction for at least one control parameter, the at least one control parameter for controlling a semiconductor manufacturing process so as to manufacture semiconductor devices on a substrate. The method includes: obtaining metrology data relating to the semiconductor manufacturing process or at least part thereof; obtaining associated data relating to the semiconductor manufacturing process or at least part thereof, the associated data providing information for interpreting the metrology data; and determining the correction based on the metrology data and the associated data, wherein the determining is such that the determined correction depends on a degree to which a trend and/or event in the metrology data should be corrected based on the interpretation of the metrology data.

公开(公告)号：US12092967B2

公开(公告)日：2024-09-17

申请号：US18159347

申请日：2023-01-25

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ryota Makino ,  Wataru Yamaguchi

IPC: G03F9/00 ,  G03F7/00

CPC classification number: G03F9/7088 ,  G03F7/70625 ,  G03F7/70633 ,  G03F9/7092

Abstract: A method of determining a position of a mark including a first pattern arranged in a first layer of a substrate and a second pattern arranged in a second layer of the substrate, includes determining information concerning the position of the mark as provisional position information based on an image of the mark, acquiring relative position information indicating a relative position between the first pattern and the second pattern, and determining the position of the mark based on the provisional position information and the relative position information.

公开(公告)号：US20240264539A1

公开(公告)日：2024-08-08

申请号：US18565951

申请日：2022-05-20

Applicant: ASML NETHERLANDS B.V.

Inventor： Lingling LU ,  Yuzhang LIN ,  Teng WANG ,  Bo WANG ,  Raphael Eric LA GRECA ,  Stefan HUNSCHE

IPC: G03F7/00 ,  G06T7/00 ,  G06T7/12

CPC classification number: G03F7/706837 ,  G03F7/70625 ,  G03F7/70655 ,  G06T7/0006 ,  G06T7/12 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: To monitor semiconductor manufacturing process variation, contours of identical pattern features are determined based on SEM images, and the contours are aggregated and statistically analyzed to determine the variation of the feature. Some of the contours are outliers, and the aggregation and averaging of the contours “hides” these outliers. The present disclosure describes filtering certain outlier contours before they are aggregated and statistically analyzed. The filtering can be performed at multiple levels, such as based on individual points on the contours in the set of inspection contours, or based on overall geometrical shapes of the contours in the set of inspection contours.

公开(公告)号：US20240255858A1

公开(公告)日：2024-08-01

申请号：US18565481

申请日：2022-05-23

Applicant: Lam Research Corporation

Inventor： Ye Feng ,  Yan Zhang ,  Jorge Luque

IPC: G03F7/00

CPC classification number: G03F7/706841 ,  G03F7/70504 ,  G03F7/70625

Abstract: A machine learning model may employ in situ chemical composition information, as an input, to characterize processes in real time, and optionally assist in process control. Chemical composition information may be obtained from an in situ emission spectrometer such an optical emission spectrometer.

公开(公告)号：US12050406B2

公开(公告)日：2024-07-30

申请号：US17953751

申请日：2022-09-27

Applicant: ASML NETHERLANDS B.V.

Inventor： Frank Staals

IPC: G03F7/00

CPC classification number: G03F7/70483 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/70641

Abstract: A method for controlling a lithographic apparatus, and associated apparatuses. The method is configured to provide product structures to a substrate in a lithographic process and includes determining optimization data. The optimization data includes measured and/or simulated data of at least one performance parameter associated with the product structures and/or their arrangement which are to be applied to the substrate in the lithographic process. Substrate specific metrology data as measured and/or modelled before the providing of product structures to the substrate is determined, the substrate specific metrology data including metrology data relating to a characteristic of the substrate to which the structures are being applied and/or the state of the lithographic apparatus at the time that the structures are applied to the substrate. The method further includes optimizing control of the lithographic apparatus during the lithographic process based on the optimization data and the substrate specific metrology data.

公开(公告)号：US20240248413A1

公开(公告)日：2024-07-25

申请号：US18416087

申请日：2024-01-18

Applicant: Tokyo Electron Limited

Inventor： Takeshi SHIMOAOKI ,  Arnaud Alain Jean DAUENDORFFER ,  Keisuke YOSHIDA ,  Shinichiro KAWAKAMI ,  Yuya KAMEI ,  Soichiro OKADA ,  Takafumi NIWA

IPC: G03F7/00 ,  G03F7/004 ,  G03F7/16 ,  G03F7/20 ,  H01L21/033

CPC classification number: G03F7/706837 ,  G03F7/161 ,  G03F7/168 ,  G03F7/2002 ,  G03F7/70008 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/70866 ,  H01L21/0337 ,  G03F7/0042

Abstract: A substrate treatment method includes: developing a substrate which has a coating film of an inorganic resist formed on a base film thereon and has been subjected to an exposure treatment, with a developing solution to form a pattern of the inorganic resist; supplying an embedding solution to the developed substrate to fill a space between adjacent protrusions of the pattern; drying the filled embedding solution to form an embedded film on the substrate; and reducing a thickness of the embedded film by an ultraviolet ray.

公开(公告)号：US20240231238A9

公开(公告)日：2024-07-11

申请号：US18489062

申请日：2023-10-18

Applicant: CANON KABUSHIKI KAISHA

Inventor： SHOHEI IWATA

IPC: G03F7/00

CPC classification number: G03F7/70141 ,  G03F7/70625 ,  G03F7/706849

Abstract: An exposure apparatus for exposing a plurality of shot regions on a substrate includes a projection optical system, a drive mechanism configured to drive the substrate, a detector configured to detect a surface height of the substrate, and a controller configured to control the drive mechanism based on an output of the detector. The projection optical system is configured to project a pattern of an original to an exposure region in an image plane of the projection optical system. A detection region of the detector is larger than the exposure region. The controller is configured to control, based on an output of the detector obtained when a first shot region of the plurality of shot regions is arranged in the exposure region, driving of the substrate, by the drive mechanism, for exposing a second shot region of the plurality of shot regions.

公开(公告)号：US20240230462A1

公开(公告)日：2024-07-11

申请号：US18616014

申请日：2024-03-25

Applicant: APPLIED MATERIALS, INC.

Inventor： Pengyu Han ,  Lei Lian

IPC: G01M11/02 ,  G01B11/06 ,  G02B6/04 ,  G02B6/136 ,  G02B27/00 ,  G02B27/30 ,  G03F7/00

CPC classification number: G01M11/0207 ,  G01B11/0683 ,  G02B6/04 ,  G02B6/136 ,  G02B27/0025 ,  G02B27/30 ,  G03F7/70625

Abstract: An endpoint detection system for enhanced spectral data collection is provided. An optical bundle is coupled to a light source. The optical bundle includes an emitting optical fiber and a receiving optical fiber disposed at a pairing angle relative to the emitting optical fiber. The optical bundle is coupled to a collimator assembly that receives a light beam of incident light from the emitting optical fiber and directs spectral components of the light beam to first and second portions of a substrate surface. The collimator collects reflected spectral components produced by the spectral components directed to the substrate surface. The collimator assembly transmits the reflected spectral components to the receiving fiber, which transmits the reflected spectral components to a light detection component. A processing device coupled to the light detection component determines a reflectance of the substrate surface based on the reflected spectral components.