公开(公告)号：US06513236B2

公开(公告)日：2003-02-04

申请号：US09777062

申请日：2001-02-05

申请人： Masahide Tsukamoto

发明人： Masahide Tsukamoto

IPC分类号： H05K310

CPC分类号： H01L24/75 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/284 ,  H05K3/303 ,  H05K2203/0278 ,  H05K2203/085 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  H01L2924/00 ,  H01L2224/05599

摘要： Bump components mounted on a circuit board on a supporting substrate is covered with a flexible separation wall. A pressure difference is provided between the inner and outer sides of the separation wall and thus the bump components are pressed against the circuit board. When heating is carried out in this state, the bump components and the circuit board are connected with a conductive adhesive or solder. During the heating, the circuit board is not deformed. Therefore, a bump-component mounted body can be manufactured with high yield.

摘要翻译： 安装在支撑基板上的电路板上的凸起部件被柔性分隔壁覆盖。 在分隔壁的内侧和外侧之间设置压力差，因此凸块部件被压靠在电路板上。 当在这种状态下进行加热时，凸起部件和电路板与导电粘合剂或焊料连接。 在加热过程中，电路板不会变形。 因此，可以以高产率制造凸块部件安装体。

公开(公告)号：US06389691B1

公开(公告)日：2002-05-21

申请号：US09286015

申请日：1999-04-05

申请人： Glenn A. Rinne ,  Joseph Daniel Mis

发明人： Glenn A. Rinne ,  Joseph Daniel Mis

IPC分类号： H05K310

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/013

摘要： A method for forming routing conductors and solder bumps on a microelectronic substrate includes the steps of forming an under bump metallurgy layer on the substrate and forming a solder structure on the under bump metallurgy layer where the solder structure includes an elongate portion and an enlarged width portion. The portions of the under bump metallurgy layer not covered by the solder structure can be selectively removed using the solder structure as a mask. In addition, the solder is caused to flow from the elongate portion of the solder structure to the enlarged width solder portion thereby forming a raised solder bump. This step is preferably performed by heating the solder structure above its liquidus temperature allowing surface tension induced internal pressures to affect the flow. Various solder structures are also disclosed.

摘要翻译： 用于在微电子衬底上形成布线导体和焊料凸块的方法包括以下步骤：在衬底上形成凸块下金属层，并在凸块下金属层上形成焊料结构，其中焊料结构包括细长部分和扩大的宽度部分 。 可以使用焊料结构作为掩模来选择性地去除不被焊料结构覆盖的凸块下冶金层的部分。 此外，使焊料从焊料结构的细长部分流向扩大的宽度焊料部分，从而形成凸起的焊料凸块。 该步骤优选通过将焊料结构加热到高于其液相线温度来进行，从而允许表面张力引起的内部压力影响流动。 还公开了各种焊料结构。

公开(公告)号：US06643924B2

公开(公告)日：2003-11-11

申请号：US09903251

申请日：2001-07-11

申请人： Takayuki Hirabayashi

发明人： Takayuki Hirabayashi

IPC分类号： H05K310

CPC分类号： H01P1/20336 ,  H01P1/20363 ,  H01P1/20381 ,  H01P11/007 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49165

摘要： A distributed constant filter capable of being connected to a wiring pattern and the like while simultaneously achieving miniaturization, stable performance and assurance of the reliability and a manufacturing method of the distributed constant filter are provided. In a triplate structure band-pass filter, in place of a high impedance pattern which is, in the prior art, formed on the same face as that of a low impedance pattern in an inner layer, conductor patterns extending in the thickness direction of a stacked substrate are formed. Each of the conductor patterns functions as a via pattern connecting the low impedance pattern in the inner layer and a wiring pattern in the surface layer and also functions as a high impedance line. As long as the filtering characteristic is the same, the line overall length (distance in a plane) of the conductor patterns can be made shorter than the conventional line overall length and the area occupied by the conductor patterns can be reduced. A change in the filtering characteristic which occurs when via patterns are separately provided does not occur.

摘要翻译： 提供一种分布式常数滤波器，其能够同时实现小型化，稳定的性能和可靠性的保证以及分布式常数滤波器的制造方法连接到布线图案等。 在三板结构带通滤波器中，代替在现有技术中形成在与内层中的低阻抗图案相同的面上的高阻抗图案，沿着厚度方向延伸的导体图案 形成层叠基板。 每个导体图案用作连接内层中的低阻抗图案和表面层中的布线图案的通孔图案，并且还用作高阻抗线。 只要滤波特性相同，导体图案的线总长度（平面中的距离）可以比常规的线总长度短，并且可以减少导体图案占据的面积。 不会发生通孔图案分离设置时发生的过滤特性的变化。

公开(公告)号：US06640434B1

公开(公告)日：2003-11-04

申请号：US09821697

申请日：2001-03-29

申请人： Albert Wojewnik ,  James D. Dowd

发明人： Albert Wojewnik ,  James D. Dowd

IPC分类号： H05K310

CPC分类号： H05K3/107 ,  B60R16/0207 ,  H05K3/048 ,  H05K3/143 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/0143 ,  H05K2203/0191 ,  H05K2203/1152 ,  H05K2203/1344 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49162

摘要： A method of forming an electrical circuit on a surface of a substrate includes providing a substrate having a surface with at least one groove formed therein, the groove having a bottom textured surface, and applying an electrically conductive material onto the bottom textured surface of the groove.

摘要翻译： 在基板的表面上形成电路的方法包括提供具有表面的基板，其中形成有至少一个凹槽，所述凹槽具有底纹理表面，并且将导电材料施加到凹槽的底纹理表面上 。

公开(公告)号：US06594893B2

公开(公告)日：2003-07-22

申请号：US09953934

申请日：2001-09-18

申请人： Mark J. Bailey ,  Michael John Shea ,  Gerald Wayne Swift

发明人： Mark J. Bailey ,  Michael John Shea ,  Gerald Wayne Swift

IPC分类号： H05K310

CPC分类号： H05K1/0216 ,  H05K1/183 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09509 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A surface laminar circuit board includes an insulating layer, and a signal ground conductive layer disposed on an upper surface of the insulating layer. The conductive layer has a hole formed therein. A photosensitive dielectric layer is disposed on an upper surface of the signal ground conductive layer. The dielectric layer has a photo micro-via formed therein. A signal trace is disposed on the photosensitive dielectric layer, and is electrically coupled with the signal ground conductive layer by way of the photo micro-via. A conductive pad is provided, which has a majority thereof within an area defined by an outer periphery of the hole. The conductive pad is electrically coupled with the signal trace. A surface mounted component is mounted on the conductive pad.

摘要翻译： 表面层状电路基板包括绝缘层和设置在绝缘层的上表面上的信号接地导电层。 导电层具有形成在其中的孔。 光敏介电层设置在信号接地导电层的上表面上。 电介质层具有形成在其中的光微通孔。 信号迹线设置在光敏电介质层上，并通过照相微通孔与信号接地导电层电耦合。 提供了一种导电垫，其具有大部分在由孔的外周限定的区域内。 导电焊盘与信号迹线电耦合。 表面安装部件安装在导电焊盘上。

公开(公告)号：US06568073B1

公开(公告)日：2003-05-27

申请号：US09036494

申请日：1998-03-06

申请人： Naoki Fukutomi ,  Hidehiro Nakamura ,  Hajime Nakayama ,  Yoshiaki Tsubomatsu ,  Masanori Nakamura ,  Kouichi Kaitou ,  Atsushi Kuwano ,  Itsuo Watanabe ,  Masahiko Itabashi

发明人： Naoki Fukutomi ,  Hidehiro Nakamura ,  Hajime Nakayama ,  Yoshiaki Tsubomatsu ,  Masanori Nakamura ,  Kouichi Kaitou ,  Atsushi Kuwano ,  Itsuo Watanabe ,  Masahiko Itabashi

IPC分类号： H05K310

CPC分类号： H05K3/4658 ,  G01R1/07314 ,  H05K3/062 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/428 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0367 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10S29/016 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158

摘要： The present invention provides a process for the fabrication of a wiring board, which comprises the following steps: (a) forming a first wiring pattern on a first side of a self-supporting carrier metal foil so as to obtain a self-supporting wiring sheet comprising the carrier metal foil and the first wiring pattern; (b) superposing and pressing the first side of said self-supporting wiring sheet on and against an insulating substrate so that the first wiring pattern is_embedded in the insulating substrate and constitutes a surface with the insulating substrate; and (c) etching off desired portions of said carrier metal foil to form a second wiring pattern made of said carrier metal foil remaining on the surface constituted by the insulating substrate and the first wiring pattern. The present invention also provides the wiring board for electrical tests so fabricated.

摘要翻译： 本发明提供一种制造布线板的方法，其包括以下步骤：（a）在自支撑载体金属箔的第一面上形成第一布线图案，以获得自支撑布线板 包括载体金属箔和第一布线图案; （b）将所述自支撑布线板的第一侧叠置并压在绝缘基板上，使得第一布线图案嵌入在绝缘基板中并与绝缘基板构成表面; 和（c）蚀刻所述载体金属箔的期望部分，以形成由保留在由绝缘基板和第一布线图案构成的表面上的所述载体金属箔制成的第二布线图案。 本发明还提供了如此制造的用于电测试的接线板。

公开(公告)号：US06434818B1

公开(公告)日：2002-08-20

申请号：US09798897

申请日：2001-03-06

申请人： Masayuki Kanechika ,  Hideki Urabe ,  Yoshio Kuriyama

发明人： Masayuki Kanechika ,  Hideki Urabe ,  Yoshio Kuriyama

IPC分类号： H05K310

摘要： A high-frequency circuit board free from variations in transmission impedance and having the desired characteristics is produced. A surface of a resin substrate is activated to form a roughened surface, and a thin-wall pattern of an electrically conductive metal is formed directly on the roughened surface of the resin substrate.

公开(公告)号：US06729022B2

公开(公告)日：2004-05-04

申请号：US10230329

申请日：2002-08-29

申请人： Hideyuki Kurita ,  Masanao Watanabe

发明人： Hideyuki Kurita ,  Masanao Watanabe

IPC分类号： H05K310

CPC分类号： H05K3/4635 ,  H05K1/0393 ,  H05K3/005 ,  H05K3/28 ,  H05K3/423 ,  H05K3/4617 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155

摘要： The present invention aims to connect metal films without forming any opening in a resin film. Against a first resin film 16 formed on a first metal film 12 are pressed bumps 21 on a second metal film 11 so that the bumps 21 are embedded into the first resin film 16. Either one of the first metal film 12 or the second metal film 11 or both is (are) patterned while the bumps 21 are in contact with the first metal film 12, and the first resin film 16 is heat-treated while the top of the first resin film is partially exposed to discharge the solvent or moisture from the exposed zone and cure the first resin film 16. After curing, the bumps 21 and the first metal film 12 may be ultrasonically bonded to each other. A second resin film and a third metal film may be further layered to form a multilayer structure.

摘要翻译： 本发明的目的是在不在树脂膜中形成任何开口的情况下连接金属膜。在第一金属膜12上形成的第一树脂膜16上，在第二金属膜11上形成按压凸块21，使得凸块21嵌入到第一金属膜11中。 在第一金属膜12或第二金属膜11中的任一个或两者均被图案化，同时凸块21与第一金属膜12接触，并且第一树脂膜16被热处理同时 第一树脂膜的顶部部分地暴露以从暴露区域排出溶剂或水分，并使第一树脂膜16固化。固化后，凸块21和第一金属膜12可以彼此超声波接合。 可以进一步层叠第二树脂膜和第三金属膜以形成多层结构。

公开(公告)号：US06678950B1

公开(公告)日：2004-01-20

申请号：US10007247

申请日：2001-11-01

申请人： Derryl D. J. Allman ,  David T. Price

发明人： Derryl D. J. Allman ,  David T. Price

IPC分类号： H05K310

CPC分类号： H01L24/11 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/05093 ,  H01L2224/05095 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/30105 ,  Y10T29/49155

摘要： A bonding pad for an integrated circuit, having a conductive base layer. The conductive base layer has slots formed in it, where the slots extend completely through the conductive base layer. An insulating layer is disposed on top of the conductive base layer. The insulating layer protrudes into the slots of the conductive base layer. The insulating layer also includes a low k material. A conductive top layer is disposed on top of the insulating layer.

摘要翻译： 一种用于集成电路的焊盘，具有导电基底层。 导电基层具有在其中形成的槽，其中狭槽完全延伸穿过导电基层。 绝缘层设置在导电基底层的顶部。 绝缘层突出到导电基底层的槽中。 绝缘层还包括低k材料。 导电顶层设置在绝缘层的顶部。

公开(公告)号：US06560863B2

公开(公告)日：2003-05-13

申请号：US09924807

申请日：2001-08-08

申请人： Toshinori Koyama ,  Mikiko Kobayashi ,  Atsuhiko Hattori

发明人： Toshinori Koyama ,  Mikiko Kobayashi ,  Atsuhiko Hattori

IPC分类号： H05K310

CPC分类号： H05K3/4661 ,  H05K3/381 ,  H05K3/4602 ,  H05K2203/095 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A method of producing a wiring board having a plurality of wiring layers each being located on an electrical insulation layer, in which an electrical insulation layer is formed on a substrate using a resin material, and a conductor layer is formed on the surface of the electrical insulation layer by successive electroless plating and electroplating with copper, and is patterned to form a wiring layer, wherein, after the formation of the electrical insulation layer on the substrate, the electrical insulation layer is subjected to a plasma treatment and a subsequent ultraviolet treatment, and the electroless plating and the electroplating are then performed.