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    Pellet picking method and pellet picking apparatus
    1.
    发明授权
    Pellet picking method and pellet picking apparatus 有权
    颗粒采摘方法和颗粒采​​摘装置

    公开(公告)号：US06561743B1

    公开(公告)日：2003-05-13

    申请号：US09709018

    申请日：2000-11-08

    申请人： Akira Nakatsu

    发明人： Akira Nakatsu

    IPC分类号： H01L2168

    CPC分类号： H01L21/67132 ,  H01L21/6836 ,  H01L2221/68322 ,  H01L2221/68327 ,  Y10S156/934 ,  Y10T156/19

    摘要： A pellet picking apparatus for separating a pellet adhered on an adhesive sheet from the sheet and picking the pellet thus separated is provided, which prevents the pellet from being damaged during the pellet picking process without lowering the productivity. This apparatus comprises (a) a stage having a surface with which a lower face of the adhesive sheet is contacted; the pellet being adhered on an upper face of the sheet; the stage having a suction hole that pulls down the sheet; the suction hole having a suction end to be contacted with the sheet on the surface of the stage; the stage being movable in a horizontal plane with respect to a specific reference position; and (b) a collet for holding the pellet by a suction force; the collet having a suction end to be contacted with the pellet; the collet being capable of holding the pellet by the suction force at the suction end. When the sheet is placed on the surface of the stage in such a way that the pellet on the sheet is located at the reference position, the collet is controlled to hold the pellet by the suction force at the suction end and at the same time, the stage is controlled to hold the sheet at the suction end of the suction hole and to be moved in the horizontal plane with respect to the reference position to thereby detach the sheet from the pellet. The collet is controlled to pick the pellet thus detached from the sheet.

    摘要翻译： 提供了一种用于将粘附在粘合片上的颗粒与片材分离并且分离如此分离的颗粒的颗粒采集装置，这防止了颗粒在颗粒采摘过程中被损坏而不降低生产率。 该装置包括（a）具有与粘合片的下表面接触的表面的台， 所述颗粒粘附在所述片材的上表面上; 所述平台具有将片材拉下的抽吸孔; 所述吸入孔具有与所述台的表面上的所述片材接触的吸力端; 所述台可相对于特定的参考位置在水平平面中移动; 和（b）用于通过吸力保持颗粒的夹头; 所述夹头具有与所述丸粒接触的吸入端; 夹头能够通过抽吸端的吸力保持颗粒。 当片材以使得片材上的颗粒位于参考位置的方式放置在台面上时，通过抽吸端的抽吸力控制夹头以保持颗粒，同时， 控制台阶将片材保持在吸孔的吸入端，并相对于基准位置在水平面移动，从而将片材从丸粒分离。 控制夹头以从片材中分离出颗粒。

    Article storage system
    2.
    发明授权
    Article storage system 失效

    公开(公告)号：US06558101B2

    公开(公告)日：2003-05-06

    申请号：US10055464

    申请日：2002-01-22

    申请人： Yoshitaka Inui

    发明人： Yoshitaka Inui

    IPC分类号： H01L2168

    CPC分类号： B65G1/0478 ,  B65G1/0435 ,  Y10S414/14

    摘要： The object of the present invention is to reduce the number of shelves for supporting articles in an article storage system for storage of articles such as containers. The storage system includes a shelf 12 for supporting a container 2 having an engaging means 8 formed at an upper portion thereof. The storage system also includes a loader/unloader 4 for loading the container 2 on and unloading it from the shelf 12. The shelf 12 includes a deck 20 formed on the upper side thereof, on which the container 2 can be placed. The shelf 12 also includes a pair of right and left engaging parts 16 formed on the lower side thereof for engaging with the engaging means 8 of the container 2 to hold the container 2 hanging from the shelf 12. The engaging means 8 and the pair of engaging parts 16 can engage with and disengage from each other in the directions in which the container 2 can be loaded and unloaded.

    Method of adhering wafer and wafer adhering device
    4.
    发明授权
    Method of adhering wafer and wafer adhering device 有权
    粘贴晶片和晶片粘附装置的方法

    公开(公告)号：US06692221B2

    公开(公告)日：2004-02-17

    申请号：US10038262

    申请日：2002-01-03

    申请人： Tetsuro Toya

    发明人： Tetsuro Toya

    IPC分类号： H01L2168

    CPC分类号： C30B25/12 ,  F27D2003/0002

    摘要： The method of the present invention is capable of adhering a wafer to a prescribed position of the carrier plate, which has been correctly positioned, in a short time. The method comprises the steps of: heating a carrier plate; detecting a mark provided to a predetermined position of the carrier plate rotating at predetermined rotational speed; positioning the carrier plate on the basis of a position of the detected mark; conveying the carrier plate to a wafer adhering section with keeping a posture of the carrier plate which has been positioned in the positioning step; and adhering the wafer at a prescribed position of the carrier plate.

    摘要翻译： 本发明的方法能够在短时间内将晶片粘贴到正确定位的载板的规定位置。 该方法包括以下步骤：加热载板; 检测提供给以预定转速旋转的所述承载板的预定位置的标记; 基于检测到的标记的位置来定位承载板; 将承载板传送到晶片粘附部分，同时保持已经定位在定位步骤中的承载板的姿势; 并将晶片粘附在载体板的规定位置。

    Method for confirming alignment of a substrate support mechanism in a semiconductor processing system
    5.
    发明授权
    Method for confirming alignment of a substrate support mechanism in a semiconductor processing system 有权
    确认半导体处理系统中的基板支撑机构的对准的方法

    公开(公告)号：US06677166B2

    公开(公告)日：2004-01-13

    申请号：US10083899

    申请日：2002-02-27

    申请人： Reginald Hunter

    发明人： Reginald Hunter

    IPC分类号： H01L2168

    CPC分类号： H01L21/681 ,  G03F7/707 ,  G03F7/70708 ,  G03F7/7085 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67242 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67288 ,  Y10S414/135 ,  Y10T29/49004 ,  Y10T29/49769

    摘要： A sensor device, for diagnosing a processing system, generally includes a support platform and one or more sensors mounted on the support platform. The sensor senses a condition, such as direction or inclination or acceleration in one or two axes, of the sensor device and outputs a signal indicative thereof, which is then sent to a transmitter, also mounted to the support platform, for wireless transmission of the signal to a receiver mounted on or near the processing system. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.

    摘要翻译： 用于诊断处理系统的传感器装置通常包括支撑平台和安装在支撑平台上的一个或多个传感器。 传感器感测传感器装置的一个或两个轴的方向或倾斜或加速度的状况，并输出一个表示该传感器装置的信号，该信号然后被发送到也安装在支撑平台上的发射器，用于无线传输 信号到安装在处理系统上或附近的接收器。 支撑平台通常具有物理特征，例如尺寸，轮廓高度，质量，柔韧性和/或强度，基本上类似于在处理系统中要处理的基板的物理特性，因此传感器装置可以通过加工 系统以类似于生产基板通过处理系统传送的方式。

    Substrate processing apparatus and substrate processing method
    6.
    发明授权
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号：US06582174B1

    公开(公告)日：2003-06-24

    申请号：US09491491

    申请日：2000-01-25

    申请人： Akinari Hayashi

    发明人： Akinari Hayashi

    IPC分类号： H01L2168

    CPC分类号： H01L21/67769 ,  Y10S414/14

    摘要： A substrate processing apparatus includes a rotation accommodating shelf and a transfer machine. The rotation accommodating shelf is capable of accommodating a plurality of accommodating containers in which substrates are to be loaded. The transfer machine is for transferring the plurality of accommodating containers to the rotation accommodating shelf. The plurality of accommodating containers are respectively disposed on radial lines, which radiate from a rotation center of the rotation accommodating shelf, such that each accommodating container is respectively inclined in a horizontal plane in a same fixed direction with respect to a radial line.

    摘要翻译： 基板处理装置包括旋转容纳架和转印机。 旋转容纳架能够容纳多个容纳容器，其中衬底将被装载。 转印机用于将多个容纳容器转移到旋转容纳架。 多个容纳容器分别设置在从旋转容纳架的旋转中心辐射的径向线上，使得每个容纳容器分别相对于径向线在相同的固定方向上在水平面中倾斜。

    Small footprint vertical lift and rotation stage
    7.
    发明授权
    Small footprint vertical lift and rotation stage 失效

    公开(公告)号：US06486574B2

    公开(公告)日：2002-11-26

    申请号：US09812234

    申请日：2001-03-19

    申请人： Stephen J. Botos ,  Albert P. Ciez ,  Gerald W. McClain

    发明人： Stephen J. Botos ,  Albert P. Ciez ,  Gerald W. McClain

    IPC分类号： H01L2168

    CPC分类号： G05D3/12 ,  Y10T74/20207

    摘要： A small footprint vertical lift and rotary positioning stage comprises a bottom wedge and a top wedge, a linear bearing between the bottom wedge and the top wedge, cam grooves and cam surfaces for constraining the motion of the top wedge in a vertical direction, a brushless linear motor for moving the bottom wedge back and forth along a horizontal path raising and lowering the top wedge, a circular table rotatably mounted on the top wedge and having a first cylindrical flange extending downward from a segment of the circumference of the circular table, a bracket mounted on the side of the top wedge, the bracket supporting an upwardly extending second cylindrical flange coaxial with the circular table and the first cylindrical flange, and a brushless curvilinear motor between the first and second cylindrical flanges.

    Self aligning wafer chuck design for wafer processing tools
    8.
    发明授权
    Self aligning wafer chuck design for wafer processing tools 失效
    晶圆加工工具的自对准晶片卡盘设计

    公开(公告)号：US06183189B2

    公开(公告)日：2001-02-06

    申请号：US09200550

    申请日：1998-11-27

    申请人： Erzhuang Lzu ,  Xiaosong Tang ,  Yih-Shung Lin ,  Charles Lin

    发明人： Erzhuang Lzu ,  Xiaosong Tang ,  Yih-Shung Lin ,  Charles Lin

    IPC分类号： H01L2168

    CPC分类号： H01L21/6833 ,  Y10S414/136

    摘要： A wafer chuck for positioning and releasably holding a wafer includes a support platform having an upper surface for positioning and supporting the wafer. Wafer banking pins are affixed to the support platform for positioning the wafer. A lift device acting on the wafer when it rests on the support platform to move the wafer relative to the support platform in a slanted direction away from the support platform and wafer banking pins. The lift device has a plurality of wafer lifting fingers that cooperatively extend in a biased and substantially vertical direction are disposed in a pattern to be supportive of the wafer. Each of the wafer lifting fingers has an end portion that is movable relative to the support platform between a first position at which it is retracted from the upper surface of the support platform and a second position at which it protrudes from the upper surface of the support platform so as to engage the wafer to lift it relative to the support platform.

    摘要翻译： 用于定位和可释放地保持晶片的晶片卡盘包括具有用于定位和支撑晶片的上表面的支撑平台。 晶片银针被固定在支撑平台上以便定位晶片。 提升装置，当其搁置在支撑平台上时，其作用在晶片上，以相对于支撑平台沿倾斜方向远离支撑平台和晶片储存销移动晶片。 提升装置具有多个晶片提升指状物，其以偏置且基本垂直的方向协同地延伸，以图案形式支撑晶片。 每个晶片提升指具有端部，该端部可相对于支撑平台移动在第一位置和第二位置之间，第二位置从支撑平台的上表面缩回到第二位置，第二位置从支撑台的上表面突出 平台，以便使晶片相对于支撑平台升起。