摘要:
A PPAT polypeptide of SEQ ID NO: 1 derived from Jatropha, a PPAT polynucleotide of SEQ ID NO: 2 and so on were found. By transforming Jatropha with these PPAT polynucleotides, it is possible to overexpress the PPAT polypeptide in comparison with a wild type, and biosynthesis of coenzyme A is promoted by these polypeptides, the metabolic function and viability of the transformed Jatropha are enhanced, and for example, stress resistance can be significantly improved.
摘要翻译:发现衍生自麻疯树的SEQ ID NO:1的PPAT多肽,SEQ ID NO:2的PPAT多核苷酸等。 通过用这些PPAT多核苷酸转化麻疯树,可以与野生型相比过表达PPAT多肽,并且这些多肽促进了辅酶A的生物合成,增强了转化的麻疯树的代谢功能和活力,例如, 耐应力可显着提高。
摘要:
An aluminum nitride sintered body has excellent thermal shock resistance and strength, and is applicable to a radiating substrate for a power module or a jig for semiconductor equipment employed under a strict heat cycle. The aluminum nitride sintered body contains 0.01 to 5 percent by weight of an alkaline earth metal element compound in terms of an oxide and 0.01 to 10 percent by weight of a rare earth element compound in terms of an oxide, respectively as sintering aids, and a residual amount of carbon in a range from 0.005 to 0.1 percent by weight, thereby suppressing grain growth and improving thermal shock resistance and strength of the sintered body.
摘要:
A connection structure between lead frames and a base plate of aluminum nitride, to be applied as a connection structure between components of a semiconductor apparatus, has a base plate made of a sintered body of aluminum nitride on which a semiconductor device is to be mounted. The lead frames are made of iron alloy containing nickel in 29 wt. % and cobalt in 17 wt. %. A silver solder is used for joining the base plate and the lead frames. A surface of the lead frame to be joined to the base plate is clad with a stress relief layer of oxygen-free copper of a high plastic deformability to relieve, by its plastic deformation, a thermal stress caused by a difference between a thermal expansion coefficient of the aluminum nitride base plate and that of the lead frame in a cooling process at the time of soldering. Preferably, only a portion of each lead frame to be joined to the base plate comprises an inner layer of an iron alloy containing 29 wt. % of nickel and 17 wt. % of cobalt, and an outer layer portion of oxygen-free copper.
摘要:
A member for a semiconductor apparatus for carrying or holding a semiconductor device, obtained by joining an aluminum nitride substrate and a radiating substrate, comprises an insulating member formed by an aluminum nitride sintered body to be provided thereon with the semiconductor device, a radiating member to be joined to the insulating member, which radiating member is mainly formed of a copper-tungsten alloy or a copper-molybdenum alloy, a stress relieving member interposed between the insulating member and the radiating member and a silver solder member for joining the insulating member, the stress relieving member and the radiating member with each other. The stress relieving member is prepared by copper or a copper alloy, implementing a soft metal or a soft alloy having high plastic deformability, in order to relax, by its own plastic deformation, thermal stress caused by difference in thermal expansion coefficient between the insulating member and the radiating member in a cooling step upon soldering.
摘要:
A PPAT polypeptide of SEQ ID NO: 1 derived from Jatropha, a PPAT polynucleotide of SEQ ID NO: 2 and so on were found. By transforming Jatropha with these PPAT polynucleotides, it is possible to overexpress the PPAT polypeptide in comparison with a wild type, and biosynthesis of coenzyme A is promoted by these polypeptides, the metabolic function and viability of the transformed Jatropha are enhanced, and for example, stress resistance can be significantly improved.
摘要翻译:发现衍生自麻疯树的SEQ ID NO:1的PPAT多肽,SEQ ID NO:2的PPAT多核苷酸等。 通过用这些PPAT多核苷酸转化麻疯树,可以与野生型相比过表达PPAT多肽,并且这些多肽促进了辅酶A的生物合成,增强了转化的麻疯树的代谢功能和活力,例如, 耐应力可显着提高。
摘要:
An aluminum-nitride sintered body that has both high thermal conductivity and high mechanical strength, a fabricating method for the same, and a semiconductor substrate comprising the same. A material powder is prepared by mixing an aluminum-nitride powder, constituting 1 to 95 wt. %, having an average particle diameter of 1.0 &mgr;m or less obtained by chemical vapor deposition, with another type or types of aluminum-nitride powders constituting the remaining part. The material powder is sintered in a non-oxidizing atmosphere to obtain a sintered body having an average grain diameter of 2 &mgr;m or less and a half width of the diffraction peak on the (302) plane, obtained by X-ray diffraction, of 0.24 deg. or less. Formation of a metallized layer on the sintered body yields a semiconductor substrate.
摘要:
A heater for fixing a toner image suffers no cracking of the ceramics substrate, thereof has a high connection reliability between an electrode and a connector thereof, and capable of attaining an improved fixing speed and a size increase of a transfer material. The heater, which is adapted to heat and fix a toner image on a transfer material, comprises a ceramics substrate containing silicon nitride and a heat generator formed on the ceramics substrate. The thermal conductivity and the transverse rupture strength of the silicon nitride forming the ceramics substrate are preferably at least 40 W/mK and at least 50 kg/mm.sup.2 respectively, and the thickness of the ceramics substrate can be reduced to 0.1 to 0.5 mm.
摘要:
For improving driver's awareness about emissions and promoting environmental protection, an emission amount notifying device is provided. When such a taxation system becomes effective that a tax is imposed in accordance with an amount of one or more kinds of harmful substances, which include a carbon dioxide, nitrogen oxides, sulphur oxides and hydrocarbons emitted from a vehicle, a sensor determines the emission amounts of respective harmful substances, and a CPU obtains the amount of tax corresponding to the determined emission amounts from a ROM storing tax information related to the tax amounts corresponding to respective displacements, and displays the obtained tax amount on a display device. Further, the CPU sends the information relating to the determined emission amount to a server of authorities from a communication unit for performing tax payment procedures.
摘要:
A susceptor for semiconductor manufacturing equipment obtained by laminating plural aluminum nitride (AlN) ceramic substrates with a high melting point metallic layer and an adhesive layer, and in particular, the aluminum nitride (AlN) ceramic substrate contains a compound of a Group 3a element in an amount of from 0.01 to 1% by weight in terms of the element, and the balance consisting essentially of aluminum nitride (AlN), in which the average particle size of an AlN crystal is from 2 to 5 &mgr;m. The susceptor is prepared by obtaining substrates from a mixture of the material powders through the steps of molding, sintering in a non-oxidizing atmosphere at 1,600 to 2,000° C. and forming into a desired substrate shape, and then laminating a plurality of the thus obtained substrate with a high melting point metallic layer and an adhesive layer inserted between the substrates, firing the laminate in a non-oxidizing atmosphere at 1,500 to 1,700° and finishing the fired laminate.
摘要:
The circumferential edge portion of a ductile rotating body containing abrasive grains is used to polish the surface of a ceramic substrate. The angle &thgr; formed between the polishing direction D0 of the ceramic substrate and the rotating direction D1, of the rotating body is set in the range from 10° to 80° for the polishing step. Alternatively, the polishing process is divided into at least two steps. and the average grain size of abrasive grains is reduced stepwise in the successive steps of the polishing process. According to this method, the surface of a large-area and thin ceramic substrate can be polished without damage, and a smooth polished ceramic surface can be provided. This method is particularly suitable for polishing a ceramic substrate having a thickness of at most 2.0 mm, and the resulting polished ceramic substrate is suitable for a ceramic heater in a thermal fixation device for fixing a toner image.