公开(公告)号：US20190186034A1

公开(公告)日：2019-06-20

申请号：US16107222

申请日：2018-08-21

Applicant: USC, LLC

Inventor： Robert Z. Reath ,  Amitava Datta ,  John D. Carpenter

IPC: C25D3/56 ,  C25D1/00 ,  C25D15/02 ,  C25D15/00

CPC classification number: C25D3/562 ,  C25D1/00 ,  C25D15/00 ,  C25D15/02 ,  Y10S428/935 ,  Y10T428/12576 ,  Y10T428/1266 ,  Y10T428/12861 ,  Y10T428/12931 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/259

Abstract: The invention provides a method and system for electrolytically coating an article. The method includes providing an article to be coated and disposing the article in an electrolytic cell. The cell includes an anode, a cathode in operable communication with the article, and an electrolyte bath. During electrolysis, the electrolyte bath comprises cobalt ions, phosphorous acid, and tribological particles selected from the group consisting of refractory materials, solid lubricants and mixtures thereof dispersed therein. The method further includes applying steady direct electric current through the anode, the electrolyte bath and the cathode to coat the article with cobalt, phosphorous and the tribological particles. An improved composition of matter is also provided that may be used as a coating, or the composition may be electroformed on a mandrel to form an article made from the composition of matter.

公开(公告)号：US20180230588A1

公开(公告)日：2018-08-16

申请号：US15945033

申请日：2018-04-04

Applicant: Mo-How Herman Shen

Inventor： Mo-How Herman Shen

IPC: C23C14/16 ,  B32B15/01 ,  F01D5/28 ,  C23C14/14 ,  C23C14/24 ,  C23C14/30

CPC classification number: C23C14/16 ,  B32B15/01 ,  B32B15/043 ,  B32B2255/06 ,  B32B2603/00 ,  C23C14/0641 ,  C23C14/0664 ,  C23C14/14 ,  C23C14/24 ,  C23C14/28 ,  C23C14/30 ,  C23C14/54 ,  C23C24/04 ,  C23C28/321 ,  C23C28/34 ,  F01D5/288 ,  F03D1/0675 ,  F04D29/023 ,  F04D29/324 ,  F04D29/668 ,  F05D2230/90 ,  F05D2300/507 ,  F05D2300/611 ,  Y10T428/12576 ,  Y10T428/12931 ,  Y10T428/12986

Abstract: A method to increase the damping of a substrate using a face-centered cubic damping material foil containing voids.

公开(公告)号：US09656246B2

公开(公告)日：2017-05-23

申请号：US13546827

申请日：2012-07-11

Applicant: Baratunde A. Cola

Inventor： Baratunde A. Cola

IPC: B01J23/745 ,  B82Y30/00 ,  C01B31/02 ,  B01J23/42 ,  B01J23/44 ,  B01J23/46 ,  B01J23/75 ,  B01J23/755 ,  B82Y40/00 ,  B01J21/02 ,  B01J23/72 ,  B01J35/00 ,  B01J35/02 ,  C09K5/14

CPC classification number: B01J23/745 ,  B01J21/02 ,  B01J23/42 ,  B01J23/44 ,  B01J23/464 ,  B01J23/466 ,  B01J23/468 ,  B01J23/72 ,  B01J23/75 ,  B01J23/755 ,  B01J35/0006 ,  B01J35/02 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/162 ,  C01B2202/08 ,  C09K5/14 ,  Y10S977/742 ,  Y10S977/81 ,  Y10T428/12431 ,  Y10T428/12493 ,  Y10T428/12576 ,  Y10T428/12611 ,  Y10T428/24975 ,  Y10T428/25 ,  Y10T428/265 ,  Y10T428/30

Abstract: Multilayer substrates for the growth and/or support of CNT arrays are provided. These multilayer substrates both promote the growth of dense vertically aligned CNT arrays and provide excellent adhesion between the CNTs and metal surfaces. Carbon nanotube arrays formed using multilayer substrates, which exhibit high thermal conductivity and excellent durability, are also provided. These arrays can be used as thermal interface materials.

公开(公告)号：US20170016701A1

公开(公告)日：2017-01-19

申请号：US15137498

申请日：2016-04-25

Applicant: Robert M. Willson ,  Michael C. Willson ,  Anil R. (Neil) Chaudhry

Inventor： Robert M. Willson ,  Michael C. Willson ,  Anil R. (Neil) Chaudhry

IPC: F41H5/04

CPC classification number: F41H5/0421 ,  F41H5/0414 ,  F41H5/0442 ,  F41H5/0492 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/26

Abstract: Armor components having a ceramic substrate, a thermal sprayed barrier coating covering the substrate material to form a barrier coated substrate, and an outermost encapsulation of metal generally surrounding at least the periphery of the barrier coated substrate are disclosed herein. The encapsulation of metal was cast to the ceramic substrate as molten metal, and the thermal sprayed barrier coating comprises a cermet material, a ceramic material, or a combination thereof. The ceramic substrate is preferably a ceramic tile for ballistic armor. Also disclosed are armor components having a plurality of the ceramic tiles interconnected by the encapsulation of metal, with the metal, which was casted thereto, surrounding at least the periphery of each of the plurality of the armor components.

Abstract translation: 本文公开了具有陶瓷基板的装甲部件，覆盖基板材料以形成阻挡涂层基板的热喷涂阻挡涂层以及通常围绕阻挡涂布基板的周边的金属的最外部封装。 将金属的包封作为熔融金属铸造到陶瓷基板上，并且热喷涂的阻隔涂层包括金属陶瓷材料，陶瓷材料或其组合。 陶瓷基板优选为用于防弹装置的陶瓷砖。 还公开了具有多个陶瓷瓦片的装甲部件，其中多个陶瓷瓦片通过金属的包封与铸造的金属相互连接，至少围绕多个装甲部件中的每一个的周边。

公开(公告)号：US20160230262A1

公开(公告)日：2016-08-11

申请号：US15022948

申请日：2013-09-25

Applicant: THE CHUGOKU ELECTRIC POWER CO., INC.

Inventor： Hidetaka Nishida

IPC: C23C4/12 ,  C23C4/06

CPC classification number: C23C4/12 ,  C21D9/08 ,  C21D9/50 ,  C21D2251/00 ,  C23C4/06 ,  C23C4/10 ,  C23C4/11 ,  C23C4/16 ,  C23C4/18 ,  Y10T428/12576 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12931

Abstract: A creep reinforcement material containing one or a plurality of elements selected from B, W, Cr, Mo, Nb, V, Hf, Zr, Ti, Cu, and Co is coated or thermally sprayed onto a surface of a heat-resistant metal member manufactured using a heat-resistant metal material, and a section coated or thermally sprayed with the creep reinforcement material is covered by a heat-resistant covering member and secured so as to contact the section. The heat-resistant metal member covered by the heat-resistant covering member is heated to a temperature of 1000° C. or greater, and thus compressive force accordingly acts on the heat-resistant metal member as it thermally expands in a direction toward the outer periphery, restraining thermal expansion of the heat-resistant metal member in the direction toward the outer periphery, and enabling the creep reinforcement material on the surface of the heat-resistant metal member to be efficiently diffused and permeated into the heat-resistant metal member.

Abstract translation: 包含选自B，W，Cr，Mo，Nb，V，Hf，Zr，Ti，Cu和Co中的一种或多种元素的蠕变增强材料被涂覆或热喷涂到耐热金属构件的表面上 使用耐热金属材料制造，并且用蠕变增强材料涂覆或热喷涂的部分被耐热覆盖件覆盖并且被固定以接触该部分。 由耐热性覆盖部件覆盖的耐热金属部件被加热到1000℃以上的温度，因此压缩力随着朝向外部的方向热膨胀而作用在耐热金属部件上 使耐热金属构件朝向外周的方向抑制热膨胀，并且使耐热金属构件的表面上的蠕变增强材料能够有效地扩散并渗透到耐热金属构件中。

公开(公告)号：US09095062B2

公开(公告)日：2015-07-28

申请号：US14078647

申请日：2013-11-13

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Yoshirou Kuromitsu ,  Kazuhiro Akiyama ,  Takeshi Kitahara ,  Hiroshi Tonomura

IPC: H05K1/16 ,  H05K1/02 ,  H05K1/18 ,  H05K1/05 ,  H01L23/373 ,  H05K7/06

CPC classification number: H05K1/053 ,  H01L23/3735 ,  H01L2224/32225 ,  H05K1/021 ,  H05K1/0212 ,  H05K1/18 ,  H05K1/181 ,  H05K7/06 ,  Y10T29/49124 ,  Y10T428/12576

Abstract: A power module substrate includes a ceramics substrate composed of Al2O3 having a top face. A metal plate composed of aluminum having a purity of 99.99% or more is joined to the top face of the ceramics substrate with a brazing filler metal which includes silicon interposed therebetween. A high concentration section is formed at a joint interface at which the metal plate is joined to the ceramics substrate, and has a silicon concentration that is more than five times the silicon concentration in the metal plate.

Abstract translation: 功率模块基板包括由具有顶面的Al 2 O 3构成的陶瓷基板。 由纯度为99.99％以上的铝构成的金属板与陶瓷基板的上表面接合，该钎焊金属包含硅。 在金属板与陶瓷基板接合的接合界面处形成高浓度部分，其硅浓度大于金属板中硅浓度的五倍。

公开(公告)号：US09039916B1

公开(公告)日：2015-05-26

申请号：US12961030

申请日：2010-12-06

Applicant: Stephen Edward Lehman, Jr.

Inventor： Stephen Edward Lehman, Jr.

IPC: C23F3/00 ,  C03C15/00 ,  H01L21/683 ,  H01L23/64 ,  H05K1/16

CPC classification number: H05K1/0306 ,  B01J23/42 ,  B01J23/8926 ,  B01J37/00 ,  B22F2001/0092 ,  B28B3/025 ,  B28B23/0081 ,  B28B23/0087 ,  B32B5/30 ,  B32B7/12 ,  B32B37/14 ,  B32B2037/1253 ,  B32B2262/0253 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2307/558 ,  B32B2571/02 ,  B82Y30/00 ,  B82Y40/00 ,  C01B33/027 ,  C23C4/134 ,  C23C18/14 ,  F41H1/02 ,  F41H5/0471 ,  F41H5/0492 ,  H01B1/02 ,  H01L21/6835 ,  H01L23/64 ,  H01L2924/0002 ,  H05K1/16 ,  Y02E60/122 ,  Y02P70/54 ,  Y10T428/12576 ,  Y10T428/24983 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T428/2916 ,  H01L2924/00

Abstract: A method for removing copper-oxide from copper powder, the method comprising: providing a copper powder defined by each particle having a copper core and a copper-oxide layer surrounding the copper core; disposing the particles in an etching solution in a container, wherein the etching solution removes the copper-oxide layer from each particle; decanting the etching solution and by-products; washing the particles; disposing the washed particles in an organic solvent; coating each copper core with an organic material from the organic solvent; dispersing the particles in the organic solvent; and providing the copper powder as dispersed copper cores that are absent a copper-oxide layer and have an organic coating, wherein the steps of dispersing in the etching solution, decanting, washing, disposing in the organic solvent, coating, and dispersing are performed in situ with the plurality of particles disposed in liquid, absent any exposure of the copper cores to air.

Abstract translation: 一种从铜粉中除去氧化铜的方法，其特征在于，提供由具有铜芯的每个粒子和围绕铜芯的铜氧化物层形成的铜粉末; 将颗粒置于容器中的蚀刻溶液中，其中蚀刻溶液从每个颗粒中去除氧化铜层; 滗析蚀刻溶液和副产物; 洗涤颗粒; 将洗涤过的颗粒置于有机溶剂中; 用有机溶剂用有机材料涂覆每个铜芯; 将颗粒分散在有机溶剂中; 并将铜粉末作为不含铜氧化物层并具有有机涂层的分散铜芯，其中分散在蚀刻溶液中的步骤，倾析，洗涤，在有机溶剂中的涂布，涂布和分散进行在 将多个颗粒置于液体中，而不会将铜芯暴露于空气中。

公开(公告)号：US20150111061A1

公开(公告)日：2015-04-23

申请号：US14059538

申请日：2013-10-22

Applicant: Mo-How Herman Shen

Inventor： Mo-How Herman Shen

IPC: C23C4/08 ,  C23C4/12 ,  B05D1/12 ,  F01D5/28 ,  C22F1/10 ,  C23C14/30 ,  C23C14/16 ,  B32B15/01 ,  C23C4/18 ,  C23F17/00

CPC classification number: F01D5/288 ,  B22F1/0003 ,  B22F2301/15 ,  B22F2301/35 ,  B32B15/01 ,  C22C19/005 ,  C22C19/07 ,  C22C38/04 ,  C22F1/10 ,  C23C14/0641 ,  C23C14/16 ,  C23C14/30 ,  C23C24/04 ,  C23C24/087 ,  C23C28/042 ,  C23C28/044 ,  C23C28/32 ,  C23C28/321 ,  C23C28/322 ,  C23C28/34 ,  C23C28/341 ,  C30B1/02 ,  C30B29/52 ,  F05D2230/31 ,  F05D2300/174 ,  F05D2300/506 ,  F05D2300/507 ,  F05D2300/516 ,  Y10T428/12576 ,  Y10T428/12931 ,  Y10T428/12986

Abstract: A method to increase the damping of a substrate using a face-centered cubic ferromagnetic damping coating having high damping loss attributes when a strain amplitude is 500-2000 micro-strain, and/or maximum damping loss attributes that occurs when the strain amplitude is greater than 250 micro-strain, and a turbine component having a face-centered cubic ferromagnetic damping coating.

公开(公告)号：US09005769B2

公开(公告)日：2015-04-14

申请号：US13695605

申请日：2011-05-11

Applicant: Philippe Lambert ,  Alessandro Farinotti

Inventor： Philippe Lambert ,  Alessandro Farinotti

IPC: B32B15/04 ,  B21D39/00 ,  B32B18/00 ,  B32B9/00 ,  A61F2/28 ,  A61F2/30 ,  A61L27/04 ,  A61L27/30 ,  C23C28/04 ,  A61F2/32

CPC classification number: A61F2/30 ,  A61F2/30767 ,  A61F2/32 ,  A61F2002/30929 ,  A61F2002/3098 ,  A61F2310/00029 ,  A61F2310/00886 ,  A61F2310/00898 ,  A61L27/045 ,  A61L27/306 ,  A61L2430/24 ,  C23C28/04 ,  Y10T428/12389 ,  Y10T428/12549 ,  Y10T428/12576 ,  Y10T428/12806

Abstract: Substrates for joints for orthopaedic implants are described, wherein at least one of the sliding surfaces of non-ferrous metal alloys, in particular of cobalt, chromium, molybdenum alloys, has a coating consisting of niobium nitride nanolayers alternating with chromium nitride nanolayers, the lot being protected by a chromium nitride microlayer.

Abstract translation: 描述了用于矫形植入物的接头的基底，其中有色金属合金，特别是钴，铬，钼合金的滑动表面中的至少一个具有由氮化铌纳米层与氮化铬纳米层交替的涂层，所述涂层 被氮化铬微层保护。

公开(公告)号：US08974916B2

公开(公告)日：2015-03-10

申请号：US12642813

申请日：2009-12-20

Applicant: Reid Brennen ,  Kevin Killeen ,  Karen L. Seaward

Inventor： Reid Brennen ,  Kevin Killeen ,  Karen L. Seaward

IPC: B32B15/01 ,  B32B15/04 ,  B32B15/18 ,  B32B3/20 ,  C23C30/00 ,  B01D63/08 ,  B23K20/02

CPC classification number: B32B15/01 ,  B01D63/088 ,  B23K20/023 ,  B32B3/20 ,  B32B15/043 ,  B32B15/18 ,  C23C30/005 ,  Y10T428/12361 ,  Y10T428/12493 ,  Y10T428/12576 ,  Y10T428/12806 ,  Y10T428/12965 ,  Y10T428/12979 ,  Y10T428/12993

Abstract: A method for solid state bonding of a plurality of metallic layers and devices made by that method are disclosed. First and second metallic layers are solid state bonded utilizing a protective coating on the non-bonded surfaces that engage the pressure applying appliance to prevent the surfaces from adhering to the pressure applying appliance and to protect the surfaces from imprinting during the bonding process. The invention can be used to fabricate micro-channel devices with smooth outer surfaces and eliminate mold release compounds utilized in conventional bonding procedures.

Abstract translation: 公开了一种通过该方法制造的多个金属层和器件的固态接合方法。 第一和第二金属层是利用在非接合表面上接合压力施加器具的保护涂层固态结合的，以防止表面粘附到施压器具上，并在接合过程中保护表面免受压印。 本发明可用于制造具有光滑外表面的微通道器件，并消除常规接合工艺中使用的脱模剂。