公开(公告)号：US06183189B2

公开(公告)日：2001-02-06

申请号：US09200550

申请日：1998-11-27

申请人： Erzhuang Lzu ,  Xiaosong Tang ,  Yih-Shung Lin ,  Charles Lin

发明人： Erzhuang Lzu ,  Xiaosong Tang ,  Yih-Shung Lin ,  Charles Lin

IPC分类号： H01L2168

CPC分类号： H01L21/6833 ,  Y10S414/136

摘要： A wafer chuck for positioning and releasably holding a wafer includes a support platform having an upper surface for positioning and supporting the wafer. Wafer banking pins are affixed to the support platform for positioning the wafer. A lift device acting on the wafer when it rests on the support platform to move the wafer relative to the support platform in a slanted direction away from the support platform and wafer banking pins. The lift device has a plurality of wafer lifting fingers that cooperatively extend in a biased and substantially vertical direction are disposed in a pattern to be supportive of the wafer. Each of the wafer lifting fingers has an end portion that is movable relative to the support platform between a first position at which it is retracted from the upper surface of the support platform and a second position at which it protrudes from the upper surface of the support platform so as to engage the wafer to lift it relative to the support platform.

摘要翻译： 用于定位和可释放地保持晶片的晶片卡盘包括具有用于定位和支撑晶片的上表面的支撑平台。 晶片银针被固定在支撑平台上以便定位晶片。 提升装置，当其搁置在支撑平台上时，其作用在晶片上，以相对于支撑平台沿倾斜方向远离支撑平台和晶片储存销移动晶片。 提升装置具有多个晶片提升指状物，其以偏置且基本垂直的方向协同地延伸，以图案形式支撑晶片。 每个晶片提升指具有端部，该端部可相对于支撑平台移动在第一位置和第二位置之间，第二位置从支撑平台的上表面缩回到第二位置，第二位置从支撑台的上表面突出 平台，以便使晶片相对于支撑平台升起。