公开(公告)号：US20120289058A1

公开(公告)日：2012-11-15

申请号：US13533053

申请日：2012-06-26

申请人： Makoto Hirano ,  Akinari Hayashi ,  Makoto Tsuri ,  Haruyuki Miyata

发明人： Makoto Hirano ,  Akinari Hayashi ,  Makoto Tsuri ,  Haruyuki Miyata

IPC分类号： C23C16/44 ,  H01L21/02

CPC分类号： H01L21/67017 ,  H01L21/67772 ,  H01L21/67775 ,  Y10T29/41

摘要： Adverse effects when a carrier is open, such as particles adhesion to the substrate or natural oxidation film deposits on the substrate, as well as a rise in oxygen concentration and contamination of the substrate transfer chamber are prevented. Semiconductor manufacturing apparatus includes a carrier in which a cover unit is provided on a substrate loading/unloading opening for loading and unloading a substrate, a carrier open/close chamber continuously arranged to the carrier, a substrate transfer chamber continuously arranged to the carrier open/close chamber, a substrate processing chamber continuously arranged to the substrate transfer chamber, an exhaust means for exhausting the atmosphere in the carrier open/close chamber by suction, and an exhaust quantity adjuster means for adjusting the suction exhaust quantity of the exhaust means.

摘要翻译： 载体打开时的不利影响，例如颗粒附着于基底或天然氧化膜沉积在基底上，以及氧浓度的上升和基底传送室的污染被阻止。 半导体制造装置包括载体，其中盖单元设置在用于装载和卸载基板的基板装载/卸载开口上，连续布置到载体的载体打开/关闭室，连续布置到载体打开/ 关闭室，连续配置在基板搬送室的基板处理室，通过抽吸排出载体打开/关闭室中的气氛的排气装置，以及用于调节排气装置的抽吸排气量的排气量调节装置。

公开(公告)号：US20080236487A1

公开(公告)日：2008-10-02

申请号：US11662584

申请日：2005-09-15

申请人： Makoto Hirano ,  Akinari Hayashi ,  Makoto Tsuri ,  Haruyuki Miyata

发明人： Makoto Hirano ,  Akinari Hayashi ,  Makoto Tsuri ,  Haruyuki Miyata

IPC分类号： C23C16/00 ,  H01L21/64

CPC分类号： H01L21/67017 ,  H01L21/67772 ,  H01L21/67775

摘要： Adverse effects when a carrier is open, such as particles adhesion to the substrate or natural oxidation film deposits on the substrate, as well as a rise in oxygen concentration and contamination of the substrate transfer chamber are prevented. Semiconductor manufacturing apparatus includes a carrier (10) in which a cover unit (10a) is provided on a substrate loading/unloading opening (10b) for loading and unloading a substrate (9), a carrier open/close chamber (61) continuously arranged to the carrier (10), a substrate transfer chamber (16) continuously arranged to the carrier open/close chamber, a substrate processing chamber continuously arranged to the substrate transfer chamber, an exhaust means (63) for exhausting the atmosphere in the carrier open/close chamber by suction, and an exhaust quantity adjuster means (65, 66) for adjusting the suction exhaust quantity of the exhaust means.

摘要翻译： 载体打开时的不利影响，例如颗粒对基底的粘附或自然氧化膜沉积在基底上，以及氧浓度的上升和基底传送室的污染被阻止。 半导体制造装置包括载体（10），其中盖单元（10a）设置在用于装载和卸载基板（9）的基板装载/卸载开口（10b）上，载体打开/关闭室（61） 连续地布置到载体（10）上，连续地布置到载体打开/关闭室的基板传送室（16），连续地布置到基板传送室的基板处理室，排出装置（63） 载体打开/关闭室，以及用于调节排气装置的抽吸排气量的排气量调节装置（65,66）。

公开(公告)号：US08777553B2

公开(公告)日：2014-07-15

申请号：US13533053

申请日：2012-06-26

申请人： Makoto Hirano ,  Akinari Hayashi ,  Makoto Tsuri ,  Haruyuki Miyata

发明人： Makoto Hirano ,  Akinari Hayashi ,  Makoto Tsuri ,  Haruyuki Miyata

IPC分类号： B65H1/00

CPC分类号： H01L21/67017 ,  H01L21/67772 ,  H01L21/67775 ,  Y10T29/41

摘要： Adverse effects when a carrier is open, such as particles adhesion to the substrate or natural oxidation film deposits on the substrate, as well as a rise in oxygen concentration and contamination of the substrate transfer chamber are prevented. Semiconductor manufacturing apparatus includes a carrier in which a cover unit is provided on a substrate loading/unloading opening for loading and unloading a substrate, a carrier open/close chamber continuously arranged to the carrier, a substrate transfer chamber continuously arranged to the carrier open/close chamber, a substrate processing chamber continuously arranged to the substrate transfer chamber, an exhaust means for exhausting the atmosphere in the carrier open/close chamber by suction, and an exhaust quantity adjuster means for adjusting the suction exhaust quantity of the exhaust means.

摘要翻译： 载体打开时的不利影响，例如颗粒附着于基底或天然氧化膜沉积在基底上，以及氧浓度的上升和基底传送室的污染被阻止。 半导体制造装置包括载体，其中盖单元设置在用于装载和卸载基板的基板装载/卸载开口上，连续布置到载体的载体打开/关闭室，连续布置到载体打开/ 关闭室，连续配置在基板搬送室的基板处理室，通过抽吸排出载体打开/关闭室中的气氛的排气装置和用于调节排气装置的抽吸排气量的排气量调节装置。

公开(公告)号：US06582174B1

公开(公告)日：2003-06-24

申请号：US09491491

申请日：2000-01-25

申请人： Akinari Hayashi

发明人： Akinari Hayashi

IPC分类号： H01L2168

CPC分类号： H01L21/67769 ,  Y10S414/14

摘要： A substrate processing apparatus includes a rotation accommodating shelf and a transfer machine. The rotation accommodating shelf is capable of accommodating a plurality of accommodating containers in which substrates are to be loaded. The transfer machine is for transferring the plurality of accommodating containers to the rotation accommodating shelf. The plurality of accommodating containers are respectively disposed on radial lines, which radiate from a rotation center of the rotation accommodating shelf, such that each accommodating container is respectively inclined in a horizontal plane in a same fixed direction with respect to a radial line.

摘要翻译： 基板处理装置包括旋转容纳架和转印机。 旋转容纳架能够容纳多个容纳容器，其中衬底将被装载。 转印机用于将多个容纳容器转移到旋转容纳架。 多个容纳容器分别设置在从旋转容纳架的旋转中心辐射的径向线上，使得每个容纳容器分别相对于径向线在相同的固定方向上在水平面中倾斜。