发明申请
- 专利标题: SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- 专利标题(中): 半导体制造设备和半导体器件制造方法
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申请号: US13533053申请日: 2012-06-26
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公开(公告)号: US20120289058A1公开(公告)日: 2012-11-15
- 发明人: Makoto Hirano , Akinari Hayashi , Makoto Tsuri , Haruyuki Miyata
- 申请人: Makoto Hirano , Akinari Hayashi , Makoto Tsuri , Haruyuki Miyata
- 申请人地址: JP Tokyo
- 专利权人: HITACHI KOKUSAI ELECTRIC INC.
- 当前专利权人: HITACHI KOKUSAI ELECTRIC INC.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2004-268369 20040915; JP2004-276671 20040924
- 主分类号: C23C16/44
- IPC分类号: C23C16/44 ; H01L21/02
摘要:
Adverse effects when a carrier is open, such as particles adhesion to the substrate or natural oxidation film deposits on the substrate, as well as a rise in oxygen concentration and contamination of the substrate transfer chamber are prevented. Semiconductor manufacturing apparatus includes a carrier in which a cover unit is provided on a substrate loading/unloading opening for loading and unloading a substrate, a carrier open/close chamber continuously arranged to the carrier, a substrate transfer chamber continuously arranged to the carrier open/close chamber, a substrate processing chamber continuously arranged to the substrate transfer chamber, an exhaust means for exhausting the atmosphere in the carrier open/close chamber by suction, and an exhaust quantity adjuster means for adjusting the suction exhaust quantity of the exhaust means.
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