Abstract:
This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semiconductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus. Accordingly, highly clean evacuated condition can be attained and, in addition, semiconductor devices at high reliability and with no degradation in the electric characteristics can be obtained by using the pressure-reducing processing apparatus having such a highly clean processing chamber.
Abstract:
A method of forming on a substrate a waveguide lens having a predetermined distribution of refractive index, for converging or diverging light rays which propagate through a two-dimensional waveguide formed on a surface of the substrate. The method includes a step of forming a film of a diffusion metal having a constant thickness, a step of removing local portions of said film, by using a mask so that a density of the removed local portions of the film per unit area is continuously varied, and a step of effecting thermal diffusion of the remainder of the film into the substrate. Alternatively, the method includes a step of forming a mask having a multiplicity of separate openings whose density per unit area is continuously varied, a step of exposing a multiplicity of separate exposed areas of the substrate aligned with the separate openings to a material which serves to change a refractive index of the substrate, and a step of moving the material from the surface of the substrate into its interior.
Abstract:
Disclosed is a thyristor and a method for the manufacture thereof. An auxiliary dopant, such as gold, is diffused into the cathode emitter region and the area immediately therearound. The auxiliary dopant is selected from among those known to stimulate charge carrier recombination. Consequently charge carrier recombination in the vicinity of the cathode emitter is enhanced and rapid turnoff of the device is promoted. Both SCR and triac embodiments are disclosed.
Abstract:
A method of epitaxially depositing onto a semiconductor substrate by planarizing the deposition surface of the substrate substantially parallel to a predetermined crystallographic plane, forming a deposition mask which exposes a predetermined site on the surface of the substrate, and epitaxially depositing semiconductor material in a preferred growth direction at the exposed site to produce a monocrystalline structure. A plurality of sites may be exposed through the deposition mask to permit formation of a plurality of discrete monocrystalline structures having predetermined spacing. Layers of different conductivity types can be formed in the structures by selective doping during deposition. Monocrystalline structures formed by the above method may be coated with a dielectric material and further processed to produce semiconductor devices for use in integrated circuits. If the monocrystalline structures are suitably arrayed and of a different conductivity type than the substrate, thus yielding semiconductor diodes, they can be utilized as a target in a vidicon tube.
Abstract:
HEAVILY LITHIUM-DOPED N+ SURFAC-ADJACENT REGIONS ARE FORMED IN HIGH-PURITY GERMANIUM BODIES BY ELECTRODEPOSITION THEREOF FROM A BATH OF FUSED LITHIUM SALT AT A TEMPERATURE AT WHICH THE SOLUBILITY OF COPPER IN GERMANIUM IS NEGLIGIBLE.
Abstract:
A process for making a vertical PNP transistor and a transistor made by the process includes providing a highly doped semiconductor substrate (10) of P conductivity type. A first lightly doped P- layer (12) is epitaxially grown on the substrate (10). An N+ type buried layer impurity (18) is introduced into a surface region of the first lightly doped layer (12) that will underlie and define an island in which the vertical transistor will be constructed. A second lightly doped P- layer (16) is epitaxially grown on the first lightly doped layer (12) and the buried layer impurity (18). An N+ type isolation impurity is diffused into the second layer to form wells to laterally enclose an island (22) of the second layer (16) above the buried layer impurity (18). An N type base impurity (28) is diffused into the island (22) region of the second layer (16), and a P type emitter impurity (30) is diffused into the base region (28). A collector resistivity adjusting impurity (25) may optionally be diffused into the second layer (16) to reduce the collector resistance of the PNP transistor that is formed. Various steps in the construction of the vertical PNP transistor, such as diffusing the isolation impurity (18), diffusing the base impurity (28), and diffusing the emitter impurity (30), may be performed simultaneously with corresponding steps of a BiCMOS process.
Abstract:
The asymmetrical implanted regions required in a single-level electrode two-phase charge coupled device structure are formed by a process which accurately aligns one edge of each ion-implanted region with an edge of a corresponding conductive electrode overlying the ion-implanted region.
Abstract:
The memory apparatus incorporates a drum, mounted for rotation, and a series of hard mounted heads, spaced from the drum magnetic recording medium surface. The mounting structure includes spaced parallel aligning bars, utilized to precisely align the magnetic heads prior to finally fixing them to the structure, and resilient plastic wedges utilized to maintain a bias against the aligning bars, to compensate for the stresses induced in the assembly process. The precise spacing from the magnetic medium is accomplished by placing a spacing film over the drum, which film is removed after final assembly, leaving the proper head-tomedium gap. The final configuration is maintained by the use of epoxy adhesive to secure the heads to the aligning bars and retaining bars. The frame structure and head utilize the same metal alloy to maintain the head-to-medium gap during temperature variations. The resulting apparatus may be utilized in a voice response system for producing computer ordered, human voice response, to various commands. In this application the drum is rotated at a rate of one revolution per second and the head gap, head-to-medium spacing, and medium thickness, controlled to produce a relatively flat response characteristics over the frequencies of importance and thereby enable the use of relatively simple amplifiers with linear response characteristics.
Abstract:
A silicon semiconductor device double doped with phosphorus and arsenic or boron and arsenic, the arsenic being present in an amount 3 to 40 percent of the other dopant and preventing lattice collapse with heavy doping concentrations.
Abstract:
TO PRODUCE A P-CONDUCTIVITY TYPE WIDE BAND GAP SEMICONDUCTOR MATERIAL, A III-V COMPOUND SEMICONDUCTOR LAYER IS FIRST VACUUM EVAPORATED ONTO AND THEN DIFFUSED INTO A CRYSTALLINE II-VI COMPOUND SEMICONDUCTOR SUBSTRATE, SPECIFICALLY A ZINC CHALCOGENIDE. THE RESULTING HYBRID CRYSTALLINE MATERIAL IS DOPED BY SIMULTANEOUS OR SEQUENTIAL INFUSION OF ZINC ATOMS IN SUBSTITUTION FOR ATOMS OF THE GROUP III ELEMENT. THE PROCESS MAY BE USED FOR THE DIRECT PRODUCTION OF P-N JUNCTIONS IN ZINC CHALOGENIDES BY EMPLOYING AN N-TYPE RATHER THAN AN INTRINSIC SUBSTRATE.