公开(公告)号：US07568272B2

公开(公告)日：2009-08-04

申请号：US10988702

申请日：2004-11-16

Applicant: Tsukasa Morita ,  Noriaki Kawauchi ,  Toshihiro Seki ,  Akihiko Satou

Inventor： Tsukasa Morita ,  Noriaki Kawauchi ,  Toshihiro Seki ,  Akihiko Satou

IPC: B21D31/00

CPC classification number: B21D53/88 ,  Y10T29/49829

Abstract: In a press-forming method, a plurality of plates are prepared and end faces of the plurality of plates are butt joined to obtain a blank having joined portions. The blank has deformed-shape sections formed in a vicinity of the joined portion so as to deform in a direction along which peripheral lengths of the deformed-shape sections are stretched. Press-forming, involving stretch-flange formation, is carried out on the blank so as to allow the joined portions to be included in stretching regions, respectively. Also, the stretch-flange formation is carried out on the blank while restraining ends of the joined portion of the blank.

Abstract translation: 在压制成型方法中，制备多个板，并且将多个板的端面对接，以获得具有接合部的坯料。 坯料具有形成在接合部附近的变形形状部分，以沿着变形形状部分的周长延伸的方向变形。 在坯料上进行包括拉伸凸缘成形的压制成形，以使接合部分分别包含在拉伸区域中。 此外，在坯料的接合部分的限制端部处，在坯料上进行拉伸凸缘形成。

公开(公告)号：US20050210654A1

公开(公告)日：2005-09-29

申请号：US11079267

申请日：2005-03-15

Applicant: Noriaki Kawauchi ,  Akihiko Satou

Inventor： Noriaki Kawauchi ,  Akihiko Satou

IPC: B21D19/08 ,  B21D39/02 ,  B21D39/03 ,  B21J15/02 ,  B21J15/10 ,  B23P11/00 ,  F16H35/18

CPC classification number: B21D39/032 ,  Y10T29/49908 ,  Y10T29/49915 ,  Y10T29/53065

Abstract: A caulking method for joining a first plate having a tapered hole and a hollow cylindrical caulking portion extending from a periphery of the tapered hole, and a second plate having a hole, the method including inserting the caulking portion of the first plate through the hole of the second plate to project a tip end portion of the caulking portion beyond the hole and overlay the second plate on the first plate, and folding back the tip end portion of the caulking portion over a periphery of the hole of the second plate on one side surface thereof, while pressing against a beveled surface defining the tapered hole so as to prevent a material of the caulking portion from flowing toward the other side surface of the first plate along the periphery of the tapered hole.

Abstract translation: 一种用于接合具有锥形孔的第一板和从锥形孔的周边延伸的中空圆柱形铆接部分的铆接方法和具有孔的第二板，该方法包括将第一板的铆接部分穿过孔的孔 所述第二板将所述铆接部的前端部突出到所述孔之外，并且将所述第二板覆盖在所述第一板上，并且在所述第二板的一侧的所述第二板的孔的周边上折叠所述铆接部的前端部 的表面，同时压靠限定锥形孔的斜面，以防止铆接部的材料沿着锥形孔的周边朝向第一板的另一侧表面流动。

公开(公告)号：US20050115300A1

公开(公告)日：2005-06-02

申请号：US10988702

申请日：2004-11-16

Applicant: Tsukasa Morita ,  Noriaki Kawauchi ,  Toshihiro Seki ,  Akihiko Satou

Inventor： Tsukasa Morita ,  Noriaki Kawauchi ,  Toshihiro Seki ,  Akihiko Satou

IPC: B21D53/88 ,  B21D31/00

CPC classification number: B21D53/88 ,  Y10T29/49829

Abstract: In a press-forming method, a plurality of plates are prepared and end faces of the plurality of plates are butt joined to obtain a blank having joined portions. The blank has deformed-shape sections formed in a vicinity of the joined portion so as to deform in a direction along which peripheral lengths of the deformed-shape sections are stretched. Press-forming, involving stretch-flange formation, is carried out on the blank so as to allow the joined portions to be included in stretching regions, respectively. Also, the stretch-flange formation is carried out on the blank while restraining ends of the joined portion of the blank.

Abstract translation: 在压制成型方法中，制备多个板，并且将多个板的端面对接，以获得具有接合部的坯料。 坯料具有形成在接合部附近的变形形状部分，以沿着变形形状部分的周长延伸的方向变形。 在坯料上进行包括拉伸凸缘成形的压制成形，以使接合部分分别包含在拉伸区域中。 此外，在坯料的接合部分的限制端部处，在坯料上进行拉伸凸缘形成。

公开(公告)号：US5062771A

公开(公告)日：1991-11-05

申请号：US325910

申请日：1989-03-20

Applicant: Akihiko Satou ,  Tadao Kusaka ,  Shigeo Tomiyama ,  Kouzi Aoki ,  Ichiro Gyobu ,  Kimio Muramatsu ,  Hiroaki Sakamoto ,  Shinjiroo Ueda ,  Masahiro Mase ,  Takashi Nagaoka

Inventor： Akihiko Satou ,  Tadao Kusaka ,  Shigeo Tomiyama ,  Kouzi Aoki ,  Ichiro Gyobu ,  Kimio Muramatsu ,  Hiroaki Sakamoto ,  Shinjiroo Ueda ,  Masahiro Mase ,  Takashi Nagaoka

IPC: B01J3/00 ,  C23C16/44 ,  F04D19/04

CPC classification number: B01J3/006 ,  C23C16/4412 ,  F04D17/168 ,  F04D19/046 ,  F04D23/008 ,  Y10S148/022 ,  Y10S148/03 ,  Y10S148/169 ,  Y10S438/909

Abstract: This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semiconductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus. Accordingly, highly clean evacuated condition can be attained and, in addition, semiconductor devices at high reliability and with no degradation in the electric characteristics can be obtained by using the pressure-reducing processing apparatus having such a highly clean processing chamber.

公开(公告)号：US4835114A

公开(公告)日：1989-05-30

申请号：US16567

申请日：1987-02-19

Applicant: Akihiko Satou ,  Tadao Kusaka ,  Shigeo Tomiyama ,  Kouzi Aoki ,  Ichiro Gyobu ,  Kimio Muramatsu ,  Hiroaki Sakamoto ,  Shinjiroo Ueda ,  Masahiro Mase ,  Takashi Nagaoka

Inventor： Akihiko Satou ,  Tadao Kusaka ,  Shigeo Tomiyama ,  Kouzi Aoki ,  Ichiro Gyobu ,  Kimio Muramatsu ,  Hiroaki Sakamoto ,  Shinjiroo Ueda ,  Masahiro Mase ,  Takashi Nagaoka

IPC: B01J3/00 ,  C23C16/44 ,  F04D19/04

CPC classification number: B01J3/006 ,  C23C16/4412 ,  F04D17/168 ,  F04D19/046 ,  F04D23/008 ,  Y10S148/022 ,  Y10S148/03 ,  Y10S148/169 ,  Y10S438/909

Abstract: This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semi-conductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus. Accordingly, highly clean evacuated condition can be attained and, in addition, semiconductor devices at high reliability and with no degradation in the electric characteristics can be obtained by using the pressure-reducing processing apparatus having such a highly clean processing chamber.

Abstract translation: 本发明涉及一种用于半导体器件的制造方法和处理装置，以及用于该处理装置的抽空装置。 根据本发明，由于用于在半导体器件的制造步骤期间进行各种晶片处理的减压处理装置的抽空系统仅由无油真空泵，有害油污染或由油产生的油的碳酸化产物构成 与使用真空油泵作为抽空泵的常规减压处理装置以及使用这种装置的半导体装置的制造方法相比，减压处理室中不存在加热。 因此，可以实现高度清洁的抽真空条件，并且通过使用具有这种高度清洁的处理室的减压处理装置，可以获得高可靠性且不劣化电气特性的半导体器件。