Abstract:
An improved noise suppression circuit which includes a first transistor having a collector, an emitter coupled to the input of the circuit, and a base coupled to an output of the circuit through an impedance means. The circuit includes a second transistor having a base coupled to the collector of the first transistor, a collector coupled to a reference potential, and an emitter integral with the impedance means. The circuit of the present invention can be constructed to suppress positive-going noise pulses, negative-going noise pulses, or one of each can be cascaded to suppress both positive and negative-going noise pulses.
Abstract:
A charge coupled memory device is disclosed which comprises a plurality of CCD shift registers, input write circuitry, output read circuitry, and a plurality of charge comparison circuits, each of which are coupled between corresponding ones of the CCD shift registers. Each charge comparison circuit includes an active charge comparator device having a pair of field effect transistors that are cross-coupled to one another. Charge is applied from the output of the preceding shift register to an input of the charge comparison circuit, and the charge is compared with a reference charge developed from a reference signal. The charge comparison circuit provides complementary logic output signals that correspond to whether the input charge is greater or less than the reference charge. The charge comparison circuit is insensitive to voltage variations in the DC power supply and does not consume any DC power. The output logic signals are compatible with the logic levels of the external circuitry.
Abstract:
A high-gain comparator circuit including a pair of input transistors, a constant current source, a pair of shunting transistors, and a pair of diodes geometrically scaled to corresponding ones of the shunting transistors, all of which are connected to provide a regenerative circuit which produces high slope bilevel output signals at the circuit switching point.
Abstract:
A charge coupled distributed amplifier comprises a first plurality of charge storage wells arranged along a first selected line, a second plurality of charge storage wells arranged along a second selected line, and a multiplicity of amplifier means, each amplifier means electrically coupling one charge storage well in the first plurality of wells to a corresponding charge storage well in the second plurality of wells. Charges are driven along the first and second pluralities of charge storage wells in synchronization. The same charge in the first plurality of charge storage wells creates an additional increment of charge in each charge storage well connected to the output of each amplifier means which adds in that well to the previously accumulated charge in the second plurality of charge storage wells. Thus a given amount of input charge is amplified coherently to produce a detectable output signal.
Abstract:
A memory cell having two transistors, each transistor having two emitters, a base, and a collector; the bases and the collectors of the transistors are cross-coupled; by the application of a first signal to one of the emitters of each of the two transistors simultaneously, and a second signal at the same time to the other emitter of only one of the two transistors, the transistor having the second signal at its emitter is placed in a conducting state so that data is stored in the cell having the actuated emitter.
Abstract:
Semiconductor devices containing integrated circuits are attached directly to external package leads by pressing simultaneously a plurality of groups of leads against bonding pads on a plurality of face-up semiconductor dice and heating the composite structures. Solder bumps on the bonding pads contain hard pedestals which prevent the overlying leads from being pushed into the faces of the semiconductor devices while the solder on the solder bumps melts to form the bonds between the leads and the underlying semiconductor dice. The process for carrying out this operation lowers significantly the cost of each packaged semiconductor device and the resulting structure is more reliable than structures of the prior art.
Abstract:
Apparatus and method for the deposition of semiconductor material onto semiconductor wafers by immersing them in a source of liquid semiconductor material. The apparatus includes a chamber, a wafer holder, and a plug, the plug adapted to rest upon the liquid residing in the chamber during mixing of the liquid, and to be pushed through the liquid, thereby forcing the liquid to flow through the space between the plug and the walls of the chamber, that space acting as a filter to prevent solid contaminants from coming into contact with the wafers in the holder. The floating plug also serves to prevent volatilization of constituents during the mixing of the semiconductor and dopants.
Abstract:
MULTIPLE LAYERS OF CONDUCTIVE INTERCONNECTS ARE FORMED ON AN INTEGRATED CIRCUIT BY DEPOSTING LAYERS OF A METAL (TYPICALLY ALUMINUM) ON THE SURFACE OF THE CIRCUIT AND THEN SELECTIVELY ANODIZING THESE LAYERS TO FORM INSULATION LAYERS OR LAYERS OF CONDUCTIVE INTERCONNECTS. MASKING MATERIAL IS USED TO PREVENT THE ANODIZATION OF AND THUS TO DEFINE, THE CONDUCTIVE LEAD PATTERNS.
Abstract:
A silicon wafer has a plurality of spaced diode junctions formed in its upper surface and through openings in a silicon dioxide layer. A conductive grid is disposed over the silicon dioxide layer and has openings exposing the elemental diode surfaces. The top of the exposed diode surfaces are cesiated. Each of the diodes is reverse biased and the cesiated surfaces of the diodes emit electrons, appropriately adjusting their potential in response to radiation applied to the adjacent rear surface of the wafer.
Abstract:
Low-melting, low-expansion, lead-free glass compositions are provided for sealing ceramics parts and encapsulating ceramic substrates. In addition to having a thermal expansion matching that of alumina, the glass compositions provide for the formation of a glass-to-alumina seal in the 380* to 450* C. temperature range.