Abstract:
MULTIPLE LAYERS OF CONDUCTIVE INTERCONNECTS ARE FORMED ON AN INTEGRATED CIRCUIT BY DEPOSTING LAYERS OF A METAL (TYPICALLY ALUMINUM) ON THE SURFACE OF THE CIRCUIT AND THEN SELECTIVELY ANODIZING THESE LAYERS TO FORM INSULATION LAYERS OR LAYERS OF CONDUCTIVE INTERCONNECTS. MASKING MATERIAL IS USED TO PREVENT THE ANODIZATION OF AND THUS TO DEFINE, THE CONDUCTIVE LEAD PATTERNS.