公开(公告)号：US3765590A

公开(公告)日：1973-10-16

申请号：US3765590D

申请日：1972-05-08

Applicant: FAIRCHILD CAMERA INSTR CO

Inventor： DUFFEK E ,  LANE J ,  LEHNER W ,  FUNK E ,  JANKOWSKI A ,  OLIVER F ,  SCHNEIDER M

IPC: H01L21/00 ,  H01L23/495 ,  B23K1/00

CPC classification number: H01L21/67144 ,  H01L23/49541 ,  H01L23/49551 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/53183 ,  H01L2924/00

Abstract: Semiconductor devices containing integrated circuits are attached directly to external package leads by pressing simultaneously a plurality of groups of leads against bonding pads on a plurality of face-up semiconductor dice and heating the composite structures. Solder bumps on the bonding pads contain hard pedestals which prevent the overlying leads from being pushed into the faces of the semiconductor devices while the solder on the solder bumps melts to form the bonds between the leads and the underlying semiconductor dice. The process for carrying out this operation lowers significantly the cost of each packaged semiconductor device and the resulting structure is more reliable than structures of the prior art.

Abstract translation: 包含集成电路的半导体器件通过同时将多组引线抵抗多个面朝上半导体晶片上的接合焊盘并且加热复合结构而直接附接到外部封装引线。 接合焊盘上的焊料凸起包含硬的基座，其防止上覆的引线被推入半导体器件的表面，同时焊料凸块上的焊料熔化以形成引线和下面的半导体管芯之间的结合。 执行该操作的过程显着降低了每个封装的半导体器件的成本，并且所得到的结构比现有技术的结构更可靠。