Abstract:
Semiconductor devices containing integrated circuits are attached directly to external package leads by pressing simultaneously a plurality of groups of leads against bonding pads on a plurality of face-up semiconductor dice and heating the composite structures. Solder bumps on the bonding pads contain hard pedestals which prevent the overlying leads from being pushed into the faces of the semiconductor devices while the solder on the solder bumps melts to form the bonds between the leads and the underlying semiconductor dice. The process for carrying out this operation lowers significantly the cost of each packaged semiconductor device and the resulting structure is more reliable than structures of the prior art.
Abstract:
A package for displaying alpha-numeric characters using a plurality of discrete, light-emitting diodes, each diode providing a point source of light corresponding to one of the segments of the characters when electrically activated, including a substrate having the light-emitting diodes mounted upon it; a block of material adjacent the substrate containing a plurality of light pipes in the shape of the segments; and a composite fly''s eye lens on top of the light pipes for displaying the selected character by the selective activation of the lightemitting diodes.