公开(公告)号：US12041727B2

公开(公告)日：2024-07-16

申请号：US17797597

申请日：2021-07-12

申请人： NITTO BOSEKI CO., LTD.

发明人： Kazutaka Adachi ,  Kohei Matsumoto

IPC分类号： H05K3/24 ,  H05K1/03 ,  H05K3/28

CPC分类号： H05K3/285 ,  H05K1/0366 ,  H05K3/249 ,  H05K2203/1377

摘要： Provided are a surface-treated glass cloth that enables the reliability of a printed wiring board to be improved, a prepreg, and a printed wiring board. In the surface-treated glass cloth, a surface-treated layer contains a silane coupling agent, the amount of carbon attached of an adhering component of the surface-treated layer is in the range of 0.030 to 0.060% by mass, the arithmetic average height of the surface of the adhering component of the surface-treated layer is in the range of 1.0 to 3.0 nm, and the product of the amount of carbon attached of the adhering component and the arithmetic average height of the surface of the adhering component is in the range of 0.060 to 0.100.

公开(公告)号：US20190191569A1

公开(公告)日：2019-06-20

申请号：US16283808

申请日：2019-02-24

申请人： Cambrios Film Solutions Corporation

发明人： David Jones ,  Florian Pschenitzka ,  Xina Quan ,  Michael A. Spaid ,  Jeffrey Wolk

IPC分类号： H05K3/24 ,  B82Y30/00 ,  B82Y10/00 ,  H01L31/18 ,  H01L29/41

CPC分类号： H05K3/245 ,  B82Y10/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/1884 ,  H01L51/0048 ,  H01L51/5206 ,  H05K1/097 ,  H05K3/249 ,  H05K2201/0108 ,  H05K2201/026 ,  Y02E10/50

摘要： Composite transparent conductors are described, which comprise a primary conductive medium based on metal nanowires and a secondary conductive medium based on a continuous conductive film.

公开(公告)号：US08314339B2

公开(公告)日：2012-11-20

申请号：US12495860

申请日：2009-07-01

申请人： Masayuki Kitajima ,  Takeshi Ishitsuka ,  Satoshi Emoto

发明人： Masayuki Kitajima ,  Takeshi Ishitsuka ,  Satoshi Emoto

IPC分类号： H05K1/03 ,  H05K1/09

CPC分类号： H05K3/249 ,  H05K1/118 ,  H05K2201/0272 ,  H05K2201/035 ,  H05K2201/0769 ,  H05K2203/1105

摘要： A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.

摘要翻译： 印刷布线板包括形成布线图案的第一导电浆料和包含捏合的第一导电材料的第二导电浆料和其颗粒比第一导电材料细颗粒的第二导电材料。

公开(公告)号：US20110108876A1

公开(公告)日：2011-05-12

申请号：US12684969

申请日：2010-01-11

申请人： Lee-Sheng Yen

发明人： Lee-Sheng Yen

IPC分类号： H01L33/00 ,  H05K1/09 ,  H05K3/10 ,  H01L21/768

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H05K3/244 ,  H05K3/247 ,  H05K3/249 ,  H05K2201/0257 ,  H05K2201/0329 ,  Y10T29/49155 ,  H01L2924/00

摘要： A pad structure includes a copper circuit pattern on a substrate, at least a gold layer stacked on the copper circuit pattern, and a nano-structured coating film stacked on the gold layer.

摘要翻译： 衬垫结构包括在衬底上的铜电路图案，至少堆叠在铜电路图案上的金层和堆叠在金层上的纳米结构涂层膜。

公开(公告)号：US20100047653A1

公开(公告)日：2010-02-25

申请号：US12544254

申请日：2009-08-20

申请人： Hiroshi YAMAZAKI ,  Noriaki AIMOTO ,  Taiki SUEYOSHI ,  Hiroyuki HANAZONO

发明人： Hiroshi YAMAZAKI ,  Noriaki AIMOTO ,  Taiki SUEYOSHI ,  Hiroyuki HANAZONO

IPC分类号： H01M8/10 ,  H05K1/00

CPC分类号： H01M8/1011 ,  H01M8/0234 ,  H01M8/0239 ,  H01M8/0243 ,  H01M8/0245 ,  H01M8/2475 ,  H01M2250/30 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/249 ,  H05K3/28 ,  H05K2201/0191 ,  Y02B90/18 ,  Y02E60/523

摘要： A pair of rectangular collector portions and extraction conductor portions that each extend in a long-sized shape from the respective collector portions are formed on one surface of a base insulating layer. A carbon containing layer is formed on the base insulating layer to cover the collector portion and the extraction conductor portion excluding a tip. A carbon containing layer and a solder resist layer are formed on the base insulating layer to cover the collector portion and the extraction conductor portion excluding a tip. The solder resist layer is formed to cover a portion of the extraction conductor portion above a bend portion.

摘要翻译： 在基底绝缘层的一个表面上形成一对矩形集电体部分和提取导体部分，每个矩形收集器部分和提取导体部分各自从各个集电部分延伸成长形状。 在基底绝缘层上形成含碳层，以覆盖除了尖端之外的集电体部分和提取导体部分。 在基底绝缘层上形成含碳层和阻焊层，以覆盖不包括尖端的集电体部分和提取导体部分。 阻焊层形成为覆盖在弯曲部分上方的提取导体部分的一部分。

公开(公告)号：US20080143906A1

公开(公告)日：2008-06-19

申请号：US11871767

申请日：2007-10-12

申请人： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

发明人： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

IPC分类号： G02F1/136 ,  H05K1/09 ,  H01L31/0224 ,  H01J1/62 ,  H01J17/04 ,  H05K3/00

CPC分类号： H01L31/022425 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01B1/02 ,  H01L27/1421 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/022466 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/1884 ,  H01L33/38 ,  H01L33/40 ,  H01L51/0021 ,  H01L51/0048 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5212 ,  H05K1/095 ,  H05K1/097 ,  H05K3/06 ,  H05K3/245 ,  H05K3/249 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  Y02E10/549 ,  Y02P70/521 ,  Y10S977/95 ,  Y10T29/49155

摘要： A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

摘要翻译： 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可嵌入矩阵中的纳米线网络。 导电层是透明的，可图案化的，并且适合作为诸如触摸屏，液晶显示器，等离子显示面板等的视觉显示装置中的透明电极。

公开(公告)号：US06989325B2

公开(公告)日：2006-01-24

申请号：US10653860

申请日：2003-09-03

申请人： Ruoh-Huey Uang ,  Yu-Hua Chen

发明人： Ruoh-Huey Uang ,  Yu-Hua Chen

IPC分类号： H01L21/44

CPC分类号： H01L24/13 ,  B82Y10/00 ,  H01L23/53276 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05111 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/1133 ,  H01L2224/13099 ,  H01L2224/13193 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/06 ,  H05K3/249 ,  H05K3/4007 ,  H05K2201/026 ,  Y10S977/882 ,  H01L2924/00014 ,  H01L2924/00

摘要： A self-assembled nanometer conductive bump and a method for fabricating the bump. In the method, a multiplicity of carbon nanotubes that are coated at two ends with chemically functional groups is first provided. A substrate that is equipped with at least one bond pad on a surface is then positioned juxtaposed to the carbon nanotubes for forming a bond between the carbon nanotubes and the metal pads facilitated by a chemical affinity existed between the functional groups and the metal pad.

摘要翻译： 一种自组装纳米导电凸块及其制造方法。 在该方法中，首先提供用化学官能团在两端涂覆的多个碳纳米管。 然后将配备有表面上的至少一个键合焊盘的衬底与碳纳米管并置放置，以形成碳纳米管与金属衬底之间的键，这通过官能团和金属衬垫之间存在的化学亲合力而促进。

公开(公告)号：US20050087363A1

公开(公告)日：2005-04-28

申请号：US10951620

申请日：2004-09-29

申请人： Norihito Tsukahara ,  Kazuhiro Nishikawa

发明人： Norihito Tsukahara ,  Kazuhiro Nishikawa

IPC分类号： H05K1/09 ,  H05K3/20 ,  H05K3/24 ,  H05K3/40

CPC分类号： H05K3/249 ,  H05K1/095 ,  H05K3/207 ,  H05K2201/035

摘要： A wiring board comprises a patterned wiring formed of electrically conductive resin composed primarily of silver and embedded into a substrate in a manner that a surface thereof is exposed above the substrate, and a covering conductor formed primarily of carbon covering the surface of the patterned wiring. The wiring board of this structure is superior in resistance to moisture absorption and water, prevents silver migration attributable to the moisture, and reduces a contact resistance in the connection between a terminal portion of the wiring board and an external apparatus.

摘要翻译： 布线板包括由主要由银构成并以其表面暴露在基板上方的方式嵌入到基板中的导电树脂形成的图案布线，以及主要由覆盖图案化布线表面的碳形成的覆盖导体。 该结构的布线基板具有优异的耐吸湿性和防水性，防止由于水分引起的银迁移，并且降低了布线板的端子部分与外部设备之间的连接中的接触电阻。

公开(公告)号：US08094247B2

公开(公告)日：2012-01-10

申请号：US11871767

申请日：2007-10-12

申请人： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

发明人： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

IPC分类号： G02F1/1335

CPC分类号： H01L31/022425 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01B1/02 ,  H01L27/1421 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/022466 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/1884 ,  H01L33/38 ,  H01L33/40 ,  H01L51/0021 ,  H01L51/0048 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5212 ,  H05K1/095 ,  H05K1/097 ,  H05K3/06 ,  H05K3/245 ,  H05K3/249 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  Y02E10/549 ,  Y02P70/521 ,  Y10S977/95 ,  Y10T29/49155

摘要： A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

公开(公告)号：US20110281024A1

公开(公告)日：2011-11-17

申请号：US12944205

申请日：2010-11-11

申请人： John C. Crumpton ,  Robert Paul Waldrop

发明人： John C. Crumpton ,  Robert Paul Waldrop

IPC分类号： B05D5/12 ,  B05D3/00 ,  B05D1/38

CPC分类号： C23C28/322 ,  C23C28/34 ,  H05K1/095 ,  H05K3/245 ,  H05K3/249 ,  H05K3/4685 ,  H05K2201/0769

摘要： Disclosed is the use of carbon layers as barriers to prevent silver migration in circuitry crossovers, either over a bottom circuitry layer and/or beneath subsequent circuit layers.

摘要翻译： 公开了使用碳层作为屏障来防止在电路交叉中的银迁移，或者在底部电路层上和/或在后面的电路层之下。