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1.发明申请METHOD FOR PREVENTING OR REDUCING SILVER MIGRATION IN THE CROSSOVER AREAS OF A MEMBRANE TOUCH SWITCH 审中-公开用于防止或减少膜触摸开关的交叉区域中的银移动的方法公开(公告)号：US20110281024A1
公开(公告)日：2011-11-17
申请号：US12944205
申请日：2010-11-11
CPC分类号： C23C28/322 , C23C28/34 , H05K1/095 , H05K3/245 , H05K3/249 , H05K3/4685 , H05K2201/0769
摘要： Disclosed is the use of carbon layers as barriers to prevent silver migration in circuitry crossovers, either over a bottom circuitry layer and/or beneath subsequent circuit layers.
摘要翻译： 公开了使用碳层作为屏障来防止在电路交叉中的银迁移，或者在底部电路层上和/或在后面的电路层之下。
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2.发明授权公开(公告)号：US08562808B2
公开(公告)日：2013-10-22
申请号：US12884517
申请日：2010-09-17
摘要： The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium consisting of (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent. The invention is further directed to novel method(s) of circuitry formation on printed wiring board constructions.
摘要翻译： 本发明涉及聚合物厚膜银组合物，其包含：（a）导电银片和（b）由（1）丙烯酸有机聚合物粘合剂组成的有机介质; 和（2）有机溶剂。 组合物可以在足以除去所有溶剂的时间和能量下进行处理。 本发明还涉及印刷电路板结构上电路形成的新颖方法。
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3.发明申请公开(公告)号：US20110068011A1
公开(公告)日：2011-03-24
申请号：US12884517
申请日：2010-09-17
摘要： The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium comprising (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent.The invention is further directed to novel method(s) of circuitry formation on printed wiring board constructions.
摘要翻译： 本发明涉及聚合物厚膜银组合物，其包含：（a）导电银片和（b）有机介质，其包含（1）丙烯酸有机聚合物粘合剂; 和（2）有机溶剂。 组合物可以在足以除去所有溶剂的时间和能量下进行处理。 本发明还涉及印刷电路板结构上电路形成的新颖方法。
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公开(公告)号：US20140099499A1
公开(公告)日：2014-04-10
申请号：US13648710
申请日：2012-10-10
CPC分类号： H05K3/1283 , B32B2037/243 , B32B2038/168 , B32B2457/00 , H01B1/22 , H05K1/095 , H05K3/1216 , H05K2201/0245 , H05K2203/0278 , H05K2203/0425 , Y10T428/256
摘要： This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
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公开(公告)号：US08696860B1
公开(公告)日：2014-04-15
申请号：US13648710
申请日：2012-10-10
CPC分类号： H05K3/1283 , B32B2037/243 , B32B2038/168 , B32B2457/00 , H01B1/22 , H05K1/095 , H05K3/1216 , H05K2201/0245 , H05K2203/0278 , H05K2203/0425 , Y10T428/256
摘要： This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
摘要翻译： 本发明提供了一种使用聚合物厚膜导体组合物在电路中形成电导体的方法，该方法使沉积的厚膜导体组合物层压。 本发明还提供了一种降低由聚合物厚膜导体组合物形成的电导体的电阻的方法，该方法包括使电导体层压的步骤。 本发明还提供了包含由这些方法制成的电导体的装置。
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