公开(公告)号：US12028987B2

公开(公告)日：2024-07-02

申请号：US17734031

申请日：2022-04-30

Applicant: Pac Tech—Packaging Technologies GmbH

Inventor： Matthias Fettke ,  Andrej Kolbasow ,  Nico Lange

IPC: B23K1/00 ,  B23K31/00 ,  B23K31/12 ,  H05K3/34 ,  B23K101/42

CPC classification number: H05K3/3468 ,  B23K1/0016 ,  B23K31/125 ,  H05K3/3415 ,  H05K3/3447 ,  B23K2101/42 ,  H05K2203/041 ,  H05K2203/086 ,  H05K2203/108 ,  H05K2203/111 ,  H05K2203/163

Abstract: A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

公开(公告)号：US09986638B2

公开(公告)日：2018-05-29

申请号：US14389574

申请日：2013-03-29

Applicant: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY

Inventor： Sun Ho Jeong ,  Young Min Choi ,  Beyong Hwang Ryu ,  Yeong Hui Seo ,  Su Hyun Lee

IPC: H05K1/00 ,  H05K1/09 ,  B05D3/02 ,  B05D5/12 ,  H05K3/12

CPC classification number: H05K1/097 ,  B05D3/02 ,  B05D3/0254 ,  B05D5/12 ,  H05K3/1275 ,  H05K3/1283 ,  H05K2203/086

Abstract: Provided is a method of manufacturing a conductive metal thin film, the method including: a) heating and stirring a first solution containing a metal precursor, acid, amine, and a reducing agent to synthesize metal nano-particles on which formation of a surface oxide film is suppressed; b) dispersing the metal nano-particles synthesize in step a) in a non-aqueous solvent to prepare a conductive ink composition; c) applying the conductive ink composition onto an insulating substrate; and d) heat-treating the insulating substrate applied with the ink composition to form a conductive metal thin film. With the method of manufacturing a conductive metal thin film according to the present invention, large area conductive thin film may be manufactured as compared with the existing conductive ink composition based on noble metal nano-particles. In addition, the conductive metal thin film having excellent conductivity may be manufactured by suppressing a surface oxide film from being formed.

公开(公告)号：US09240256B2

公开(公告)日：2016-01-19

申请号：US13576014

申请日：2010-04-23

Applicant: Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

Inventor： Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

IPC: C09J11/06 ,  H01B1/02 ,  B22F1/00 ,  B82Y30/00 ,  H01L23/00 ,  H05K3/32 ,  B22F7/06 ,  B22F9/24 ,  C22C5/06 ,  H05K3/34

CPC classification number: H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2101/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/3512

Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.

Abstract translation: 提供了使用金属纳米粒子形成接合产物的方法。 更具体地，提供了含有即使在惰性气氛中也可形成金属相的助熔剂成分的糊剂。 通过使用该糊状物，可以在不进行常规使用的加压的情况下，在低温下在惰性气氛例如氮气气氛中提供可以提供实际可接受的粘合强度的接合材料。 糊状物是构成为包含平均一次粒径为1〜200nm的银纳米粒子并涂布有碳原子数为8以下的有机材料的接合材料。 具有至少两个羧基的助熔剂组分; 和分散介质。 使用这种粘合材料即使在300℃或更低的温度也可以粘合材料。

公开(公告)号：US20140027495A1

公开(公告)日：2014-01-30

申请号：US14039552

申请日：2013-09-27

Applicant: AIR PRODUCTS AND CHEMICALS INC.

Inventor： Gregory Khosrov Arslanian ,  Jerry Wu ,  Victor Wang

IPC: B23K3/08

CPC classification number: B23K3/082 ,  B23K1/0016 ,  B23K1/085 ,  B23K1/203 ,  B23K3/0653 ,  B23K3/08 ,  B23K2101/42 ,  H05K3/3468 ,  H05K2203/044 ,  H05K2203/081 ,  H05K2203/086

Abstract: Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an apparatus for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a base comprising an interior volume in fluid communication with an inerting gas source, a tube having an interior volume and comprising one or more perforations for the flow of inerting gas therethrough, and one or more support legs comprising an interior volume in fluid communication with the interior volume of the base and the interior volume of the tube, wherein the one or more support legs extend vertically upward from the base and elevate the tube above the surface of molten solder contained within a solder reservoir, and wherein the inerting gas travels through the base, upward through the one or more support legs, into the interior volume of the tube, and out through the one or more perforations in the tube.

Abstract translation: 这里描述了一种用于在对工件进行焊接的过程中提供惰性气体的装置和方法。 在一个方面，提供了一种用于在工件焊接期间将惰性气体提供到焊料储存器上方的气氛中的装置，包括：基部，包括与惰性气体源流体连通的内部容积，管体具有内部体积 并且包括一个或多个用于使惰性气体流过其中的穿孔，以及一个或多个支撑腿，其包括与所述底座的内部容积和所述管的内部容积流体连通的内部容积，其中所述一个或多个支撑腿延伸 从底部向上垂直向上并且将管升高到容纳在焊料储存器内的熔融焊料的表面上方，并且其中惰性气体通过基体向上穿过一个或多个支撑腿进入管的内部容积，并且出口 通过管中的一个或多个穿孔。

公开(公告)号：US07984545B2

公开(公告)日：2011-07-26

申请号：US12220746

申请日：2008-07-25

Applicant: Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tamaki Ushimoto

Inventor： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tamaki Ushimoto

IPC: G11B5/127 ,  H04R31/00

CPC classification number: B23K20/007 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/041 ,  H05K2203/086 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/49021 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/49169 ,  Y10T29/5313

Abstract: Approaches for helping to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. Inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.

Abstract translation: 有助于减少回流焊接头部滑块和悬架的连接端子所需的非活性气体量的方法。 非活性气体从回流装置的喷嘴吹向磁头滑块和悬架的互连接头。 磁头滑块被粘合到万向节舌头上。 喷嘴包括惰性气体通过的管道和装配在管的喷射出口中的多孔构件。 将多孔构件放置在头部滑块附近实现有效地减少焊球周围的氧浓度。

公开(公告)号：US20100196681A1

公开(公告)日：2010-08-05

申请号：US12503491

申请日：2009-07-15

Applicant: Young Ah SONG ,  Young Chang Joo ,  Ji Hoon Lee ,  Seol Min Yi ,  Jae Woo Joung ,  Sung Il Oh ,  Tae Hoon Kim ,  In Young Kim

Inventor： Young Ah SONG ,  Young Chang Joo ,  Ji Hoon Lee ,  Seol Min Yi ,  Jae Woo Joung ,  Sung Il Oh ,  Tae Hoon Kim ,  In Young Kim

IPC: B32B15/02 ,  B05D5/12

CPC classification number: H05K3/1283 ,  H05K2201/0257 ,  H05K2203/085 ,  H05K2203/086 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T428/24917

Abstract: Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.

Abstract translation: 公开了一种形成金属布线和使用其形成的金属布线的方法。 该方法包括使用包括金属纳米颗粒的油墨组合物和保持金属纳米颗粒的分散体的分散剂进行印刷布线，进行在真空或惰性气氛下烧结布线以抑制晶粒生长的第一煅烧工艺，并进行第二次烧制 布线与真空或惰性气体释放，加速晶粒生长。 在金属纳米粒子的烧制过程中，在金属纳米粒子的生长力高的温度下快速除去能够诱导金属纳米粒子生长的分散剂，形成金属配线的方法可以引起异常的晶粒生长。 因此，金属布线具有含有平均粒径大的金属粒子的粗粒结构，能够提高其电气和机械特性。

公开(公告)号：US20090025205A1

公开(公告)日：2009-01-29

申请号：US12220746

申请日：2008-07-25

Applicant: Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tamaki Ushimoto

Inventor： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tamaki Ushimoto

IPC: G11B5/127

CPC classification number: B23K20/007 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/041 ,  H05K2203/086 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/49021 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/49169 ,  Y10T29/5313

Abstract: Embodiments of the present invention help to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. In an embodiment of the present invention, inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.

Abstract translation: 本发明的实施例有助于减少回流到磁头滑块和悬架的互连连接端子所需的非活性气体的量。 在本发明的一个实施方案中，惰性气体从回流装置的喷嘴吹向磁头滑块和悬架的互连接头。 磁头滑块被粘合到万向节舌头上。 喷嘴包括惰性气体通过的管道和装配在管的喷射出口中的多孔构件。 将多孔构件放置在头部滑块附近实现有效地减少焊球周围的氧浓度。

公开(公告)号：US20080178463A1

公开(公告)日：2008-07-31

申请号：US12077434

申请日：2008-03-19

Applicant: Akihiko Okubora

Inventor： Akihiko Okubora

IPC: H05K3/36 ,  H05K3/10

CPC classification number: H01L25/165 ,  B81C1/0023 ,  H01L23/04 ,  H01L23/10 ,  H01L23/552 ,  H01L23/564 ,  H01L24/48 ,  H01L24/81 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/0272 ,  H05K1/16 ,  H05K1/186 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0179 ,  H05K2201/09072 ,  H05K2201/09981 ,  H05K2201/10053 ,  H05K2203/061 ,  H05K2203/086 ,  H05K2203/1147 ,  H05K2203/1178 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate (11) in which conductive pattern or patterns are formed on the principal surface thereof and one element body (7) or more are mounted, and a second organic substrate (12) in which a recessed portion (22) is formed in correspondence with the area where the element body or bodies (7) are mounted at the connecting surface to the first organic substrate (11). In the state where the second organic substrate (12) is connected to the first organic substrate (11), an element body accommodating portion (24) which seals the element body or bodies (7) is constituted by the recessed portion (22), wherein the element body accommodating portion (24) is adapted so that moisture resistance characteristic and oxidation resistance characteristic are maintained.

Abstract translation: 本发明涉及一种用于无线通信模块的高频模块，并且包括：第一有机基板（11），其主体表面上形成有导电图案或图案，并且安装有一个元件体（7）以上; 以及第二有机基板（12），其中，与所述元件体（7）安装在与所述第一有机基板（11）的连接面处的区域对应地形成有凹部（22）。 在第二有机基板（12）与第一有机基板（11）连接的状态下，密封元件主体（7）的元件主体容纳部（24）由凹部（22）构成， 其特征在于，所述元件主体容纳部（24）适于保持耐湿性和抗氧化特性。

公开(公告)号：US20080073413A1

公开(公告)日：2008-03-27

申请号：US11854222

申请日：2007-09-12

Applicant: Toru MIZUNO ,  Kazuaki TAKANUKI ,  Tatsuya WAGOU

Inventor： Toru MIZUNO ,  Kazuaki TAKANUKI ,  Tatsuya WAGOU

IPC: B23K31/02 ,  B23K37/06

CPC classification number: B23K3/0623 ,  B23K2101/38 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/086

Abstract: In a conductive material supply apparatus that can connect a small slider electrode and a wiring electrode on a flexure in a miniaturized magnetic head, electrically conductive material is supplied, with the aid of flow of nitrogen gas that is pressurized to a first pressure, into the interior of a nozzle assembly that defines an interior space having a nozzle orifice through which the electrically conductive material can pass. After the electrically conductive material has been supplied, the flow of the nitrogen gas is stopped, and the interior space is temporarily brought into communication with the exterior space thereby decreasing the pressure in the interior space. Thereafter, nitrogen gas maintained at a second pressure that is designed to be lower than the first pressure is supplied to the interior space, whereby the electrically conductive material is ejected to the exterior from the nozzle orifice by the effect of the second pressure.

Abstract translation: 在小型磁头中的弯曲部上可以连接小滑块电极和布线电极的导电材料供给装置中，借助于加压到第一压力的氮气流，供给导电材料， 喷嘴组件的内部限定具有喷嘴孔的内部空间，导电材料可以通过该喷嘴孔通过。 在提供导电材料之后，停止氮气的流动，并且内部空间暂时与外部空间连通，从而减小内部空间中的压力。 此后，保持在设计为低于第一压力的第二压力的氮气被供应到内部空间，由此导电材料通过第二压力从喷嘴孔喷射到外部。

公开(公告)号：US20050288392A1

公开(公告)日：2005-12-29

申请号：US10519765

申请日：2003-06-19

Applicant: Akihiko Okubora

Inventor： Akihiko Okubora

IPC: H01L23/12 ,  H01L21/60 ,  H01L21/607 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L25/00 ,  H01L25/16 ,  H01P1/12 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  C09J4/00 ,  C09J101/00

CPC classification number: H01L25/165 ,  B81C1/0023 ,  H01L23/04 ,  H01L23/10 ,  H01L23/552 ,  H01L23/564 ,  H01L24/48 ,  H01L24/81 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/0272 ,  H05K1/16 ,  H05K1/186 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0179 ,  H05K2201/09072 ,  H05K2201/09981 ,  H05K2201/10053 ,  H05K2203/061 ,  H05K2203/086 ,  H05K2203/1147 ,  H05K2203/1178 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate (11) in which conductive pattern or patterns are formed on the principal surface thereof and one element body (7) or more are mounted, and a second organic substrate (12) in which a recessed portion (22) is formed in correspondence with the area where the element body or bodies (7) are mounted at the connecting surface to the first organic substrate (11). In the state where the second organic substrate (12) is connected to the first organic substrate (11), an element body accommodating portion (24) which seals the element body or bodies (7) is constituted by the recessed portion (22), wherein the element body accommodating portion (24) is adapted so that moisture resistance characteristic and oxidation resistance characteristic are maintained.

Abstract translation: 本发明涉及一种用于无线通信模块的高频模块，并且包括：第一有机基板（11），其主体表面上形成有导电图案或图案，并且安装有一个元件体（7）以上; 以及第二有机基板（12），其中，与所述元件体（7）安装在与所述第一有机基板（11）的连接面处的区域对应地形成有凹部（22）。 在第二有机基板（12）与第一有机基板（11）连接的状态下，密封元件主体（7）的元件主体容纳部（24）由凹部（22）构成， 其特征在于，所述元件主体容纳部（24）适于保持耐湿性和抗氧化特性。