公开(公告)号：US08499924B2

公开(公告)日：2013-08-06

申请号：US13174001

申请日：2011-06-30

Applicant: Masayoshi Kobayashi ,  Toru Mizuno

Inventor： Masayoshi Kobayashi ,  Toru Mizuno

IPC: B65G29/00

CPC classification number: G01N21/95 ,  G01N21/8803 ,  G01R31/013

Abstract: A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.

Abstract translation: 一种用于稳定在两个盘上承载的芯片部件的瞄准线的方法和系统，用于稳定两个盘之间的芯片部件的传递，并且改善和稳定芯片部件的视觉检查中的检查精度。 这通过采用用于承载芯片部件的机构来实现，同时将其支撑在第一旋转盘的水平面上，然后在将其保持在第二旋转盘的垂直平面上的同时承载芯片部件。 当芯片部件承载在第一旋转盘上时，芯片部件的上表面和一个侧面由第一和第二相机成像。 当芯片部件承载在第二旋转盘上时，芯片部件的下表面和另一侧面由第三和第四相机成像。

公开(公告)号：US20120062909A1

公开(公告)日：2012-03-15

申请号：US13233944

申请日：2011-09-15

Applicant: Masashi KUNO ,  Hirotoshi MAEHIRA ,  Sadaaki MIYAZAKI ,  Toru MIZUNO

Inventor： Masashi KUNO ,  Hirotoshi MAEHIRA ,  Sadaaki MIYAZAKI ,  Toru MIZUNO

IPC: G06K15/10

CPC classification number: G06F3/1215 ,  B41J2/2052 ,  G06F3/1232 ,  G06F3/1247 ,  G06F3/1285 ,  G06K15/105

Abstract: An image processing device may perform an analysis by utilizing target data representing a target image of a print target, so as to select, from among a plurality of types of print orders for printing the target image, one type of print order in which a print of the target image is presumed to be completed in the shortest time period. In each of the plurality of types of print orders, an area in the target image to be printed by the initial main scanning of the print head may be mutually different. The image processing device may create print data by utilizing the target data for causing a print performing unit to perform the print of the target image according to the selected one type of print order, and supply the print data to the print performing unit.

Abstract translation: 图像处理设备可以通过利用表示打印目标的目标图像的目标数据来执行分析，以从用于打印目标图像的多种类型的打印命令中选择一种打印顺序，其中打印 假定目标图像在最短时间内完成。 在多种类型的打印指令中的每一种中，要由打印头的初始主扫描打印的目标图像中的区域可以是相互不同的。 图像处理装置可以通过利用用于使打印执行单元根据所选择的一种打印顺序执行目标图像的打印的目标数据来创建打印数据，并将打印数据提供给打印执行单元。

公开(公告)号：US07987968B2

公开(公告)日：2011-08-02

申请号：US11578062

申请日：2004-09-07

Applicant: Masayoshi Kobayashi ,  Toru Mizuno

Inventor： Masayoshi Kobayashi ,  Toru Mizuno

IPC: B65G29/00

CPC classification number: G01N21/95 ,  G01N21/8803 ,  G01R31/013

Abstract: A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.

Abstract translation: 一种用于稳定在两个盘上承载的芯片部件的瞄准线的方法和系统，用于稳定两个盘之间的芯片部件的传递，并且改善和稳定芯片部件的视觉检查中的检查精度。 这通过采用用于承载芯片部件的机构来实现，同时将其支撑在第一旋转盘的水平面上，然后在将其保持在第二旋转盘的垂直平面上的同时承载芯片部件。 当芯片部件承载在第一旋转盘上时，芯片部件的上表面和一个侧面由第一和第二相机成像。 当芯片部件承载在第二旋转盘上时，芯片部件的下表面和另一侧面由第三和第四相机成像。

公开(公告)号：US07276673B2

公开(公告)日：2007-10-02

申请号：US10947294

申请日：2004-09-23

Applicant: Osamu Shindo ,  Toru Mizuno ,  Satoshi Yamaguchi

Inventor： Osamu Shindo ,  Toru Mizuno ,  Satoshi Yamaguchi

IPC: B23K26/00

CPC classification number: H05K3/3494 ,  B23K1/0056 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K3/3442 ,  H05K2203/041 ,  H05K2203/107

Abstract: A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.

Abstract translation: 提供焊料接合方法和焊接接合装置，其中焊料熔化，并且通过向设置有电极部分的区域的内侧照射激光来进行电极部分的加热，使得电极部分之间的温度差 并且熔化的焊料更小以改善焊料的润湿性并增加焊接可靠性。 焊接接合方法和焊接接合装置通过熔化焊料进行形成在待接合物体上的电极部分的接合。 在熔融之前将焊料供应到电极部分之后，激光照射到焊料和焊料周围的电极部分。 焊料熔化，电极部分被加热。 因此焊料相对于电极部的润湿性提高，可以提高电极部之间的电连接的可靠性。

公开(公告)号：US20070205084A1

公开(公告)日：2007-09-06

申请号：US11578062

申请日：2004-09-07

Applicant: Masayoshi Kobayashi ,  Toru Mizuno

Inventor： Masayoshi Kobayashi ,  Toru Mizuno

IPC: B65G29/00

CPC classification number: G01N21/95 ,  G01N21/8803 ,  G01R31/013

Abstract: A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.

Abstract translation: 一种用于稳定在两个盘上承载的芯片部件的瞄准线的方法和系统，用于稳定两个盘之间的芯片部件的传递，并且改善和稳定芯片部件的视觉检查中的检查精度。 这通过采用用于承载芯片部件的机构来实现，同时将其支撑在第一旋转盘的水平面上，然后在将其保持在第二旋转盘的垂直平面上的同时承载芯片部件。 当芯片部件承载在第一旋转盘上时，芯片部件的上表面和一个侧面由第一和第二相机成像。 当芯片部件承载在第二旋转盘上时，芯片部件的下表面和另一侧面由第三和第四相机成像。

公开(公告)号：US07164097B2

公开(公告)日：2007-01-16

申请号：US10936747

申请日：2004-09-09

Applicant: Osamu Shindo ,  Toru Mizuno ,  Youichi Andoh ,  Satoshi Yamaguchi

Inventor： Osamu Shindo ,  Toru Mizuno ,  Youichi Andoh ,  Satoshi Yamaguchi

IPC: B23K1/005

CPC classification number: B23K1/0056 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/36 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/742 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/107

Abstract: Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.

Abstract translation: 提供了一种焊球接合方法和焊球接合装置，用于通过熔化焊球进行形成在待接合物体上的多个电极部分的接合。 通过使用跟随待接合物体的电极部分的多个吸嘴来吸引焊球，并将其输送到电极部分上。 然后，在吸引喷嘴上方的激光照射部分沿吸引喷嘴排列的方向移动，同时通过使用激光照射部分通过吸嘴的吸入口的激光照射焊球。 因此，可以仅使用单个激光照射部来熔化电极部上的多个焊球。

公开(公告)号：US07131720B2

公开(公告)日：2006-11-07

申请号：US10764459

申请日：2004-01-27

Applicant: Toru Mizuno ,  Masahiko Sasa

Inventor： Toru Mizuno ,  Masahiko Sasa

IPC: B41J2/19 ,  B41J2/175

CPC classification number: B41J2/16532

Abstract: In a maintenance method of an inkjet printer comprising an air discharge device which discharges air accumulated in ink supply paths with pressurized air and an ink vacuum device which vacuums ink from an inkjet head, the pressurized air is in a high pressure mode when the air discharge device is used. The pressurized air is in a low pressure mode when the ink vacuum device is used. The driving time and the rotational speed of a drive motor which drives an air pump are controlled according to the capability and the ambient temperature of the air pump which generates the pressurized air.

Abstract translation: 在一种喷墨打印机的维护方法中，所述喷墨打印机包括：用加压空气排出在供墨路径中积聚的空气的排气装置和从喷墨头抽真空墨水的墨水真空装置，当空气排出时，加压空气处于高压模式 使用设备。 当使用墨水真空装置时，加压空气处于低压模式。 根据产生加压空气的气泵的能力和环境温度来控制驱动空气泵的驱动马达的驱动时间和转速。

公开(公告)号：US07128255B2

公开(公告)日：2006-10-31

申请号：US10445027

申请日：2003-05-27

Applicant: Toru Mizuno ,  Kouji Tanaka ,  Satoshi Yamaguchi

Inventor： Toru Mizuno ,  Kouji Tanaka ,  Satoshi Yamaguchi

IPC: B23K1/06

CPC classification number: G11B5/4853 ,  G11B5/4826 ,  Y10T29/49027 ,  Y10T29/4903

Abstract: The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.

公开(公告)号：US06751061B2

公开(公告)日：2004-06-15

申请号：US10417168

申请日：2003-04-17

Applicant: Toru Mizuno ,  Kouji Tanaka ,  Satoshi Yamaguchi

Inventor： Toru Mizuno ,  Kouji Tanaka ,  Satoshi Yamaguchi

IPC: G11B560

CPC classification number: G11B5/4853 ,  G11B5/4826 ,  Y10T29/49027 ,  Y10T29/4903

Abstract: The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.

Abstract translation: 本发明提供一种磁头结构，连接方法和连接装置，通过该磁头结构，连接方法和连接装置，可以通过使用背负式系统的磁头中的挠性件上的芯电极和基板接合面之间进行优良的电连接。 为了达到感兴趣的目的，在本发明中，在芯部和挠曲部之间设置微调致动器， 在所述芯部设置有从所述挠曲部观察时从所述微调节致动器突出的突出部; 在所述弯曲部上对应于所述突出部设置孔， 只有芯部由通过孔部分提供的支撑部分和夹紧销固定，而不对微调致动器施加任何负载; 并且在保持该固定状态的同时，用导线将电极和基板焊盘彼此接合。

公开(公告)号：US06438444B1

公开(公告)日：2002-08-20

申请号：US08983449

申请日：1998-01-09

Applicant: Toru Mizuno ,  Masahiko Hosokawa ,  Minoru Nakamura

Inventor： Toru Mizuno ,  Masahiko Hosokawa ,  Minoru Nakamura

IPC: G06F1900

CPC classification number: G05B19/4185 ,  G05B19/41845 ,  G05B19/41865 ,  G05B2219/31151 ,  G05B2219/31418 ,  G05B2219/31422 ,  Y02P90/16 ,  Y02P90/18 ,  Y02P90/20

Abstract: When a system is activated, a host computer reads modules from an external nonvolatile memory, reconstructs control software for a machine in accordance with a system configuration information storage file, and transfers the control software to a volatile memory of each numerical control device. Various types of modules are stored collectively in the external nonvolatile memory without duplication. In updating the control software, it is necessary only that data be updated for the software modules in the external nonvolatile memory alone.

Abstract translation: 当系统被激活时，主计算机从外部非易失性存储器中读取模块，根据系统配置信息存储文件重建机器的控制软件，并将控制软件传送到每个数字控制装置的易失性存储器。 各种类型的模块集体存储在外部非易失性存储器中，而不会重复。 在更新控制软件时，仅需要更新外部非易失性存储器中的软件模块的数据。