公开(公告)号：US20120298009A1

公开(公告)日：2012-11-29

申请号：US13576014

申请日：2010-04-23

Applicant: Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

Inventor： Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

IPC: C09J11/04 ,  B32B7/12 ,  B82Y30/00

CPC classification number: H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2101/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/3512

Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.

Abstract translation: 提供了使用金属纳米粒子形成接合产物的方法。 更具体地，提供了含有即使在惰性气氛中也可形成金属相的助熔剂成分的糊剂。 通过使用该糊状物，可以在不进行常规使用的加压的情况下，在低温下在惰性气氛例如氮气气氛中提供可以提供实际可接受的粘合强度的接合材料。 糊状物是构成为包含平均一次粒径为1〜200nm的银纳米粒子并涂布有碳原子数为8以下的有机材料的接合材料。 具有至少两个羧基的助熔剂组分; 和分散介质。 使用这种粘合材料即使在300℃或更低的温度也可以粘合材料。

公开(公告)号：US09240256B2

公开(公告)日：2016-01-19

申请号：US13576014

申请日：2010-04-23

Applicant: Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

Inventor： Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

IPC: C09J11/06 ,  H01B1/02 ,  B22F1/00 ,  B82Y30/00 ,  H01L23/00 ,  H05K3/32 ,  B22F7/06 ,  B22F9/24 ,  C22C5/06 ,  H05K3/34

CPC classification number: H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2101/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/3512

Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.

Abstract translation: 提供了使用金属纳米粒子形成接合产物的方法。 更具体地，提供了含有即使在惰性气氛中也可形成金属相的助熔剂成分的糊剂。 通过使用该糊状物，可以在不进行常规使用的加压的情况下，在低温下在惰性气氛例如氮气气氛中提供可以提供实际可接受的粘合强度的接合材料。 糊状物是构成为包含平均一次粒径为1〜200nm的银纳米粒子并涂布有碳原子数为8以下的有机材料的接合材料。 具有至少两个羧基的助熔剂组分; 和分散介质。 使用这种粘合材料即使在300℃或更低的温度也可以粘合材料。

公开(公告)号：US08641929B2

公开(公告)日：2014-02-04

申请号：US13702718

申请日：2011-06-10

Applicant: Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

Inventor： Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

IPC: H01B1/02 ,  B41J2/16 ,  C04B28/36

CPC classification number: C09J1/00 ,  B22F1/0018 ,  B22F1/0062 ,  B22F2303/10 ,  B22F2998/00 ,  B32B37/12 ,  B82Y30/00 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K3/32 ,  H05K3/3463 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/1131 ,  B22F2303/01 ,  B22F2301/255 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/2929

Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.

Abstract translation: 提供一种能够在氮气中形成接合体的接合材料，并且在加压或高温条件下，在不进行热处理的情况下，可以显示接合强度以抵抗实际应用，同时减少样品之间的接合波动。 接合材料包括：平均一次粒径为1〜200nm的银纳米粒子，并涂布有碳原子数为8以下的有机物质; 沸点为230℃以上的分散介质; 以及包含具有至少两个羧基的有机物质的助熔剂成分。 特别地，优选组合使用银纳米粒子和亚微米银粒子。

公开(公告)号：US20130081759A1

公开(公告)日：2013-04-04

申请号：US13702718

申请日：2011-06-10

Applicant: Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

Inventor： Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

IPC: C09J1/00 ,  B32B37/12

CPC classification number: C09J1/00 ,  B22F1/0018 ,  B22F1/0062 ,  B22F2303/10 ,  B22F2998/00 ,  B32B37/12 ,  B82Y30/00 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K3/32 ,  H05K3/3463 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/1131 ,  B22F2303/01 ,  B22F2301/255 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/2929

Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.

Abstract translation: 提供一种能够在氮气中形成接合体的接合材料，并且在加压或高温条件下，在不进行热处理的情况下，可以显示接合强度以抵抗实际应用，同时减少样品之间的接合波动。 接合材料包括：平均一次粒径为1〜200nm的银纳米粒子，并涂布有碳原子数为8以下的有机物质; 沸点为230℃以上的分散介质; 以及包含具有至少两个羧基的有机物质的助熔剂成分。 特别地，优选组合使用银纳米粒子和亚微米银粒子。