公开(公告)号：US20240213193A1

公开(公告)日：2024-06-27

申请号：US18594703

申请日：2024-03-04

申请人： Infineon Technologies Austria AG

发明人： Clemens Roessler ,  Silke Auchter ,  Martin Gruber ,  Johanna Elisabeth Roessler

IPC分类号： H01L23/00

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L2224/0212 ,  H01L2224/0239 ,  H01L2224/03552

摘要： A device for trapping ions includes: a substrate having a metal layer structure; and at least one ion trap configured to trap ions in a space over the substrate. The metal layer structure is a multi-layer metal structure that includes: a top metal layer having one or more electrodes forming part of the at least one ion trap; a redistribution metal layer having wiring for connecting the one or more electrodes; a first insulating layer arranged between the top metal layer and the redistribution layer and having one or more voids; and one or more connection elements arranged in the one or more voids that connect the wiring from the redistribution metal layer with the one or more electrodes in the top metal layer.

公开(公告)号：US20150318246A1

公开(公告)日：2015-11-05

申请号：US14473375

申请日：2014-08-29

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chen-Hua Yu ,  Ming-Fa Chen ,  Sung-Feng Yeh

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L25/065 ,  H01L23/00 ,  H01L21/768

CPC分类号： H01L24/89 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/76805 ,  H01L21/76807 ,  H01L21/76831 ,  H01L21/76843 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/53209 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/06 ,  H01L24/17 ,  H01L24/19 ,  H01L24/82 ,  H01L25/00 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0212 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/04105 ,  H01L2224/11 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/8019 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/92244 ,  H01L2225/06548 ,  H01L2924/01029 ,  H01L2924/05442 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2924/14 ,  H01L2924/00

摘要： A package according to an embodiment includes a first device package and a fan-out RDL disposed over the first device package. The fan-out RDL extends past edges of the first device package. The first device package comprises a first die having a first redistribution layer (RDL) disposed on a first substrate, a second die having a second RDL disposed on a second substrate, an isolation material over the first die and extending along sidewalls of the second die, and a conductive via. The first RDL is bonded to the second RDL, and the first die and the second die comprise different lateral dimensions. At least a portion of the conductive via extends from a top surface of the isolation material to contact a first conductive element in the first RDL.

摘要翻译： 根据实施例的包装包括设置在第一装置包装上的第一装置包装和扇出RDL。 扇出的RDL延伸到第一个器件封装的边缘。 第一器件封装包括具有设置在第一衬底上的第一再分布层（RDL）的第一管芯，具有设置在第二衬底上的第二RDL的第二管芯，在第一管芯上方的隔离材料，并沿着第二管芯的侧壁延伸 ，和导电通孔。 第一RDL被结合到第二RDL，并且第一模具和第二模具包括不同的横向尺寸。 导电通孔的至少一部分从隔离材料的顶表面延伸以接触第一RDL中的第一导电元件。

公开(公告)号：US20150303153A1

公开(公告)日：2015-10-22

申请号：US14687057

申请日：2015-04-15

申请人： Seiko Epson Corporation

发明人： Satoru TANAKA

IPC分类号： H01L23/00 ,  B81B7/00 ,  B81B3/00 ,  H01L23/34

CPC分类号： B81B3/0072 ,  B81B3/0018 ,  B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0118 ,  B81B2207/097 ,  B81C1/00158 ,  B81C2203/0109 ,  G01C19/5656 ,  G01L9/0042 ,  H01L21/76205 ,  H01L23/528 ,  H01L24/02 ,  H01L2224/0212 ,  H01L2924/15 ,  H01L2924/351

摘要： According to an aspect of the invention, a functional element includes a substrate which is provided with a concave section; a stationary section connected to a wall section that defines the concave section of the substrate; an elastic section which extends from the stationary section and is capable of stretching and contracting in a first axis direction; a movable body connected to the elastic section; a movable electrode section which extends from the movable body. The concave section includes a cutout section which is provided on the wall section. The stationary section includes an overlap section which is spaced with the substrate, and overlaps the concave section when seen in a plan view. At least a portion of the overlap section overlaps the cutout section when seen in the plan view, and the elastic section extends from the overlap section.

摘要翻译： 根据本发明的一个方面，功能元件包括设置有凹部的基板; 连接到限定所述基板的凹部的壁部的固定部; 弹性部分，其从固定部分延伸并且能够在第一轴线方向上伸缩; 连接到所述弹性部分的可移动体; 从可动体延伸的可动电极部。 凹部包括设置在壁部上的切口部。 固定部分包括与基板间隔开的重叠部分，并且在平面图中看时与凹部重叠。 当在平面图中看时，重叠部分的至少一部分与切口部分重叠，并且弹性部分从重叠部分延伸。

公开(公告)号：US20140054800A1

公开(公告)日：2014-02-27

申请号：US13590218

申请日：2012-08-21

申请人： Johann Gatterbauer ,  Bernhard Weidgans ,  Joerg Busch

发明人： Johann Gatterbauer ,  Bernhard Weidgans ,  Joerg Busch

IPC分类号： H01L21/768 ,  H01L23/485

CPC分类号： H01L24/05 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/498 ,  H01L24/02 ,  H01L24/03 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/02 ,  H01L2224/0212 ,  H01L2224/02126 ,  H01L2224/02166 ,  H01L2224/0239 ,  H01L2224/03019 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0348 ,  H01L2224/0361 ,  H01L2224/0381 ,  H01L2224/0382 ,  H01L2224/03821 ,  H01L2224/03822 ,  H01L2224/03825 ,  H01L2224/03827 ,  H01L2224/03831 ,  H01L2224/03848 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05576 ,  H01L2224/05578 ,  H01L2224/056 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/0569 ,  H01L2224/05693 ,  H01L2224/12105 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48135 ,  H01L2224/48151 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48669 ,  H01L2224/4869 ,  H01L2224/48693 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/48869 ,  H01L2224/4889 ,  H01L2224/48893 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3651 ,  H01L2924/3656 ,  H01L2924/381 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/45147

摘要： A method for manufacturing a metal pad structure of a die is provided, the method including: forming a metal pad between encapsulation material of the die, wherein the metal pad and the encapsulation material are separated from each other by a gap; and forming additional material in the gap to narrow at least a part of the gap.

摘要翻译： 提供了一种用于制造管芯的金属焊盘结构的方法，所述方法包括：在所述管芯的封装材料之间形成金属焊盘，其中所述金属焊盘和所述封装材料通过间隙彼此分离; 以及在所述间隙中形成附加材料以使所述间隙的至少一部分变窄。

公开(公告)号：US11984416B2

公开(公告)日：2024-05-14

申请号：US17488388

申请日：2021-09-29

申请人： Infineon Technologies Austria AG

发明人： Clemens Roessler ,  Silke Auchter ,  Martin Gruber ,  Johanna Elisabeth Roessler

IPC分类号： H01L23/00

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L2224/0212 ,  H01L2224/0239 ,  H01L2224/03552

摘要： A device for controlling trapped ions includes a first semiconductor substrate. A second semiconductor substrate is disposed over the first semiconductor substrate. At least one ion trap is configured to trap ions in a space between the first semiconductor substrate and the second semiconductor substrate. A spacer is disposed between the first semiconductor substrate and the second semiconductor substrate, the spacer including an electrical interconnect which electrically connects a first metal layer structure of the first semiconductor substrate to a second metal layer structure of the second semiconductor substrate.

公开(公告)号：US11646280B2

公开(公告)日：2023-05-09

申请号：US17517560

申请日：2021-11-02

申请人： NANYA TECHNOLOGY CORPORATION

发明人： Jung-Hsing Chien

IPC分类号： H01L23/00 ,  H01L21/02

CPC分类号： H01L24/05 ,  H01L21/02068 ,  H01L23/562 ,  H01L24/03 ,  H01L2224/0212 ,  H01L2224/02351 ,  H01L2224/03916 ,  H01L2224/05017 ,  H01L2224/05073 ,  H01L2224/05076 ,  H01L2224/05082 ,  H01L2224/05557 ,  H01L2224/05573

摘要： The present application discloses a method for fabricating a semiconductor device. The method for fabricating a semiconductor device includes providing a substrate, forming a pad structure above the substrate, and forming a top groove on a top surface of the pad structure.

公开(公告)号：US20180012862A1

公开(公告)日：2018-01-11

申请号：US15703716

申请日：2017-09-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chen-Hua Yu ,  Ming-Fa Chen ,  Sung-Feng Yeh

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L21/768 ,  H01L23/532 ,  H01L23/538 ,  H01L21/48 ,  H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L24/89 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/76805 ,  H01L21/76807 ,  H01L21/76831 ,  H01L21/76843 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/53209 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/06 ,  H01L24/17 ,  H01L24/19 ,  H01L24/82 ,  H01L25/00 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0212 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/04105 ,  H01L2224/11 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/8019 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/92244 ,  H01L2225/06548 ,  H01L2924/01029 ,  H01L2924/05442 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2924/14 ,  H01L2924/00

摘要： A method includes bonding a die to a substrate, where the substrate has a first redistribution structure, the die has a second redistribution structure, and the first redistribution structure is bonded to the second redistribution structure. A first isolation material is formed over the substrate and around the die. A first conductive via is formed, extending from a first surface of the substrate, where the first surface is opposite the second redistribution structure, the first conductive via contacting a first conductive element in the second redistribution structure. Forming the first conductive via includes patterning an opening in the substrate, extending the opening to expose the first conductive element, where extending the opening includes using a portion of a second conductive element in the first redistribution structure as an etch mask, and filling the opening with a conductive material.

公开(公告)号：US20180096958A1

公开(公告)日：2018-04-05

申请号：US15663531

申请日：2017-07-28

申请人： SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION ,  SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION

发明人： YUNLONG KONG

IPC分类号： H01L23/00 ,  H01L27/146 ,  H04N5/369

CPC分类号： H01L24/05 ,  H01L23/3171 ,  H01L24/03 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/1469 ,  H01L2224/0212 ,  H01L2224/034 ,  H01L2224/03602 ,  H01L2224/03616 ,  H01L2224/05093 ,  H01L2224/05098 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/48227 ,  H01L2224/73265 ,  H04N5/369 ,  H01L2924/00014

摘要： A method for manufacturing a bond pad structure includes providing a substrate structure including a substrate, a first metal layer on the substrate, and a passivation layer on the first metal layer, the passivation layer having an opening extending to the first metal layer; and filling the opening of the passivation layer with a second metal layer. The bond pad structure has a significantly increased thickness compared with the thickness of the exposed portion of the first metal layer in the opening, thereby ensuring wire bonding reliability and yield.

公开(公告)号：US09806055B2

公开(公告)日：2017-10-31

申请号：US15141589

申请日：2016-04-28

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chen-Hua Yu ,  Ming-Fa Chen ,  Sung-Feng Yeh

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/00 ,  H01L23/532 ,  H01L21/48 ,  H01L23/498

CPC分类号： H01L24/89 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/76805 ,  H01L21/76807 ,  H01L21/76831 ,  H01L21/76843 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/53209 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/06 ,  H01L24/17 ,  H01L24/19 ,  H01L24/82 ,  H01L25/00 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0212 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/04105 ,  H01L2224/11 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/8019 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/92244 ,  H01L2225/06548 ,  H01L2924/01029 ,  H01L2924/05442 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2924/14 ,  H01L2924/00

摘要： A package according to an embodiment includes a first device package and a fan-out RDL disposed over the first device package. The fan-out RDL extends past edges of the first device package. The first device package comprises a first die having a first redistribution layer (RDL) disposed on a first substrate, a second die having a second RDL disposed on a second substrate, an isolation material over the first die and extending along sidewalls of the second die, and a conductive via. The first RDL is bonded to the second RDL, and the first die and the second die comprise different lateral dimensions. At least a portion of the conductive via extends from a top surface of the isolation material to contact a first conductive element in the first RDL.

公开(公告)号：US09611136B2

公开(公告)日：2017-04-04

申请号：US15169368

申请日：2016-05-31

申请人： Seiko Epson Corporation

发明人： Satoru Tanaka

IPC分类号： G01L9/00 ,  H01L21/00 ,  H05K7/02 ,  G01P15/08 ,  B81B3/00 ,  H01L23/00 ,  B81C1/00 ,  H01L23/528 ,  H01L21/762 ,  B81B7/00 ,  G01C19/5656

CPC分类号： B81B3/0072 ,  B81B3/0018 ,  B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0118 ,  B81B2207/097 ,  B81C1/00158 ,  B81C2203/0109 ,  G01C19/5656 ,  G01L9/0042 ,  H01L21/76205 ,  H01L23/528 ,  H01L24/02 ,  H01L2224/0212 ,  H01L2924/15 ,  H01L2924/351

摘要： A functional element includes a substrate which is provided with a concave section; a stationary section connected to a wall section that defines the concave section of the substrate; an elastic section which extends from the stationary section and is capable of stretching and contracting in a first axis direction; a movable body connected to the elastic section; a movable electrode section which extends from the movable body. The concave section includes a cutout section which is provided on the wall section. The stationary section includes an overlap section which is spaced with the substrate, and overlaps the concave section when seen in a plan view. At least a portion of the overlap section overlaps the cutout section when seen in the plan view, and the elastic section extends from the overlap section.