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1.发明申请METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD FOR MANUFACTURING A BOND PAD OF A CHIP, A DIE ARRANGEMENT AND A CHIP ARRANGEMENT 有权制造DIE的金属片结构的方法，制造芯片的粘合剂的方法，DIE布置和芯片布置公开(公告)号：US20140054800A1
公开(公告)日：2014-02-27
申请号：US13590218
申请日：2012-08-21
IPC分类号： H01L21/768 , H01L23/485
CPC分类号： H01L24/05 , H01L23/3171 , H01L23/3192 , H01L23/498 , H01L24/02 , H01L24/03 , H01L24/19 , H01L24/20 , H01L24/45 , H01L24/48 , H01L24/81 , H01L2224/02 , H01L2224/0212 , H01L2224/02126 , H01L2224/02166 , H01L2224/0239 , H01L2224/03019 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/0348 , H01L2224/0361 , H01L2224/0381 , H01L2224/0382 , H01L2224/03821 , H01L2224/03822 , H01L2224/03825 , H01L2224/03827 , H01L2224/03831 , H01L2224/03848 , H01L2224/0401 , H01L2224/04042 , H01L2224/05547 , H01L2224/05565 , H01L2224/05569 , H01L2224/05571 , H01L2224/05576 , H01L2224/05578 , H01L2224/056 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05669 , H01L2224/0569 , H01L2224/05693 , H01L2224/12105 , H01L2224/45124 , H01L2224/45144 , H01L2224/48135 , H01L2224/48151 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48669 , H01L2224/4869 , H01L2224/48693 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/48869 , H01L2224/4889 , H01L2224/48893 , H01L2224/81801 , H01L2924/00014 , H01L2924/181 , H01L2924/3651 , H01L2924/3656 , H01L2924/381 , H01L2924/00012 , H01L2924/01028 , H01L2924/014 , H01L2224/05552 , H01L2924/00015 , H01L2924/00 , H01L2224/45147
摘要： A method for manufacturing a metal pad structure of a die is provided, the method including: forming a metal pad between encapsulation material of the die, wherein the metal pad and the encapsulation material are separated from each other by a gap; and forming additional material in the gap to narrow at least a part of the gap.
摘要翻译： 提供了一种用于制造管芯的金属焊盘结构的方法，所述方法包括：在所述管芯的封装材料之间形成金属焊盘，其中所述金属焊盘和所述封装材料通过间隙彼此分离; 以及在所述间隙中形成附加材料以使所述间隙的至少一部分变窄。
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2.发明申请公开(公告)号：US20140048941A1
公开(公告)日：2014-02-20
申请号：US13587809
申请日：2012-08-16
IPC分类号： H01L23/485 , H01L21/50 , H01L21/768
CPC分类号： H01L24/06 , H01L21/563 , H01L23/3157 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/94 , H01L2224/02166 , H01L2224/0219 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03614 , H01L2224/03914 , H01L2224/0401 , H01L2224/04042 , H01L2224/05025 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0556 , H01L2224/05562 , H01L2224/05583 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/11334 , H01L2224/131 , H01L2224/13116 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/27334 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/48472 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2224/8185 , H01L2224/83801 , H01L2224/8385 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2224/94 , H01L2924/00014 , H01L2924/07802 , H01L2924/12032 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/3511 , H01L2924/01028 , H01L2924/014 , H01L2924/06 , H01L2924/01024 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01026 , H01L2924/01039 , H01L2924/01046 , H01L2924/00012 , H01L2224/03 , H01L2924/00 , H01L2224/05552
摘要： A chip contact pad and a method of making a chip contact pad are disclosed. An embodiment of the present invention includes forming a plurality of contact pads over a workpiece, each contact pad having lower sidewalls and upper sidewalls and reducing a lower width of each contact pad so that an upper width of each contact pad is larger than the lower width. The method further includes forming a photoresist over the plurality of contact pads and removing portions of the photoresist thereby forming sidewall spacers along the lower sidewalls.
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3.发明授权Contact pads with sidewall spacers and method of making contact pads with sidewall spacers 有权具有侧壁间隔件的接触垫和用侧壁间隔件制造接触垫的方法公开(公告)号：US08822327B2
公开(公告)日：2014-09-02
申请号：US13587809
申请日：2012-08-16
IPC分类号： H01L21/4763
CPC分类号： H01L24/06 , H01L21/563 , H01L23/3157 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/94 , H01L2224/02166 , H01L2224/0219 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03614 , H01L2224/03914 , H01L2224/0401 , H01L2224/04042 , H01L2224/05025 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0556 , H01L2224/05562 , H01L2224/05583 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/11334 , H01L2224/131 , H01L2224/13116 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/27334 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/48472 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2224/8185 , H01L2224/83801 , H01L2224/8385 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2224/94 , H01L2924/00014 , H01L2924/07802 , H01L2924/12032 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/3511 , H01L2924/01028 , H01L2924/014 , H01L2924/06 , H01L2924/01024 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01026 , H01L2924/01039 , H01L2924/01046 , H01L2924/00012 , H01L2224/03 , H01L2924/00 , H01L2224/05552
摘要： A chip contact pad and a method of making a chip contact pad are disclosed. An embodiment of the present invention includes forming a plurality of contact pads over a workpiece, each contact pad having lower sidewalls and upper sidewalls and reducing a lower width of each contact pad so that an upper width of each contact pad is larger than the lower width. The method further includes forming a photoresist over the plurality of contact pads and removing portions of the photoresist thereby forming sidewall spacers along the lower sidewalls.
摘要翻译： 公开了芯片接触焊盘和制造芯片接触焊盘的方法。 本发明的一个实施例包括在工件上形成多个接触垫，每个接触垫具有下侧壁和上侧壁，并减小每个接触垫的较低宽度，使得每个接触垫的上部宽度大于下部宽度 。 该方法还包括在多个接触焊盘上形成光致抗蚀剂并去除光致抗蚀剂的部分，从而沿着下侧壁形成侧壁间隔物。
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4.发明授权Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement 有权用于制造芯片的金属焊盘结构的方法，芯片的焊盘的制造方法，芯片布置和芯片布置公开(公告)号：US08765531B2
公开(公告)日：2014-07-01
申请号：US13590218
申请日：2012-08-21
IPC分类号： H01L21/00 , H01L23/48 , H01L23/00 , H01L23/498
CPC分类号： H01L24/05 , H01L23/3171 , H01L23/3192 , H01L23/498 , H01L24/02 , H01L24/03 , H01L24/19 , H01L24/20 , H01L24/45 , H01L24/48 , H01L24/81 , H01L2224/02 , H01L2224/0212 , H01L2224/02126 , H01L2224/02166 , H01L2224/0239 , H01L2224/03019 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/0348 , H01L2224/0361 , H01L2224/0381 , H01L2224/0382 , H01L2224/03821 , H01L2224/03822 , H01L2224/03825 , H01L2224/03827 , H01L2224/03831 , H01L2224/03848 , H01L2224/0401 , H01L2224/04042 , H01L2224/05547 , H01L2224/05565 , H01L2224/05569 , H01L2224/05571 , H01L2224/05576 , H01L2224/05578 , H01L2224/056 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05669 , H01L2224/0569 , H01L2224/05693 , H01L2224/12105 , H01L2224/45124 , H01L2224/45144 , H01L2224/48135 , H01L2224/48151 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48669 , H01L2224/4869 , H01L2224/48693 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/48869 , H01L2224/4889 , H01L2224/48893 , H01L2224/81801 , H01L2924/00014 , H01L2924/181 , H01L2924/3651 , H01L2924/3656 , H01L2924/381 , H01L2924/00012 , H01L2924/01028 , H01L2924/014 , H01L2224/05552 , H01L2924/00015 , H01L2924/00 , H01L2224/45147
摘要： A method for manufacturing a metal pad structure of a die is provided, the method including: forming a metal pad between encapsulation material of the die, wherein the metal pad and the encapsulation material are separated from each other by a gap; and forming additional material in the gap to narrow at least a part of the gap.
摘要翻译： 提供了一种用于制造管芯的金属焊盘结构的方法，所述方法包括：在所述管芯的封装材料之间形成金属焊盘，其中所述金属焊盘和所述封装材料通过间隙彼此分离; 以及在所述间隙中形成附加材料以使所述间隙的至少一部分变窄。
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