Invention Grant
US08765531B2 Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement
有权
用于制造芯片的金属焊盘结构的方法，芯片的焊盘的制造方法，芯片布置和芯片布置
- Patent Title: Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement
- Patent Title (中): 用于制造芯片的金属焊盘结构的方法，芯片的焊盘的制造方法，芯片布置和芯片布置
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Application No.: US13590218Application Date: 2012-08-21
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Publication No.: US08765531B2Publication Date: 2014-07-01
- Inventor: Johann Gatterbauer , Bernhard Weidgans , Joerg Busch
- Applicant: Johann Gatterbauer , Bernhard Weidgans , Joerg Busch
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/48 ; H01L23/00 ; H01L23/498
Abstract:
A method for manufacturing a metal pad structure of a die is provided, the method including: forming a metal pad between encapsulation material of the die, wherein the metal pad and the encapsulation material are separated from each other by a gap; and forming additional material in the gap to narrow at least a part of the gap.
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