-
1.发明授权Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement 有权用于制造芯片的金属焊盘结构的方法，芯片的焊盘的制造方法，芯片布置和芯片布置公开(公告)号：US08765531B2
公开(公告)日：2014-07-01
申请号：US13590218
申请日：2012-08-21
IPC分类号： H01L21/00 , H01L23/48 , H01L23/00 , H01L23/498
CPC分类号： H01L24/05 , H01L23/3171 , H01L23/3192 , H01L23/498 , H01L24/02 , H01L24/03 , H01L24/19 , H01L24/20 , H01L24/45 , H01L24/48 , H01L24/81 , H01L2224/02 , H01L2224/0212 , H01L2224/02126 , H01L2224/02166 , H01L2224/0239 , H01L2224/03019 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/0348 , H01L2224/0361 , H01L2224/0381 , H01L2224/0382 , H01L2224/03821 , H01L2224/03822 , H01L2224/03825 , H01L2224/03827 , H01L2224/03831 , H01L2224/03848 , H01L2224/0401 , H01L2224/04042 , H01L2224/05547 , H01L2224/05565 , H01L2224/05569 , H01L2224/05571 , H01L2224/05576 , H01L2224/05578 , H01L2224/056 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05669 , H01L2224/0569 , H01L2224/05693 , H01L2224/12105 , H01L2224/45124 , H01L2224/45144 , H01L2224/48135 , H01L2224/48151 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48669 , H01L2224/4869 , H01L2224/48693 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/48869 , H01L2224/4889 , H01L2224/48893 , H01L2224/81801 , H01L2924/00014 , H01L2924/181 , H01L2924/3651 , H01L2924/3656 , H01L2924/381 , H01L2924/00012 , H01L2924/01028 , H01L2924/014 , H01L2224/05552 , H01L2924/00015 , H01L2924/00 , H01L2224/45147
摘要： A method for manufacturing a metal pad structure of a die is provided, the method including: forming a metal pad between encapsulation material of the die, wherein the metal pad and the encapsulation material are separated from each other by a gap; and forming additional material in the gap to narrow at least a part of the gap.
摘要翻译： 提供了一种用于制造管芯的金属焊盘结构的方法，所述方法包括：在所述管芯的封装材料之间形成金属焊盘，其中所述金属焊盘和所述封装材料通过间隙彼此分离; 以及在所述间隙中形成附加材料以使所述间隙的至少一部分变窄。
-
2.发明申请METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD FOR MANUFACTURING A BOND PAD OF A CHIP, A DIE ARRANGEMENT AND A CHIP ARRANGEMENT 有权制造DIE的金属片结构的方法，制造芯片的粘合剂的方法，DIE布置和芯片布置公开(公告)号：US20140054800A1
公开(公告)日：2014-02-27
申请号：US13590218
申请日：2012-08-21
IPC分类号： H01L21/768 , H01L23/485
CPC分类号： H01L24/05 , H01L23/3171 , H01L23/3192 , H01L23/498 , H01L24/02 , H01L24/03 , H01L24/19 , H01L24/20 , H01L24/45 , H01L24/48 , H01L24/81 , H01L2224/02 , H01L2224/0212 , H01L2224/02126 , H01L2224/02166 , H01L2224/0239 , H01L2224/03019 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/0348 , H01L2224/0361 , H01L2224/0381 , H01L2224/0382 , H01L2224/03821 , H01L2224/03822 , H01L2224/03825 , H01L2224/03827 , H01L2224/03831 , H01L2224/03848 , H01L2224/0401 , H01L2224/04042 , H01L2224/05547 , H01L2224/05565 , H01L2224/05569 , H01L2224/05571 , H01L2224/05576 , H01L2224/05578 , H01L2224/056 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05669 , H01L2224/0569 , H01L2224/05693 , H01L2224/12105 , H01L2224/45124 , H01L2224/45144 , H01L2224/48135 , H01L2224/48151 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48669 , H01L2224/4869 , H01L2224/48693 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/48869 , H01L2224/4889 , H01L2224/48893 , H01L2224/81801 , H01L2924/00014 , H01L2924/181 , H01L2924/3651 , H01L2924/3656 , H01L2924/381 , H01L2924/00012 , H01L2924/01028 , H01L2924/014 , H01L2224/05552 , H01L2924/00015 , H01L2924/00 , H01L2224/45147
摘要： A method for manufacturing a metal pad structure of a die is provided, the method including: forming a metal pad between encapsulation material of the die, wherein the metal pad and the encapsulation material are separated from each other by a gap; and forming additional material in the gap to narrow at least a part of the gap.
摘要翻译： 提供了一种用于制造管芯的金属焊盘结构的方法，所述方法包括：在所述管芯的封装材料之间形成金属焊盘，其中所述金属焊盘和所述封装材料通过间隙彼此分离; 以及在所述间隙中形成附加材料以使所述间隙的至少一部分变窄。
-
搜索结果
2 条记录 (耗时 0.008 秒)
