公开(公告)号：US20180033675A1

公开(公告)日：2018-02-01

申请号：US15782500

申请日：2017-10-12

申请人： Wafer Mems Co., Ltd.

发明人： Min-Ho Hsiao ,  Pang-Yen Lee ,  Yen-Hao Tseng

IPC分类号： H01L21/70 ,  H01L27/01 ,  H01F17/00 ,  H01L49/02

CPC分类号： H01L21/705 ,  H01F17/0006 ,  H01L27/016 ,  H01L28/10

摘要： A patterned wafer used for production of passive-component chip bodies includes a peripheral end portion and at least one passive-component unit that including a connecting portion, a breaking line, and a plurality of spaced apart chip bodies. The connecting portion is connected to the peripheral end portion and is spaced apart from the chip bodies by a tab-accommodating space along a first direction. The breaking line has a plurality of connecting tabs that are spaced apart from one another and that are disposed in the tab-accommodating space. Each of the connecting tabs interconnects the connecting portion and a respective one of the chip bodies. A method for making the patterned wafer is also disclosed.

公开(公告)号：US20160379749A1

公开(公告)日：2016-12-29

申请号：US15152809

申请日：2016-05-12

申请人： Wafer Mems Co., LTD.

发明人： Min-Ho Hsiao ,  Pang-Yen Lee ,  Yen-Hao Tseng

IPC分类号： H01F27/28 ,  H01F41/02 ,  H01F41/04 ,  H01F27/24 ,  H01F27/32

CPC分类号： H01F41/042 ,  H01F17/0033 ,  H01F17/04 ,  H01L21/705 ,  H01L27/016 ,  H01L27/222

摘要： A magnetic core inductor chip includes a core and a coil. The core is in the form of a single piece of a magnetic material. The coil is deposited on and surrounds the core and has structural characteristics indicative of the coil being formed on the core by deposition techniques. Methods for making the magnetic core inductor chip are also disclosed.

摘要翻译： 磁芯电感芯片包括芯和线圈。 核心是单片磁性材料的形式。 线圈沉积在芯上并围绕芯并且具有指示线圈通过沉积技术形成在芯上的结构特征。 还公开了制造磁芯电感器芯片的方法。

公开(公告)号：US5580511A

公开(公告)日：1996-12-03

申请号：US762008

申请日：1991-09-19

申请人： Yorihiko Sakai ,  Norikatsu Ono ,  Norikazu Mineo ,  Takeshi Matsumoto ,  Hideaki Fujii

发明人： Yorihiko Sakai ,  Norikatsu Ono ,  Norikazu Mineo ,  Takeshi Matsumoto ,  Hideaki Fujii

IPC分类号： G03F7/00 ,  H01L21/48 ,  H01L21/70 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/12 ,  C04B37/00

CPC分类号： H01L21/4867 ,  G03F7/0017 ,  H01L21/481 ,  H01L21/705 ,  H05K3/1258 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0108 ,  H05K2203/0113 ,  H05K2203/0568 ,  H05K3/0079 ,  H05K3/0082

摘要： A female mold (2, 12, 22, 32, 42, 52, 62) having a desirable pattern is formed on a substrate (1, 11, 21, 31, 41, 51, 61). Next, ceramic material (3, 13, 23, 33, 43, 53, 63) is filled in spaces in the female mold. Thereafter, the female mold is removed by heating the entire substrate, whereby a desirable thick film pattern can be finely and easily formed. The inorganic paste material comprising inorganic liquid vehicle containing water glass as main ingredient and powdery solid dispersed in the inorganic liquid vehicle is used as the ceramic material. The volume change of the inorganic paste material is small during the drying and calcinating processes, thus the inorganic paste material is prevented from being broken.

摘要翻译： PCT No.PCT / JP91 / 00080 Sec。 371日期1991年9月19日 102（e）1991年9月19日PCT 1991年1月25日PCT PCT。 第WO91 / 11307号公报 日期1991年8月8日在基板（1,11,21,31,41,51,61）上形成具有所需图案的阴模（2,12,22,32,42,52,62）。 接下来，陶瓷材料（3,13,23,33,43,53,63）填充在阴模中的空间中。 此后，通过加热整个基板去除阴模，从而可以精细且容易地形成所需的厚膜图案。 使用包含以水玻璃为主要成分的无机液体载体和分散在无机液体载体中的粉状固体的无机浆料作为陶瓷材料。 无机糊剂材料的体积变化在干燥和煅烧过程中较小，因此防止无机糊剂材料破裂。

公开(公告)号：US5041191A

公开(公告)日：1991-08-20

申请号：US435928

申请日：1989-11-13

申请人： James C. Watson

发明人： James C. Watson

IPC分类号： C23F1/38 ,  H01C17/28 ,  H01L21/70

CPC分类号： C23F1/38 ,  H01C17/288 ,  H01L21/705 ,  Y10T29/49099

摘要： A thin film resistor and method of making employs tungsten or tungsten titanium alloy as an alectrically conductive diffusion barrier between the nickel chromium resistor and the gold conductor. A solution of cupric sulfate, ammonium hydroxide, glycerol and deionized water is used to remove the unwanted diffusion barrier without damaging the thin film resistor materials, thereby preserving precision resistance values.

摘要翻译： 薄膜电阻器和制造方法使用钨或钨钛合金作为镍铬电阻器和金导体之间的导电扩散阻挡层。 使用硫酸铜，氢氧化铵，甘油和去离子水的溶液去除不想要的扩散屏障，而不损害薄膜电阻材料，从而保持精密电阻值。

公开(公告)号：US4991284A

公开(公告)日：1991-02-12

申请号：US319903

申请日：1989-03-06

申请人： Shiro Ezaki

发明人： Shiro Ezaki

IPC分类号： H01C17/06 ,  H01C17/28 ,  H01L21/70 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/46

CPC分类号： H05K1/167 ,  H01C17/281 ,  H01L21/705 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K3/4685 ,  Y10T29/49099 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155

摘要： A method of manufacturing and monitoring the manufacture of a thick film circuit board device. The method includes the steps of forming a resistive layer in a prescribed pattern on an insulative base board, forming a first conductive layer on the insulative base board adjacent to the resistive layer with a gap of predetermined width therebetween and forming a second conductive layer in the gap and overlapping a portion of the resistive layer and the first conductive layer for establishing electrical contact between the resistive layer and the first conductive layer.

摘要翻译： 一种制造和监测厚膜电路板装置的制造方法。 该方法包括以下步骤：在绝缘基板上形成规定图案的电阻层，在与绝缘基板相邻的绝缘基板上形成第一导电层，其间具有预定宽度的间隙，并在其中形成第二导电层 间隙并且与电阻层和第一导电层的一部分重叠，以在电阻层和第一导电层之间建立电接触。

公开(公告)号：US4914829A

公开(公告)日：1990-04-10

申请号：US285558

申请日：1988-12-16

申请人： William R. Keaton

发明人： William R. Keaton

IPC分类号： H01L21/70 ,  H05K1/02 ,  H05K1/09

CPC分类号： H05K1/0269 ,  H01L21/705 ,  H05K1/092 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/163 ,  H05K2203/166 ,  Y10T29/49126

摘要： The addition of registration marks as an aid in projecting a precision location of a screened artwork or master pattern as used in printing of thick film circuits on a ceramic substrate base is taught by the present invention. The marks are located in a number of locations on the artwork that correspond to a location which will be determined as the edge of the substrate base when the substrate base is printed in proper registration on the artwork to which the registration marks have been added.

摘要翻译： 在本发明中教导了添加注册标记作为在陶瓷衬底基底上印刷厚膜电路中所用的筛选图形或主图案的精确位置的辅助。 标记位于艺术品上的多个位置，对应于将衬底基底印刷在已经添加了对准标记的图形上的适当登记中将被确定为基底的边缘的位置。

公开(公告)号：US4841275A

公开(公告)日：1989-06-20

申请号：US127160

申请日：1987-12-01

申请人： Mitsuru Murata

发明人： Mitsuru Murata

IPC分类号： H01L27/01 ,  H01C17/242 ,  H01L21/70 ,  H05K1/09 ,  H05K1/16 ,  H05K3/02

CPC分类号： H05K1/167 ,  H01C17/242 ,  H01L21/705 ,  H05K1/092 ,  H05K2201/10045 ,  H05K2203/171 ,  H05K3/027

摘要： A thick-film integrated circuit device comprises an insulating substrate, first and second conductors, formed on the insulating substrate by means of a thick-film forming method and spaced apart from each other, and a resistance-trimming resistor and a function-trimming resistor, both formed on the insulating substrate by means of the thick-film forming method. Both resistors are rectangular strips. The resistance-trimming resistor has two ends overlapping and thus electrically connected to the facing ends of the first and second conductors, respectively. The function-trimming resistor extends perpendicular to the second conductor, and has one end portion which extends at right angles to, overlaps and is therefore electrically coupled to the thin intermediate portion of the second conductor. A laser beam is applied onto the resistance-trimming resistor, while the resistance between those ends of the first and second conductors which face away from each other is being measured, thereby cutting a notch in the function-trimming resistor and thus greatly adjusting this resistance. A laser beam is applied onto the function-trimming resistor, thereby cutting a notch therein, cutting the resistor into two parts, and thus minutely adjusting the resistance between said ends of the first and second conductors.

摘要翻译： 厚膜集成电路器件包括绝缘衬底，第一和第二导体，其通过厚膜形成方法形成在绝缘衬底上并彼此间隔开，以及电阻调节电阻器和功能微调电阻器 两者都通过厚膜形成方法形成在绝缘基板上。 两个电阻都是矩形条。 电阻调节电阻器的两端重叠，从而分别电连接到第一和第二导体的相对端。 功能微调电阻器垂直于第二导体延伸，并且具有一个直角延伸并重叠的端部，因此电耦合到第二导体的薄的中间部分。 将激光束施加到电阻调节电阻器上，同时测量第一和第二导体的彼此远离的端部之间的电阻，从而切割功能微调电阻器中的凹口，从而大大调节该电阻 。 将激光束施加到功能微调电阻器上，从而在其中切割凹口，将电阻器切割成两部分，从而微调第一和第二导体的端部之间的电阻。

公开(公告)号：US4783642A

公开(公告)日：1988-11-08

申请号：US49261

申请日：1987-05-13

申请人： Mitsuyuki Takada ,  Yoshiyuki Morihiro ,  Hayato Takasago

发明人： Mitsuyuki Takada ,  Yoshiyuki Morihiro ,  Hayato Takasago

IPC分类号： H01C17/065 ,  H01L21/70 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/18 ,  H05K3/24 ,  H01C1/012

CPC分类号： H05K3/246 ,  H01C17/065 ,  H01L21/705 ,  H05K1/167 ,  H05K1/0306 ,  H05K1/092 ,  H05K2203/0709 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  H05K3/182 ,  Y10T29/49099

摘要： A hybrid integrated circuit substrate contains an insulating substrate. On predetermined positions of the upper surface of the substrate, there are formed resistors and activation layers to be in contact with ends of the resistors. On predetermined positions of the upper surfaces of the activation layers, there are formed conductor layers electrically connected with the ends of the resistors.

摘要翻译： 混合集成电路基板包含绝缘基板。 在基板的上表面的预定位置上，形成有与电阻器端部接触的电阻和激活层。 在激活层的上表面的预定位置处，形成与电阻器的端部电连接的导体层。

公开(公告)号：US4656048A

公开(公告)日：1987-04-07

申请号：US802950

申请日：1985-11-27

申请人： Shinichi Kudoh ,  Akira Kabeshita ,  Syuichi Murakami

发明人： Shinichi Kudoh ,  Akira Kabeshita ,  Syuichi Murakami

IPC分类号： H01L21/70 ,  H05K3/12

CPC分类号： H01L21/705 ,  H05K3/1241 ,  H05K2203/0126

摘要： Disclosed is a method of forming a thick film circuit pattern according which involves moving a nozzle having a slit opening above the surface of a stationary substrate with the elongation of the slit opening being oriented at an angle to the direction of movement of the nozzle and forcing a paste in the nozzle downward through the slit opening onto the substrate to deposit a sufficiently wide and uniformly thick film strip. Preferably, the surface irregularities of the substrate are detected without contacting it for controlling the position of the slit opening above the substrate so that it follows closely parallel with the surface contour line of the substrate.

摘要翻译： 公开了一种形成厚膜电路图案的方法，其包括在狭缝开口的伸长方向与喷嘴的移动方向成一定角度的情况下移动具有在固定基板的表面上方的狭缝开口的喷嘴，并且迫使 将喷嘴中的浆料向下通过狭缝开口，以沉积足够宽且均匀的厚膜条。 优选地，在不接触基板的情况下检测基板的表面凹凸，以控制基板上方的狭缝开口的位置，使其与基板的表面轮廓线紧密相邻。

公开(公告)号：US4508753A

公开(公告)日：1985-04-02

申请号：US409672

申请日：1982-08-19

申请人： William E. Stepan

发明人： William E. Stepan

IPC分类号： H01L21/70 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  B05D5/12

CPC分类号： H05K1/0265 ,  H01L21/705 ,  H05K3/1258 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/167 ,  H05K2201/09036 ,  H05K2201/09727 ,  H05K2203/0108 ,  H05K2203/0228 ,  H05K2203/1476 ,  H05K3/0023 ,  H05K3/0029 ,  H05K3/0044 ,  H05K3/107

摘要： The method of forming fine line circuit patterns on an insulating coating comprising the steps of applying an insulating coating to a substrate, forming a circuit pattern on the insulating coating surface, filling the circuit pattern with conductive or resistive circuit paste, removing the excess and heating at a temperature for sintering the paste to the coating.

摘要翻译： 在绝缘涂层上形成细线电路图案的方法，包括以下步骤：将绝缘涂层施加到基板上，在绝缘涂层表面上形成电路图案，用导电或电阻电路浆料填充电路图案，去除过量和加热 在将糊料烧结到涂层的温度下。