公开(公告)号：US5672965A

公开(公告)日：1997-09-30

申请号：US476248

申请日：1995-06-07

申请人： Kazuhiko Kurafuchi ,  Hiroshi Seki ,  Mitsuyuki Takada

发明人： Kazuhiko Kurafuchi ,  Hiroshi Seki ,  Mitsuyuki Takada

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R31/28 ,  H01L21/66 ,  H05K1/02 ,  H05K1/11 ,  G01R1/06 ,  G01R1/07

CPC分类号： G01R31/2886 ,  G01R1/04 ,  H05K1/0266 ,  H05K1/11

摘要： An evaluation board for evaluating electrical characteristics of an IC package has an electrically insulating support board having signal wire patterns for contact by a measurement probe formed on a first surface and mounting pads for contact with solder balls of an IC package formed on a surface. The signal wire patterns and the mounting pads are electrically connected with each other via through holes formed in the support board. The signal wire patterns are surrounded by and spaced from a ground pattern formed on the first surface.

摘要翻译： 用于评估IC封装的电气特性的评估板具有电绝缘支撑板，其具有用于与形成在表面上的IC封装的焊料球接触的安装焊盘与第一表面上形成的测量探针接触的信号线图案。 信号线图案和安装垫通过形成在支撑板上的通孔彼此电连接。 信号线图案由形成在第一表面上的接地图案围绕并与之隔开。

公开(公告)号：US4963389A

公开(公告)日：1990-10-16

申请号：US294990

申请日：1989-01-06

申请人： Mitsuyuki Takada ,  Ryusaku Tsukao ,  Hayato Takasago

发明人： Mitsuyuki Takada ,  Ryusaku Tsukao ,  Hayato Takasago

IPC分类号： H01L21/48 ,  H01L21/70 ,  H01L27/01 ,  H05K1/16 ,  H05K3/18

CPC分类号： H01L21/702 ,  H01L21/4846 ,  H05K1/16

摘要： A method for producing a high density hybrid integrated circuit substrate capable of forming a very fine pattern of a conductor by means of the chemical plating and at the same time capable of applying the chemical plating, while protecting the resistor formed on the substrate in advance of the chemical plating step, the production method comprising steps of: forming a resistor on an electrically insulating substrate; forming an activating layer for depositing a chemical plating on the electrically insulating substrate in contact with the resistor; forming a stable resin layer, during the chemical plating step, by the photolithography process in a manner to cover the resistor, except for the portion of the activating layer where an electrically conductive layer is to be formed; and forming the electrically conductive layer by the chemical plating on the exposed portion of the activating layer.

摘要翻译： 一种用于制造高密度混合集成电路基板的方法，该方法能够通过化学镀形成导体的非常精细的图案，同时能够施加化学镀，同时保护在基板上形成的电阻器之前 所述化学镀步骤，所述制造方法包括以下步骤：在电绝缘基板上形成电阻器; 形成用于在与所述电阻器接触的所述电绝缘基板上沉积化学镀层的激活层; 在化学镀步骤期间通过光刻工艺以覆盖电阻器的方式形成稳定的树脂层，除了要形成导电层的激活层的部分之外; 以及通过化学镀在活化层的暴露部分上形成导电层。

公开(公告)号：US4946709A

公开(公告)日：1990-08-07

申请号：US395213

申请日：1989-08-17

申请人： Mitsuyuki Takada ,  Eishi Gofuku ,  Hayato Takasago

发明人： Mitsuyuki Takada ,  Eishi Gofuku ,  Hayato Takasago

IPC分类号： H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/18 ,  H05K3/24 ,  H05K3/46

CPC分类号： H05K3/4661 ,  H01L21/481 ,  H01L21/4846 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0116 ,  H05K2201/0236 ,  H05K2201/0347 ,  H05K2203/072 ,  H05K3/184 ,  H05K3/246 ,  H05K3/465 ,  Y10T29/49099

摘要： A method for fabricating a hybrid IC substrate comprises the steps of: preparing an insulating ceramic substrate having a major surface; baking one or more conductors of a first group formed of high melting point metal or alloy thereof on the major surface; covering the conductors of the first group with a first plated film formed by electroless plating; forming an insulating porous active including a glass component and a small amount of a metal component having a catalytic action for electroless plating on the first plated film; and forming one or more conductors of a second group by electroless plating on the active layer, whereby portions of the active layer sandwiched between the conductors of the first and second groups are rendered conductive.

摘要翻译： 一种制造混合IC基板的方法包括以下步骤：制备具有主表面的绝缘陶瓷基片; 在主表面上烘烤由高熔点金属或其合金形成的第一组的一个或多个导体; 用无电镀形成的第一镀膜覆盖第一组导体; 在所述第一镀膜上形成具有玻璃成分和少量金属成分的绝缘多孔活性物质，所述金属成分具有化学镀的催化作用; 以及通过在有源层上进行化学镀来形成第二组的一个或多个导体，由此夹在第一和第二组的导体之间的有源层的部分变得导电。

公开(公告)号：US4914815A

公开(公告)日：1990-04-10

申请号：US312929

申请日：1989-02-21

申请人： Mitsuyuki Takada ,  Hayato Takasago ,  Yoshiyuki Morihiro

发明人： Mitsuyuki Takada ,  Hayato Takasago ,  Yoshiyuki Morihiro

IPC分类号： H05K13/04 ,  H01L21/98 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46

CPC分类号： H01L25/50 ,  H05K3/0052 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K3/0029 ,  H05K3/467 ,  Y10T156/1052 ,  Y10T225/12 ,  Y10T29/49144 ,  Y10T29/49789 ,  Y10T29/4979

摘要： In a method for manufacturing hybrid integrated circuits, a plurality of circuit patterns are formed on one surface of a board, and a connecting film is stuck onto the other surface of the board. Then, the board is divided into portions having the respective circuit patterns while leaving the connecting film intact and component parts are mounted on the portions. Finally, the individual portions are separated by cutting the connecting film. The circuit patterns may be formed over one surface of the board and covered with a connecting film. The connecting film may be a constituent element of each circuit pattern, such as an insulating layer disposed between conducting layers.

摘要翻译： 在制造混合集成电路的方法中，在板的一个表面上形成多个电路图案，并且将连接膜粘贴到板的另一个表面上。 然后，将板分成具有相应电路图案的部分，同时使连接膜完好无损，并将部件安装在该部分上。 最后，通过切割连接膜分离各个部分。 电路图案可以形成在板的一个表面上并被连接膜覆盖。 连接膜可以是每个电路图案的构成元件，例如设置在导电层之间的绝缘层。

公开(公告)号：US4785157A

公开(公告)日：1988-11-15

申请号：US000992

申请日：1987-01-07

申请人： Eishi Gofuku ,  Mitsuyuki Takada ,  Hayato Takasago

发明人： Eishi Gofuku ,  Mitsuyuki Takada ,  Hayato Takasago

IPC分类号： H01C17/242 ,  H01C17/26 ,  B23K26/00

CPC分类号： H01C17/242 ,  H01C17/265 ,  Y10T29/49155

摘要： A method for controlling electric resistance of a compound-type resistant material is disclosed in which a laser beam is irradiated on a compound-type resistant material so as to cause a change in its chemical state whereby the specific resistance inherent to the compound-type resistant material is varied thereby to change its electric resistance in an appropriate manner. If necessary, a portion of the resistant material may be cut away by irradiation of a laser beam so as to further control the resistance value of the resistant material in an increasing sense.

摘要翻译： 公开了一种用于控制复合型电阻材料的电阻的方法，其中激光束照射在化合物型耐药材料上，从而导致其化学状态的变化，由此化合物型抗性固有的电阻率 材料变化从而以适当的方式改变其电阻。 如果需要，通过激光束的照射可以切除部分耐电阻材料，以进一步控制电阻材料的电阻值。

公开(公告)号：US4645734A

公开(公告)日：1987-02-24

申请号：US726588

申请日：1985-04-23

申请人： Mitsuyuki Takada ,  Atsushi Endo ,  Hayato Takasago

发明人： Mitsuyuki Takada ,  Atsushi Endo ,  Hayato Takasago

IPC分类号： C23C18/16 ,  C23C18/20 ,  C23C18/22 ,  G03F7/004 ,  H05K3/18 ,  G03C5/00

CPC分类号： C23C18/1608 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/30 ,  G03F7/004 ,  H05K3/182 ,  H05K3/181

摘要： In manufacturing a composite having a conductive layer on the surface of a resin layer, the first resin layer of polyimide is formed on a substrate of alumina ceramic and, after a resin layer is thermally set by heating, a second resin layer of polyimide is then formed on the first resin layer and is dried. Then the surface of the second resin layer is subjected to selective photoetching by using a photomask having predetermined small opaque areas distributed, thereby to form unevenness including concaves formed as a result of the selective photoetching. The layered composite thus obtained is then heated so that the second resin layer is thermally set. Then catalyst nuclei are formed for electroless plating on the etched surface having the unevenness formed and then a conductive metallic layer is formed by an electroless plating process on the etched surface having the unevenness formed. As a result, a composite of the above described structure is provided.

摘要翻译： 在制造在树脂层的表面具有导电层的复合体时，在氧化铝陶瓷的基板上形成聚酰亚胺的第一树脂层，在通过加热热固化树脂层之后，然后将聚酰亚胺的第二树脂层 形成在第一树脂层上并干燥。 然后通过使用具有分布预定的小不透明区域的光掩模对第二树脂层的表面进行选择性光刻，从而形成包括作为选择性光刻的结果形成的凹陷的凹凸。 然后将由此获得的层状复合体加热，使第二树脂层热固化。 然后在形成有凹凸的蚀刻表面上形成催化剂核以进行化学镀，然后通过化学镀方法在形成有凹凸的蚀刻表面上形成导电金属层。 结果，提供了上述结构的复合材料。

公开(公告)号：US5173844A

公开(公告)日：1992-12-22

申请号：US794281

申请日：1991-11-19

申请人： Kohei Adachi ,  Mitsuyuki Takada ,  Atsushi Endo ,  Eishi Gofuku ,  Hayato Takasago

发明人： Kohei Adachi ,  Mitsuyuki Takada ,  Atsushi Endo ,  Eishi Gofuku ,  Hayato Takasago

IPC分类号： H01L21/58 ,  H01L21/60 ,  H01L23/14 ,  H01L23/373 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/10 ,  H05K3/46

CPC分类号： H01L24/32 ,  H01L23/142 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/48 ,  H01L24/83 ,  H05K1/021 ,  H01L2224/05644 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/20752 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/182 ,  H05K2201/0154 ,  H05K2201/09745 ,  H05K2203/049 ,  H05K3/108 ,  H05K3/4644 ,  Y10T29/4913

摘要： A circuit board includes a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.

公开(公告)号：US5081562A

公开(公告)日：1992-01-14

申请号：US540389

申请日：1990-06-19

申请人： Kohei Adachi ,  Mitsuyuki Takada ,  Eishi Gofuku ,  Hayato Takasago ,  Atsushi Endo

发明人： Kohei Adachi ,  Mitsuyuki Takada ,  Eishi Gofuku ,  Hayato Takasago ,  Atsushi Endo

IPC分类号： H01L21/58 ,  H01L21/60 ,  H01L23/14 ,  H01L23/373 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/10 ,  H05K3/46

CPC分类号： H01L24/32 ,  H01L23/142 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/48 ,  H01L24/83 ,  H05K1/021 ,  H01L2224/05644 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/20752 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/182 ,  H05K2201/0154 ,  H05K2201/09745 ,  H05K2203/049 ,  H05K3/108 ,  H05K3/4644 ,  Y10T29/4913

摘要： A circuit board includes a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.

公开(公告)号：US5069745A

公开(公告)日：1991-12-03

申请号：US571876

申请日：1990-08-24

申请人： Hirofumi Ohuchida ,  Eishi Gofuku ,  Hayato Takasago ,  Akira Ishizu ,  Toshio Tobita ,  Mitsuyuki Takada

发明人： Hirofumi Ohuchida ,  Eishi Gofuku ,  Hayato Takasago ,  Akira Ishizu ,  Toshio Tobita ,  Mitsuyuki Takada

IPC分类号： G02F1/1347 ,  G02F1/1333 ,  G02F1/1343 ,  G09F9/30 ,  G09F9/40 ,  H01R4/04 ,  H05K1/14 ,  H05K1/16 ,  H05K3/32

CPC分类号： H01R4/04 ,  G02F1/13336 ,  H05K1/142 ,  G02F1/1343 ,  H05K2203/107 ,  H05K3/321

摘要： A process for preparing a combined wiring substrate is carried out by bonding with an adhesive agent the end surfaces of the mutually opposing sides of a plurality of substrates each having a pattern of wiring on its major surface, and by connecting electrically parts of the pattern of wiring which oppose each other by interposing the bonding portion.

摘要翻译： 用于制备组合布线基板的方法是通过使粘合剂与多个基板的相互相对的侧面的各自具有在其主表面上具有布线图案的端面粘接，并且通过将 通过插入接合部分彼此相对的布线。

公开(公告)号：US5059941A

公开(公告)日：1991-10-22

申请号：US584602

申请日：1990-09-19

申请人： Eishi Gofuku ,  Mitsuyuki Takada

发明人： Eishi Gofuku ,  Mitsuyuki Takada

IPC分类号： H01C17/06 ,  H01C1/142 ,  H01C7/00 ,  H01C17/065

CPC分类号： H01C1/142 ,  H01C17/0658 ,  Y10S428/931 ,  Y10T428/31649

摘要： A resistor device includes a thick-film resistor which includes a mixture of electrical conductive material and glass, and which has the electrical conductive material at a surface portion exposed; and electrodes which are deposited on the thick-film resistor to be connected to the exposed electrical conductive material.

摘要翻译： 电阻器件包括厚膜电阻器，其包括导电材料和玻璃的混合物，并且在暴露的表面部分具有导电材料; 以及沉积在厚膜电阻器上以连接到暴露的导电材料的电极。