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    Chip component production method
    1.
    发明授权
    Chip component production method 有权

    公开(公告)号：US12125618B2

    公开(公告)日：2024-10-22

    申请号：US17769311

    申请日：2020-09-24

    Applicant: KOA CORPORATION

    Inventor： Yasushi Akahane ,  Nobuhiko Tamada

    IPC: H01C17/00 ,  C25D3/56 ,  C25D5/12 ,  C25D7/06 ,  C25D21/12 ,  H01C1/032 ,  H01C1/142 ,  H01C17/242

    CPC classification number: H01C17/006 ,  C25D3/562 ,  C25D5/12 ,  C25D7/0642 ,  C25D21/12 ,  H01C1/032 ,  H01C1/142 ,  H01C17/242

    Abstract: A chip component 10 comprises: an insulating substrate 1 on which a resistor 3 serving as a functional element is formed; a pair of internal electrodes (front electrodes 2, end surface electrodes 6, and back electrodes 5) that is formed to cover both end portions of the insulating substrate 1 and connected to the resistor 3; a barrier layer 8 that is formed on a surface of each of the internal electrodes and mainly composed of nickel; and an external connection layer 9 that is formed on a surface of the barrier layer 8 and mainly composed of tin, and the barrier layer 8 is composed of alloy plating (Ni—P) including nickel and phosphorus, which is formed by electrolytic plating, and a content rate of phosphorus in the alloy plating of an inner region is made different from that of an outer region so that at least the inner region of the barrier layer 8 has magnetic properties.

    Resistor
    2.
    发明授权
    Resistor 有权

    公开(公告)号：US11810697B2

    公开(公告)日：2023-11-07

    申请号：US17606612

    申请日：2020-05-08

    Applicant: ROHM CO., LTD.

    Inventor： Atsuki Yakata

    IPC: H01C1/142 ,  H01C1/032 ,  H01C17/242

    CPC classification number: H01C1/142 ,  H01C1/032 ,  H01C17/242

    Abstract: A resistor includes a resistive element including a first surface and a second surface; a protective film having electrical insulating properties disposed on the first surface; and a pair of electrodes in contact with the resistive element. The protective film includes a first outer edge and a second outer edge. The resistive element includes a first slit and a second slit extending from the first surface through to the second surface and extending in the second direction. The first slit is located closest to the first outer edge; and the second slit is located closest to the second outer edge. As viewed in the thickness direction, a first distance from the first outer edge to the first slit and a second distance from the second outer edge to the second slit together have a length 15% or greater of a dimension of the protective film in the first direction.

    RESISTOR AND MANUFACTURING METHOD
    5.
    发明申请
    RESISTOR AND MANUFACTURING METHOD 有权
    电阻和制造方法

    公开(公告)号：US20160118164A1

    公开(公告)日：2016-04-28

    申请号：US14920999

    申请日：2015-10-23

    Applicant: KOA Corporation

    Inventor： Hiroyuki Fukao

    IPC: H01C1/14 ,  H01C1/012 ,  H01C17/242

    CPC classification number: H01C1/14 ,  H01C3/10 ,  H01C3/12 ,  H01C7/1006 ,  H01C17/065 ,  H01C17/242 ,  H01C17/245

    Abstract: There is provided a resistor in which a first resistive part of a resistive element that electrically conducts between a pair of electrodes formed on either end of an insulating substrate has a meandering pattern meandering on the substrate surface and a swelling pattern that has a form in which a part of the meandering pattern swells out from the stroke width of the meandering pattern, a second resistive part that is electrically connected in series to the first resistive part is shorter than the entire length of the first resistive part, and has a wider width than the stroke width of the meandering pattern, and a trimming groove is formed in at least either the swelling pattern or the second resistive part. This can improve resistance accuracy and provide a high voltage resistor with high withstand voltage property.

    Abstract translation: 提供了一种电阻器，其中在绝缘基板的任一端形成的一对电极之间导电的电阻元件的第一电阻部分具有在基板表面上曲折的曲折图案和具有以下形式的膨胀图案： 蜿蜒曲线的一部分从蜿蜒图案的行程宽度膨胀，与第一电阻部分串联电连接的第二电阻部分比第一电阻部分的整个长度短，并且具有宽于 蜿蜒图案的行程宽度和修剪槽形成在至少膨胀图案或第二电阻部分中。 这可以提高电阻精度，并提供具有高耐压性能的高压电阻。

    Manufacturing apparatus of coordinate detecting device
    7.
    发明授权
    Manufacturing apparatus of coordinate detecting device 有权
    坐标检测装置制造装置

    公开(公告)号：US08975556B2

    公开(公告)日：2015-03-10

    申请号：US12463458

    申请日：2009-05-11

    Applicant: Koichi Kondoh

    Inventor： Koichi Kondoh

    IPC: B23K26/073 ,  G06F3/045 ,  H01C17/242

    CPC classification number: G06F3/045 ,  H01C17/242

    Abstract: A coordinate detecting device includes a resistive film formed on a substrate and a common electrode for applying a voltage to the resistive film, wherein a potential distribution is created in the resistive film, an electric potential of the resistive film at a contact position is detected, and a position of the contact position of the resistive film is detected. In a manufacturing apparatus, a laser light source irradiates laser light to remove a part of the resistive film to form a resistive film removed part, an optical system converges the laser light, a plurality of probes measure electric potentials of a surface of the resistive film with the common electrode providing the voltage to the resistive film, an X-Y table moves the substrate at least two-dimensionally, and a control part controls the X-Y table and the laser light source.

    Abstract translation: 坐标检测装置包括形成在基板上的电阻膜和用于向电阻膜施加电压的公共电极，其中在电阻膜中产生电位分布，检测电阻膜在接触位置处的电位， 并且检测电阻膜的接触位置的位置。 在制造装置中，激光源照射激光以去除电阻膜的一部分以形成电阻膜去除部分，光学系统会聚激光，多个探针测量电阻膜的表面的电位 当公共电极向电阻膜提供电压时，XY工作台至少二维地移动衬底，并且控制部件控制XY工作台和激光光源。

    CHIP RESISTOR AND METHOD OF PRODUCING THE SAME
    8.
    发明申请
    CHIP RESISTOR AND METHOD OF PRODUCING THE SAME 有权
    芯片电阻及其制造方法

    公开(公告)号：US20140354396A1

    公开(公告)日：2014-12-04

    申请号：US14368757

    申请日：2012-12-18

    Applicant: ROHM CO., LTD.

    Inventor： Eiji Nukaga ,  Hiroshi Tamagawa ,  Yasuhiro Kondo ,  Katsuya Matsuura

    IPC: H01C7/00 ,  H01C17/00

    CPC classification number: H01C17/006 ,  H01C7/00 ,  H01C7/006 ,  H01C13/02 ,  H01C17/06 ,  H01C17/08 ,  H01C17/242 ,  H01F27/402 ,  H01G2/065 ,  H01G4/38 ,  H01G4/40 ,  H01L21/3065 ,  H01L21/78 ,  H01L23/5256 ,  H01L23/528 ,  H01L29/6609 ,  H01L29/861 ,  Y10T29/49082

    Abstract: [Subject] To provide a chip resistor free from chipping of corner portions thereof and a method of producing the chip resistor.[Solution] The chip resistor (1) includes: a board (2) having a device formation surface (2A), a back surface (2B) opposite from the device formation surface (2A) and side surfaces (2C-2F) connecting the device formation surface (2A) to the back surface (2B), a resistor portion (56) provided on the device formation surface (2A), a first connection electrode (3) and a second connection electrode (4) provided on the device formation surface (2A) and electrically connected to the resistor portion (56), and a resin film (24) covering the device formation surface (2A) with the first connection electrode (3) and the second connection electrode (4) being exposed therefrom. Intersection portions (11) of the board (2) along which the back surface (2B) intersects the side surfaces (2C-2F) each have a rounded shape.

    Abstract translation: 提供一种片状电阻器，其没有其拐角部分的碎裂以及制造芯片电阻器的方法。 芯片电阻器（1）包括：具有器件形成表面（2A）的板（2），与器件形成表面（2A）相对的后表面（2B）和连接器件形成表面的侧表面（2C-2F） 装置形成面（2A）到背面（2B），设置在器件形成面（2A）上的电阻部（56），设置在器件形成上的第一连接电极（3）和第二连接电极（4） 表面（2A）并与电阻部分（56）电连接;以及第一连接电极（3）和第二连接电极（4）暴露于其上的覆盖器件形成表面（2A）的树脂膜（24）。 背面（2B）与侧面（2C-2F）相交的板（2）的交叉部分（11）各自具有圆形。

    CHIP RESISTOR AND ELECTRONIC EQUIPMENT HAVING RESISTANCE CIRCUIT NETWORK
    9.
    发明申请
    CHIP RESISTOR AND ELECTRONIC EQUIPMENT HAVING RESISTANCE CIRCUIT NETWORK 有权
    芯片电阻和具有电阻电路网络的电子设备

    公开(公告)号：US20140225220A1

    公开(公告)日：2014-08-14

    申请号：US14348581

    申请日：2012-09-28

    Applicant: ROHM CO., LTD.

    Inventor： Hiroshi Tamagawa ,  Yasuhiro Kondo ,  Yasuhiro Fuwa ,  Hiroyuki Okada ,  Eiji Nukaga ,  Katsuya Matsuura

    IPC: H01L27/06

    CPC classification number: H01L28/20 ,  H01C1/14 ,  H01C13/02 ,  H01C17/006 ,  H01C17/242 ,  H01L21/3065 ,  H01L21/3083 ,  H01L27/0676 ,  H01L27/0802 ,  H05K3/3431 ,  H05K2201/10674

    Abstract: [Theme] A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired.[Solution Means] A chip resistor 10 is arranged to have a resistor network 14 on a substrate. The resistor network 14 includes a plurality of resistor bodies R arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies R being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films C and fuse films F. By selectively fusing a fuse film F, a resistance unit can be electrically incorporated into the resistor network 14 or electrically separated from the resistor network to make the resistance value of the resistor network 14 the required resistance value.

    Abstract translation: [主题]希望具有相同设计结构容易地容纳多种类型的所需电阻值的紧凑且精细的芯片电阻器。 [解决方案]芯片电阻器10布置成在基板上具有电阻网络14。 电阻网络14包括排列成矩阵并具有相等电阻值的多个电阻体R。 多个电阻单元分别由电连接的一个或多个电阻体R布置。 多种类型的电阻单元使用连接导体膜C和熔丝膜F以预定模式连接。通过选择性地熔化熔丝F，电阻单元可以电连接到电阻器网络14中或与电阻器网络电分离 使电阻网络14的电阻值成为所需电阻值。

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