公开(公告)号：US10224391B2

公开(公告)日：2019-03-05

申请号：US15647592

申请日：2017-07-12

Applicant: ROHM CO., LTD.

Inventor： Hiroshi Tamagawa ,  Yasuhiro Kondo ,  Yasuhiro Fuwa ,  Hiroyuki Okada ,  Eiji Nukaga ,  Katsuya Matsuura

IPC: H01L49/02 ,  H01L27/08 ,  H01L27/06 ,  H01L21/308 ,  H01C1/14 ,  H01C13/02 ,  H01L21/3065 ,  H01C17/242 ,  H01C17/00 ,  H05K3/34

Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

公开(公告)号：US09646747B2

公开(公告)日：2017-05-09

申请号：US14373900

申请日：2012-12-26

Applicant: ROHM CO., LTD.

Inventor： Hiroshi Tamagawa ,  Hiroki Yamamoto ,  Katsuya Matsuura ,  Yasuhiro Kondo

IPC: H01C10/50 ,  H01G5/38 ,  H01G5/40 ,  H01F29/00 ,  H01F27/40 ,  H01L25/10 ,  H01G5/011 ,  H01C1/14 ,  H01L27/15 ,  H01L33/62 ,  H01L25/13 ,  H01C10/16 ,  H01F27/28 ,  H01L27/08 ,  H01C17/23 ,  H05K3/34 ,  H01L23/00 ,  H01C17/00 ,  H01F17/00

CPC classification number: H01C1/14 ,  H01C10/16 ,  H01C10/50 ,  H01C17/006 ,  H01C17/23 ,  H01F17/0006 ,  H01F27/2804 ,  H01F27/40 ,  H01F29/00 ,  H01F29/08 ,  H01F41/041 ,  H01G2/16 ,  H01G4/33 ,  H01G4/38 ,  H01G4/40 ,  H01G5/011 ,  H01G5/38 ,  H01G5/40 ,  H01L24/32 ,  H01L25/105 ,  H01L25/13 ,  H01L27/0802 ,  H01L27/15 ,  H01L33/62 ,  H01L2221/68304 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2933/0066 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/3478 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10212 ,  H05K2203/0415 ,  Y02P70/613 ,  H01L2924/00

Abstract: A chip component includes a substrate, an element circuit network including a plurality of element parts formed on the substrate, an external connection electrode provided on a surface of the substrate to provide external connection for the element circuit network, a plurality of fuses formed on the substrate and disconnectably connecting each of the plurality of element parts to the external connection electrode, a solder layer formed on an external connection terminal of the external connection electrode and a resin film which covers the surface of the substrate and other surface which intersects the surface of the substrate.

公开(公告)号：US10763016B2

公开(公告)日：2020-09-01

申请号：US16231937

申请日：2018-12-24

Applicant: ROHM CO., LTD.

Inventor： Hiroshi Tamagawa ,  Hiroki Yamamoto ,  Katsuya Matsuura ,  Yasuhiro Kondo

IPC: H01C1/14 ,  H01G5/38 ,  H01G2/16 ,  H01F27/40 ,  H01F27/28 ,  H01C10/50 ,  H01C10/16 ,  H01G5/011 ,  H01L27/08 ,  H01C17/00 ,  H01C17/23 ,  H05K3/34 ,  H01L33/62 ,  H01G4/38 ,  H01G4/40 ,  H01L25/10 ,  H01L25/13 ,  H01L27/15 ,  H01G4/33 ,  H01G5/40 ,  H05K1/18 ,  H01F29/08 ,  H01F41/04 ,  H01L23/00 ,  H01F29/00 ,  H01F17/00

Abstract: A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.

公开(公告)号：US10593480B2

公开(公告)日：2020-03-17

申请号：US16031212

申请日：2018-07-10

Applicant: ROHM CO., LTD.

Inventor： Hiroki Yamamoto ,  Keishi Watanabe ,  Hiroshi Tamagawa

IPC: H01G4/30 ,  H01L23/522 ,  H01L27/10 ,  H01L27/24 ,  H01L23/00 ,  H01L27/06 ,  H01L49/02 ,  H01G2/06 ,  H01G4/40 ,  H01L29/66 ,  H01L29/94 ,  H01L21/66 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18 ,  H01G4/005 ,  H01G4/228 ,  H01G4/232 ,  H05K3/34

Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.

公开(公告)号：US09735225B2

公开(公告)日：2017-08-15

申请号：US14956939

申请日：2015-12-02

Applicant: ROHM CO., LTD.

Inventor： Hiroshi Tamagawa ,  Yasuhiro Kondo ,  Yasuhiro Fuwa ,  Hiroyuki Okada ,  Eiji Nukaga ,  Katsuya Matsuura

IPC: H01C10/00 ,  H01L49/02 ,  H01L27/08 ,  H01L27/06 ,  H01L21/308 ,  H01C1/14 ,  H01C13/02 ,  H01L21/3065 ,  H01C17/242 ,  H01C17/00 ,  H05K3/34

CPC classification number: H01L28/20 ,  H01C1/14 ,  H01C13/02 ,  H01C17/006 ,  H01C17/242 ,  H01L21/3065 ,  H01L21/3083 ,  H01L27/0676 ,  H01L27/0802 ,  H05K3/3431 ,  H05K2201/10674

Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

公开(公告)号：US20150034981A1

公开(公告)日：2015-02-05

申请号：US14373900

申请日：2012-12-26

Applicant: ROHM CO., LTD.

Inventor： Hiroshi Tamagawa ,  Hiroki Yamamoto ,  Katsuya Matsuura ,  Yasuhiro Kondo

IPC: H01C10/50 ,  H01G5/38 ,  H01G5/40 ,  H01F29/00 ,  H01F27/40 ,  H01L25/10 ,  H01G5/011 ,  H01C1/14 ,  H01L27/15 ,  H01L33/62 ,  H01L25/13 ,  H01C10/16 ,  H01F27/28

CPC classification number: H01C1/14 ,  H01C10/16 ,  H01C10/50 ,  H01C17/006 ,  H01C17/23 ,  H01F17/0006 ,  H01F27/2804 ,  H01F27/40 ,  H01F29/00 ,  H01F29/08 ,  H01F41/041 ,  H01G2/16 ,  H01G4/33 ,  H01G4/38 ,  H01G4/40 ,  H01G5/011 ,  H01G5/38 ,  H01G5/40 ,  H01L24/32 ,  H01L25/105 ,  H01L25/13 ,  H01L27/0802 ,  H01L27/15 ,  H01L33/62 ,  H01L2221/68304 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2933/0066 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/3478 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10212 ,  H05K2203/0415 ,  Y02P70/613 ,  H01L2924/00

Abstract: [Problem] There is a need for a chip component which has excellent mountability, which can accommodate multiple types of requested values with a common basic design, and which has improved geometric accuracy and micromachining accuracy.[Solution] A chip resistor (10) (chip component) which includes: a substrate (11); an element circuit network (20, 21) which includes multiple element parts formed on the substrate (11); an external connection electrode (12) provided on the substrate (11) for external connection to the element circuit network (20, 21); multiple fuses provided on the substrate (11) for detachably connecting the element parts and the external connection electrode (12); and a solder layer (124) formed on the external connection terminal of the external connection electrode (12).[Effect] Because the external connection electrode (12) provided on the chip resistor (10) includes a solder layer (124) on the outside connection terminal, during mounting of the chip resistor (10), the chip resistor (10) can be easily mounted without solder printing. Further, the amount of solder used for mounting is decreased, and chip resistors (10) can be achieved in which solder extrusions do not occur and which can be mounted with high density.

Abstract translation: [问题]需要具有优异的安装性的芯片部件，其可以容纳具有通用基本设计的多种类型的请求值，并且具有改进的几何精度和微加工精度。 [解决方案]芯片电阻器（10）（芯片部件），其包括：基板（11）; 元件电路网络（20,21），其包括形成在所述基板（11）上的多个元件部分; 设置在所述基板（11）上用于与所述元件电路网络（20,21）外部连接的外部连接电极（12）。 设置在基板（11）上的用于可拆卸地连接元件部分和外部连接电极（12）的多个熔丝; 以及形成在外部连接电极（12）的外部连接端子上的焊料层（124）。 [效果]由于设置在片式电阻器（10）上的外部连接电极（12）在外部连接端子上包括焊料层（124），所以在安装芯片电阻器（10）期间，芯片电阻器（10）可以 容易安装，无需焊锡印刷。 此外，用于安装的焊料的量减少，并且可以实现不会发生焊料挤出并且可以以高密度安装的芯片电阻器（10）。

公开(公告)号：US10446302B2

公开(公告)日：2019-10-15

申请号：US15352263

申请日：2016-11-15

Applicant: ROHM CO., LTD.

Inventor： Eiji Nukaga ,  Hiroshi Tamagawa ,  Yasuhiro Kondo ,  Katsuya Matsuura

IPC: H01C17/00 ,  H01C17/242 ,  H01C7/00 ,  H01C13/02 ,  H01C17/06 ,  H01G2/06 ,  H01C17/08 ,  H01F27/40 ,  H01G4/38 ,  H01G4/40 ,  H01L21/3065 ,  H01L21/78 ,  H01L23/525 ,  H01L23/528 ,  H01L29/66 ,  H01L29/861

Abstract: A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape.

公开(公告)号：US10210971B2

公开(公告)日：2019-02-19

申请号：US15490333

申请日：2017-04-18

Applicant: ROHM CO., LTD.

Inventor： Hiroshi Tamagawa ,  Hiroki Yamamoto ,  Katsuya Matsuura ,  Yasuhiro Kondo

IPC: H01C1/14 ,  H01C10/16 ,  H01C17/00 ,  H01G5/40 ,  H01L33/62 ,  H05K1/18 ,  H05K3/34 ,  H01F29/08 ,  H01F41/04 ,  H01L27/15 ,  H01G5/011 ,  H01G5/38 ,  H01L27/08 ,  H01C17/23 ,  H01C10/50 ,  H01F27/28 ,  H01F27/40 ,  H01F29/00 ,  H01L25/10 ,  H01L25/13 ,  H01L23/00 ,  H01G4/33 ,  H01G4/38 ,  H01G4/40 ,  H01G2/16 ,  H01F17/00

Abstract: A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

公开(公告)号：US10178768B2

公开(公告)日：2019-01-08

申请号：US15360573

申请日：2016-11-23

Applicant: ROHM CO., LTD.

Inventor： Katsuya Matsuura ,  Hiroshi Tamagawa

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34

Abstract: A mounting substrate includes a substrate, a connection electrode, which is formed on a front surface of the substrate and on which an electronic component is mounted via a conductive bonding material, a resist film, formed on the front surface of the substrate so as to cover a peripheral edge portion of the connection electrode, and a receiving portion, formed in the resist film so as to expose a portion of the peripheral edge portion of the connection electrode and arranged to receive an excess portion of the conductive bonding material.

公开(公告)号：US09685273B2

公开(公告)日：2017-06-20

申请号：US15051648

申请日：2016-02-23

Applicant: ROHM CO., LTD.

Inventor： Hiroki Yamamoto ,  Keishi Watanabe ,  Hiroshi Tamagawa

IPC: H01L27/00 ,  H01G4/30 ,  H01L23/522 ,  H01L27/10 ,  H01L27/24 ,  H01L23/00 ,  H01G4/40 ,  H01L29/66 ,  H01L29/94 ,  H01G2/06 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18 ,  H01L21/66 ,  H01L27/06 ,  H01G4/005 ,  H01G4/228 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/005 ,  H01G4/228 ,  H01G4/232 ,  H01G4/40 ,  H01L22/14 ,  H01L22/20 ,  H01L23/5223 ,  H01L24/48 ,  H01L24/49 ,  H01L27/0629 ,  H01L27/0676 ,  H01L27/101 ,  H01L27/2409 ,  H01L28/40 ,  H01L29/66189 ,  H01L29/94 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/162 ,  H05K1/18 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10015 ,  H05K2201/10045 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.