Invention Grant
- Patent Title: Chip capacitor, circuit assembly, and electronic device
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Application No.: US16031212Application Date: 2018-07-10
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Publication No.: US10593480B2Publication Date: 2020-03-17
- Inventor: Hiroki Yamamoto , Keishi Watanabe , Hiroshi Tamagawa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2012-242834 20121102; JP2013-183157 20130904
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01L23/522 ; H01L27/10 ; H01L27/24 ; H01L23/00 ; H01L27/06 ; H01L49/02 ; H01G2/06 ; H01G4/40 ; H01L29/66 ; H01L29/94 ; H01L21/66 ; H05K1/11 ; H05K1/16 ; H05K1/18 ; H01G4/005 ; H01G4/228 ; H01G4/232 ; H05K3/34
Abstract:
A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.
Public/Granted literature
- US20180323011A1 CHIP CAPACITOR, CIRCUIT ASSEMBLY, AND ELECTRONIC DEVICE Public/Granted day:2018-11-08
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