Invention Grant
- Patent Title: Chip capacitor, circuit assembly, and electronic device
-
Application No.: US15051648Application Date: 2016-02-23
-
Publication No.: US09685273B2Publication Date: 2017-06-20
- Inventor: Hiroki Yamamoto , Keishi Watanabe , Hiroshi Tamagawa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2012-242834 20121102; JP2013-183157 20130904
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01G4/30 ; H01L23/522 ; H01L27/10 ; H01L27/24 ; H01L23/00 ; H01G4/40 ; H01L29/66 ; H01L29/94 ; H01G2/06 ; H05K1/11 ; H05K1/16 ; H05K1/18 ; H01L21/66 ; H01L27/06 ; H01G4/005 ; H01G4/228 ; H01G4/232
Abstract:
A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.
Public/Granted literature
- US20160211077A1 CHIP CAPACITOR, CIRCUIT ASSEMBLY, AND ELECTRONIC DEVICE Public/Granted day:2016-07-21
Information query
IPC分类:
