Abstract:
An electrical circuit comprising at least two negative capacitance insulators connected in series, one of the two negative capacitance insulators is biased to generate a negative capacitance. One of the negative capacitance insulators may include an air-gap which is part of a nanoelectromechnical system (NEMS) device and the second negative capacitance insulator includes a ferroelectric material. Both of the negative capacitance insulators may be located between the channel and gate of a field effect transistor. The NEMS device may include a movable electrode, a dielectric and a fixed electrode and arranged so that the movable electrode is attached to at least two points and spaced apart from the dielectric and fixed electrode, and the ferroelectric capacitor is electrically connected to either of the electrodes.
Abstract:
A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.
Abstract:
An improved MEMS transducer apparatus and method. The method includes providing a movable base structure having a base surface region overlying a substrate and a center cavity with a cavity surface region. At least one center anchor structure and one spring structure can be spatially disposed within a substantially circular portion of the surface region. The spring structure(s) can be coupled the center anchor structure(s) to a portion of the cavity surface region. The substantially circular portion can be configured within a vicinity of the center of the surface region. At least one capacitor element, having a fixed and a movable capacitor element, can be spatially disposed within a vicinity of the cavity surface region. The fixed capacitor element(s) can be coupled to the center anchor structure(s) and the movable capacitor element(s) can be spatially disposed on a portion of the cavity surface region.
Abstract:
Techniques are described herein that perform capacitance-based pressure sensing using pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. The void has a shape that is configured to change based on a change of pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel. The pressure vessel may be formed in the shape of an enclosed loop (e.g., along a path that is perpendicular to the cross section), resulting in a looped pressure vessel. For instance, an end of the pressure vessel may be connected to another end of the pressure vessel to form the enclosed loop.
Abstract:
A variable leaf capacitor is disclosed. In accordance with some embodiments of the present disclosure, a variable leaf capacitor may comprise a first alternating current coupling capacitor having a first terminal coupled to a first differential node and a second terminal coupled to a first common-mode node, a second alternating current coupling capacitor having a first terminal coupled to a second differential node and a second terminal coupled to a second common-mode node, and a varactor having a bias terminal, a first common-mode terminal coupled to the first common-mode node, and a second common-mode terminal coupled to the second common-mode node, wherein the capacitance of the varactor is based on the voltage from the first common-mode terminal of the varactor to the bias terminal of the varactor and on the voltage from the second common-mode terminal of the varactor to the bias terminal of the varactor.
Abstract:
Integrated Microelectromechanical System (“MEMS”) devices and methods for making the same. The MEMS devices comprise a substrate (200) and a MEMS filter device (100) mechanically suspended above a major surface of the substrate. A first gas gap (202) exists between the major surface of the substrate and the MEMS filter device. An isolation platform (500) is provided to absorb vibrations from an external environment prior to reaching the MEMS filter device. In this regard, the isolation platform comprises: a frame structure (510) framing a periphery of the MEMS filter device; and at least one resilient component (512-518) coupled between the frame structure and the MEMS filter device. The frame structure is mechanically connected to the substrate. Electronic circuitry is connected to the MEMS filter device via a resilient interconnection (204, 206) that is movable in at least one direction of the vibrations.
Abstract:
A voltage-controlled capacitor and methods for forming the same are described. A mechanical conductor membrane of the voltage-controlled capacitor is movable to and from a first position and a second position. An amount of capacitance can vary with the movement of the mechanical conductor membrane. A microelectromechanical systems (MEMS) voltage-controlled capacitor can be used in a variety of applications, such as, but not limited to, RF switches and RF attenuators.
Abstract:
The electronic device comprising a micro-electromechanical systems (MEMS) element at a first side of a substrate (14). The MEMS element comprises a first electrode (101) and a second electrode (11), that is part of a movable element and movable towards and from the first electrode between a first and a second position. The second electrode (11) is separated from the first electrode (101) by an air gap (110) in its first position. The movable element comprises a mechanical layer (12) and an intermediate layer, in which the second electrode (11) is defined. The second electrode (11) is constituted by a plurality of sections (131, 132, 133) in the intermediate layer, each of which is mechanically connected by a separate vertical interconnect (121, 122, 123) to the mechanical layer (12).
Abstract:
The device improved according to the invention comprises a micro-electromechanical switch (MEMS) with a piezoelectric element connected to a mechanical support on both sides at the edges. The electrode design of this piezoelectric element is characterized by two electrodes mounted on at least one of the surfaces.
Abstract:
A system and method for manufacturing micro cavity packaging enclosure at the wafer level using MEMS (MicroElectroMechanical Systems) process, wherein micro cavities are formed from epoxy-bonded single-crystalline silicon wafer as its cap, epoxy and deposited metal or insulator as at least part of its sidewall, on substrate wafers.