- 专利标题： Patterned Wafer and Method of Making the Same
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申请号： US15782500申请日： 2017-10-12
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公开(公告)号： US20180033675A1公开(公告)日： 2018-02-01
- 发明人: Min-Ho Hsiao , Pang-Yen Lee , Yen-Hao Tseng
- 申请人： Wafer Mems Co., Ltd.
- 优先权： TW104120520 20150625
- 主分类号： H01L21/70
- IPC分类号： H01L21/70 ; H01L27/01 ; H01F17/00 ; H01L49/02
摘要：
A patterned wafer used for production of passive-component chip bodies includes a peripheral end portion and at least one passive-component unit that including a connecting portion, a breaking line, and a plurality of spaced apart chip bodies. The connecting portion is connected to the peripheral end portion and is spaced apart from the chip bodies by a tab-accommodating space along a first direction. The breaking line has a plurality of connecting tabs that are spaced apart from one another and that are disposed in the tab-accommodating space. Each of the connecting tabs interconnects the connecting portion and a respective one of the chip bodies. A method for making the patterned wafer is also disclosed.
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