知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

15 条记录 (耗时 0.013 秒)

    Embedded Passive Chip Device and Method of Making the Same
    1.
    发明申请
    Embedded Passive Chip Device and Method of Making the Same 有权
    嵌入式无源芯片器件及其制作方法

    公开(公告)号：US20160380041A1

    公开(公告)日：2016-12-29

    申请号：US15152877

    申请日：2016-05-12

    申请人： Wafer Mems Co., LTD.

    发明人： Min-Ho Hsiao ,  Pang-Yen Lee ,  Yen-Hao Tseng

    IPC分类号： H01L49/02 ,  H01L23/544 ,  H01L21/78 ,  H01L21/768

    CPC分类号： H01L28/10 ,  H01F17/0006 ,  H01F41/04 ,  H01F41/046 ,  H01F2017/0066 ,  H01L21/76873 ,  H01L21/78 ,  H01L23/645

    摘要： An embedded passive chip device includes a chip body and a functional layered structure. The chip body has a circuit-forming surface that is formed with a recess. The functional layered structure is formed on the chip body and includes a conductive layer that has at least a portion which covers at least partially the circuit-forming surface, and a magnetic layer that is disposed within the recess and that is inductively coupled to the conductive layer for generating inductance. A method of making the embedded passive chip device is also disclosed.

    摘要翻译： 嵌入式无源芯片器件包括芯片体和功能分层结构。 芯体具有形成凹部的电路形成面。 功能分层结构形成在芯片体上，并且包括具有至少部分覆盖电路形成表面的至少一部分的导电层，以及设置在凹部内并且与导电性电感耦合的磁性层 产生电感层。 还公开了一种制造嵌入式无源芯片器件的方法。

    High Frequency Inductor Chip and Method of Making the Same
    3.
    发明申请
    High Frequency Inductor Chip and Method of Making the Same 有权
    高频电感芯片及其制作方法

    公开(公告)号：US20160379748A1

    公开(公告)日：2016-12-29

    申请号：US15152806

    申请日：2016-05-12

    申请人： Wafer Mems Co., LTD.

    发明人： Min-Ho Hsiao ,  Pang-Yen Lee ,  Yen-Hao Tseng

    IPC分类号： H01F27/28 ,  H01F41/04

    CPC分类号： H01F41/042 ,  H01F17/0006 ,  H01F2017/004

    摘要： A high frequency inductor chip includes a core and a coil. The core is in the form of a single piece of a non-magnetic material. The coil is deposited on and surrounds the core and has structural characteristics indicative of the coil being formed on the core by deposition techniques. A method for making the high frequency inductor chip is also disclosed.

    摘要翻译： 高频电感芯片包括芯和线圈。 芯是单片非磁性材料的形式。 线圈沉积在芯上并围绕芯并且具有指示线圈通过沉积技术形成在芯上的结构特征。 还公开了制造高频电感器芯片的方法。

    Patterned Wafer and Method of Making the Same
    5.
    发明申请
    Patterned Wafer and Method of Making the Same 审中-公开
    图案晶片及其制作方法

    公开(公告)号：US20160379969A1

    公开(公告)日：2016-12-29

    申请号：US15152885

    申请日：2016-05-12

    申请人： Wafer Mems Co., LTD.

    发明人： Min-Ho Hsiao ,  Pang-Yen Lee ,  Yen-Hao Tseng

    IPC分类号： H01L27/01 ,  H01L21/70 ,  H01L49/02

    CPC分类号： H01L21/705 ,  H01F17/0006 ,  H01L27/016 ,  H01L28/10

    摘要： A patterned wafer used for production of passive-component chip bodies includes a peripheral end portion and at least one passive-component unit that including a connecting portion, a breaking line, and a plurality of spaced apart chip bodies. The connecting portion is connected to the peripheral end portion and is spaced apart from the chip bodies by a tab-accommodating space along a first direction. The breaking line has a plurality of connecting tabs that are spaced apart from one another and that are disposed in the tab-accommodating space. Each of the connecting tabs interconnects the connecting portion and a respective one of the chip bodies. A method for making the patterned wafer is also disclosed.

    摘要翻译： 用于制造无源元件芯片体的图案化晶片包括外围端部和至少一个无源部件单元，其包括连接部分，断开线和多个间隔开的芯片体。 连接部分连接到周边端部，并且沿着第一方向由片状容纳空间与芯片体间隔开。 断线具有彼此间隔开并且设置在突片容纳空间中的多个连接突片。 每个连接翼片将连接部分和相应的一个芯片体相互连接。 还公开了制造图案化晶片的方法。

    Magnetic Patterned Wafer Used for Production of Magnetic-Core-Inductor Chip Bodies and Methods of Making the Same
    6.
    发明申请
    Magnetic Patterned Wafer Used for Production of Magnetic-Core-Inductor Chip Bodies and Methods of Making the Same 审中-公开
    用于生产磁芯电感芯片体的磁图形晶片及其制造方法

    公开(公告)号：US20160379745A1

    公开(公告)日：2016-12-29

    申请号：US15152804

    申请日：2016-05-12

    申请人： Wafer Mems Co., LTD.

    发明人： Min-Ho Hsiao ,  Pang-Yen Lee ,  Yen-Hao Tseng

    IPC分类号： H01F27/24 ,  H01F27/28 ,  H01F41/04 ,  H01F41/02

    CPC分类号： H01F27/24 ,  H01F3/08 ,  H01F17/04 ,  H01F27/2804 ,  H01F41/02 ,  H01F41/0206 ,  H01F41/041

    摘要： A magnetic patterned wafer used for production of magnetic-core-inductor chip bodies includes a peripheral end portion and at least one core chip unit that including a connecting portion, a breaking line, and a plurality of spaced apart chip bodies. The connecting portion is connected to the peripheral end portion and is spaced apart from the chip bodies by a tab-accommodating space. The breaking line has a plurality of connecting tabs that are spaced apart from one another and that are disposed in the tab-accommodating space. Each of the connecting tabs interconnects the connecting portion and a respective one of the chip bodies. The patterned wafer is made from a magnetic material.

    摘要翻译： 用于制造磁芯 - 电感器芯片体的磁性图案化晶片包括外围端部和至少一个芯片单元，其包括连接部分，断开线和多个间隔开的芯片体。 连接部分连接到周边端部并且通过片状物容纳空间与芯片体间隔开。 断线具有彼此间隔开并且设置在突片容纳空间中的多个连接突片。 每个连接翼片将连接部分和相应的一个芯片体相互连接。 图案化晶片由磁性材料制成。