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公开(公告)号：US20180096760A1
公开(公告)日：2018-04-05
申请号：US15821433
申请日：2017-11-22
IPC分类号： H01C17/065 , H01L21/02 , H01L21/762 , H01L23/64 , H01L23/62
CPC分类号： H01C7/108 , H01C7/006 , H01C7/1013 , H01C7/112 , H01C7/12 , H01C17/006 , H01C17/06553 , H01C17/12 , H01C17/245 , H01C17/288 , H01L21/02175 , H01L21/022 , H01L21/02266 , H01L21/762 , H01L23/5226 , H01L23/528 , H01L23/62 , H01L23/647 , H01L27/0248 , H01L28/20 , H01L28/24 , H01L29/0649 , H01L2924/0002 , H01L2924/00
摘要： A structure and method for fabricating a laterally configured thin film varistor surge protection device using low temperature sputtering techniques which do not damage IC device components contiguous to the varistor being fabricated. The lateral thin film varistor may include a continuous layer of alternating regions of a first metal oxide layer and a second metal oxide layer formed between two laterally spaced electrodes using a low temperature sputtering process followed by a low temperature annealing process.
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公开(公告)号：US09865674B2
公开(公告)日：2018-01-09
申请号：US15386256
申请日：2016-12-21
IPC分类号： H01L49/02 , H01L21/02 , H01C7/10 , H01C7/112 , H01C17/00 , H01C7/12 , H01L27/02 , H01L23/64 , H01L21/762 , H01L23/522 , H01L23/528 , H01L23/62 , H01L29/06 , H01C17/12
CPC分类号： H01C7/108 , H01C7/006 , H01C7/1013 , H01C7/112 , H01C7/12 , H01C17/006 , H01C17/06553 , H01C17/12 , H01C17/245 , H01C17/288 , H01L21/02175 , H01L21/022 , H01L21/02266 , H01L21/762 , H01L23/5226 , H01L23/528 , H01L23/62 , H01L23/647 , H01L27/0248 , H01L28/20 , H01L28/24 , H01L29/0649 , H01L2924/0002 , H01L2924/00
摘要： A structure and method for fabricating a laterally configured thin film varistor surge protection device using low temperature sputtering techniques which do not damage IC device components contiguous to the varistor being fabricated. The lateral thin film varistor may include of a continuous layer of alternating regions of a first metal oxide layer and a second metal oxide layer formed between two laterally spaced electrodes using a low temperature sputtering process followed by a low temperature annealing process.
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公开(公告)号：US20170271053A1
公开(公告)日：2017-09-21
申请号：US15457423
申请日：2017-03-13
申请人： ROHM CO., LTD.
发明人： Masaki YONEDA
CPC分类号： H01C1/142 , H01C1/012 , H01C1/148 , H01C7/003 , H01C17/006 , H01C17/242 , H01C17/281 , H01C17/288
摘要： The present invention provides a chip resistor and a method of making the same for alleviating stress resulted from thermal expansion difference and thus suppressing cracks. A chip resistor includes: a substrate, having a carrying surface and a mounting surface facing away from each other; a pair of upper electrodes, disposed at two ends of the carrying surface; a resistor, disposed on the carrying surface and between the pair of upper electrodes, and electrically connected to the pair of upper electrodes; a stress relaxation layer having flexibility and formed on the mounting surface of the substrate; a metal thin film layer, formed on a surface of the stress relaxation layer opposite to the substrate; a side electrode for electrically connecting the upper electrodes and the metal thin film layer; and a plating layer covering the side electrode and the metal thin film layer.
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公开(公告)号：US09520215B2
公开(公告)日：2016-12-13
申请号：US13718415
申请日：2012-12-18
申请人： ROHM CO., LTD.
发明人： Masaki Yoneda
CPC分类号： H01C17/006 , H01C1/148 , H01C7/003 , H01C17/28 , H01C17/281 , H01C17/288 , Y10T29/49082 , Y10T29/49101
摘要： A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.
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公开(公告)号：US20160254344A1
公开(公告)日：2016-09-01
申请号：US15149652
申请日：2016-05-09
IPC分类号： H01L49/02 , H01L29/06 , H01L23/528 , H01L21/762 , H01C17/12 , H01L27/02 , H01C7/12 , H01C7/00 , H01C17/00 , H01L23/522 , H01L21/02
CPC分类号： H01C7/108 , H01C7/006 , H01C7/1013 , H01C7/112 , H01C7/12 , H01C17/006 , H01C17/06553 , H01C17/12 , H01C17/245 , H01C17/288 , H01L21/02175 , H01L21/022 , H01L21/02266 , H01L21/762 , H01L23/5226 , H01L23/528 , H01L23/62 , H01L23/647 , H01L27/0248 , H01L28/20 , H01L28/24 , H01L29/0649 , H01L2924/0002 , H01L2924/00
摘要： A structure and method for fabricating a laterally configured thin film varistor surge protection device using low temperature sputtering techniques which do not damage IC device components contiguous to the varistor being fabricated. The lateral thin film varistor may include a continuous layer of alternating regions of a first metal oxide layer and a second metal oxide layer formed between two laterally spaced electrodes using a low temperature sputtering process followed by a low temperature annealing process.
摘要翻译： 一种使用低温溅射技术制造横向配置的薄膜压敏电阻浪涌保护装置的结构和方法，其不会损坏与正在制造的压敏电阻相邻的IC器件部件。 横向薄膜压敏电阻可以包括使用低温溅射工艺，随后是低温退火工艺的第二金属氧化物层和形成在两个横向隔开的电极之间的第二金属氧化物层的交替区域的连续层。
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6.发明申请HEATABLE MOTOR VEHICLE OPERATING LIQUID TANK AND METHOD OF PRODUCING THE HEATING DEVICE FOR IT 审中-公开热电动车辆操作液体罐和生产加热装置的方法公开(公告)号：US20160138455A1
公开(公告)日：2016-05-19
申请号：US14941091
申请日：2015-11-13
发明人： Fabrizio Chini , Ivan De Metri , Luca Marini , Francesca Brunori
CPC分类号： H01C17/02 , F01N3/2066 , F01N2610/10 , F01N2610/1406 , H01C1/142 , H01C7/102 , H01C17/283 , H01C17/288 , Y02A50/2325 , Y02T10/24
摘要： A motor vehicle operating liquid tank, in particular for storing aqueous urea solution, with a tank shell surrounding a tank volume and with a tank opening extending through the tank shell, wherein a planar heating device in the tank volume is provided with an electrical resistance heating track arranged sandwiched between two plastic films that oppose one another in a planar manner and encase the resistance heating track, the plastic films opposing one another in a planar manner and each have a layer of compatible, thermoplastic plastics at least on their surfaces facing one another which are connected to one another locally at least along a seam track surrounding the electrical resistance heating track, wherein slot areas are provided inside this seam track in which plastic film sections lie opposite one another in an unconnected manner without the intermediate arrangement of a section of a resistance heating track between them.
摘要翻译： 一种机动车辆操作液体罐，特别是用于储存尿素水溶液，其具有围绕罐体积的罐壳和延伸穿过罐壳的罐开口，其中罐体积中的平面加热装置设置有电阻加热 磁道布置在夹在两个以平面方式彼此相对的塑料膜之间并且包围电阻加热轨道，塑料膜以平面方式彼此相对，并且每个塑料膜至少在彼此面对的表面上具有一层相容的热塑性塑料 其至少沿着围绕电阻加热轨道的接缝轨道彼此局部连接，其中槽区域设置在该接缝轨道内部，其中塑料膜部分以不连接的方式彼此相对设置，而没有一部分 它们之间的电阻加热轨迹。
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公开(公告)号：US09251936B2
公开(公告)日：2016-02-02
申请号：US14228780
申请日：2014-03-28
CPC分类号： H01C17/003 , H01C1/142 , H01C3/00 , H01C17/24 , H01C17/288 , Y10T29/49082 , Y10T29/49098
摘要： A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.
摘要翻译： 提供金属条电阻。 金属带状电阻器包括形成电阻元件的金属条，并且在不使用单独基板的情况下为金属带状电阻器提供支撑。 存在覆盖金属条的第一和第二相对端子。 每个第一和第二相对端子上都有电镀。 还有在第一和第二相对端子之间覆盖金属带的绝缘材料。 提供一种用于形成金属带状电阻器的方法，其中金属带为不使用单独基板的金属带状电阻器提供支撑。 该方法包括将绝缘材料涂覆到金属条上，施加光刻工艺以形成覆盖电阻材料的导电图案，其中导电图案包括第一和第二相对端子，电镀导电图案，以及调整金属带的电阻。
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公开(公告)号：US20120126934A1
公开(公告)日：2012-05-24
申请号：US13185065
申请日：2011-07-18
申请人： Michael Belman , Leonid Akhtman
发明人： Michael Belman , Leonid Akhtman
CPC分类号： H01C1/034 , H01C17/288
摘要： A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electrodes 12 and overlaps them partially, an optional internal protective coating 15 that covers resistive element 14 completely or partially, an external protective coating 16 that covers completely the internal protection coating 15 and partially covers top terminal electrodes 12, a plated layer of nickel 17 that covers face sides of the substrate, top 12 and bottom 13 electrodes, and overlaps partially external protective coating 16, finishing plated layer 18 that covers nickel layer 17. The overlap of nickel layer 17 and external protective layer 16 possesses a sealing property because of metallization of the edges of external protective layer 16 prior to the nickel plating process.
摘要翻译： 芯片电阻器包括绝缘基板11，使用银基金属陶瓷在基板的顶表面上形成的顶部端子电极12，底部电极13，位于顶部端子电极12之间并与其部分重叠的电阻元件14，可选内部 完全或部分覆盖电阻元件14的保护涂层15，完全覆盖内部保护涂层15并且部分地覆盖顶部端子电极12的外部保护涂层16，覆盖基底的正面的镍17的镀层，顶部12和 底部13个电极，并且部分地覆盖外部保护涂层16，覆盖镍层17的整理镀层18.镍层17和外部保护层16的重叠由于外部保护层16的边缘的金属化而具有密封特性， 镀镍工艺。
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公开(公告)号：US20110018677A1
公开(公告)日：2011-01-27
申请号：US12839888
申请日：2010-07-20
申请人： Masaki YONEDA
发明人： Masaki YONEDA
CPC分类号： H01C17/006 , H01C1/148 , H01C7/003 , H01C17/28 , H01C17/281 , H01C17/288 , Y10T29/49082 , Y10T29/49101
摘要： A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.
摘要翻译： 制造片式电阻器的方法包括以下步骤。 在材料基板的正面上形成电阻层。 通过在材料基板的正面中形成多个在第一方向上被拉长的多个第一凹槽，在材料基板中形成多个基板部分。 导体层形成在每个第一凹槽中。 沿着沿与第一方向不同的第二方向延伸的线切割衬底部分。
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公开(公告)号：US06610925B1
公开(公告)日：2003-08-26
申请号：US09705584
申请日：2000-11-03
申请人： Masaya Wajima
发明人： Masaya Wajima
IPC分类号： H01L2302
CPC分类号： H03H9/0561 , H01C1/142 , H01C17/288 , H01G4/40 , H03H9/0514 , H03H9/1014 , H03H9/1035 , H03H9/177
摘要： A surface mounting electronic component with external electrodes has a structure in which plated coatings are laminated on metallic coatings by a wet barrel plating method, so as to achieve reduced variation in thickness of the plated coatings of the plurality of external electrodes and reduced defective component frequency rate, with the result that materials for the plated coatings can be utilized efficiently. A plurality of external electrodes are disposed on the outer surfaces of an electronic component body. Each of the external electrodes includes metallic coatings and plated coatings disposed on the metallic coatings by a wet plating method. The area of each of the plurality of electrodes is approximately the same, and the total of lengths of each of the external electrodes on the edges of the electronic component body is approximately the same.
摘要翻译： 具有外部电极的表面安装电子部件具有通过湿式滚镀法将镀覆层层压在金属涂层上的结构，以便实现多个外部电极的镀覆层的厚度变化减小，并且减少的缺陷分量频率 速率，结果是可以有效地利用电镀涂层的材料。 多个外部电极设置在电子部件主体的外表面上。 每个外部电极包括通过湿式电镀法设置在金属涂层上的金属涂层和镀覆的涂层。 多个电极中的每一个的面积大致相同，并且电子部件主体的边缘上的每个外部电极的长度的总和大致相同。
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