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公开(公告)号：US09905340B2
公开(公告)日：2018-02-27
申请号：US15102711
申请日：2014-11-19
申请人： KOA CORPORATION
发明人： Sohei Koda , Yuya Takeue
IPC分类号： H01C7/00 , H01C17/00 , H01C17/065 , H01C17/28 , H01C1/142
CPC分类号： H01C7/003 , H01C1/142 , H01C7/00 , H01C17/006 , H01C17/065 , H01C17/28 , H01C17/281 , H01C17/283
摘要： A method for manufacturing a chip resistive element including a substrate, a resistor formed on the substrate, and electrodes connected to opposite ends of the resistor, the method including an electrode forming step of forming the electrodes on the substrate. The electrode forming step includes a step of forming a first electrode layer on the substrate using a first electrode material containing silver, and a step of forming a second electrode layer on the first electrode layer using a second electrode material containing silver and palladium. The first electrode material has a higher silver content than the second electrode material.
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公开(公告)号：US20160336099A1
公开(公告)日：2016-11-17
申请号：US15110096
申请日：2015-01-07
发明人： Toshiyuki Nagase , Hiroya Ishizuka
CPC分类号： H01C1/084 , H01C1/01 , H01C1/14 , H01C1/142 , H01C1/144 , H01C17/006 , H01C17/28 , H01C17/281 , H01C17/283 , H01L2224/40 , H01L2924/181 , H01L2924/00012
摘要： In this resistor, a heat sink (Al member) (23) and the other surface (11b) of a ceramic substrate (11) are joined together using an Al—Si-based brazing filler material. The Al—Si-based brazing filler material has a melting point in a range of approximately 600° C. to 700° C. When the heat sink (23) and the ceramic substrate (11) are joined together using the Al—Si-based brazing filler material, it is possible to prevent the derogation of the heat resistance and thermal deterioration during joining at the same time.
摘要翻译： 在该电阻器中，使用Al-Si系钎焊料将散热器（Al构件）（23）和陶瓷基板（11）的另一面（11b）接合在一起。 Al-Si系钎焊料的熔点为约600℃〜700℃。当散热器（23）和陶瓷基板（11）使用Al-Si- 可以同时防止接合时的耐热性和热劣化的减损。
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3.发明申请公开(公告)号：US20160293300A1
公开(公告)日：2016-10-06
申请号：US14822893
申请日：2015-08-10
发明人： Xun Xu , Zhiwei Jia
CPC分类号： H01C17/065 , H01C1/142 , H01C7/102 , H01C17/281 , H01C17/283 , H05K3/1225 , H05K3/1291 , H05K3/14 , H05K3/28 , H05K3/4007 , H05K3/4664
摘要： A preparation method for an electronic component with an alloy electrode layer includes steps of printing a metal layer on each of the two opposite surfaces of a ceramic substrate with the metal layer made from aluminum, spraying an alloy layer being a copper alloy layer on an outer surface of each metal layer, connecting a pin to each alloy layer, and enclosing the ceramic substrate, the metal layers, the alloy layers and a portion of each pin with an insulating layer. With the adoption of copper alloy for the alloy layer, the preparation method has the advantages of low production cost and high reliability of the electronic component produced by the method.
摘要翻译： 一种具有合金电极层的电子部件的制备方法，包括以下步骤：在由铝制成的金属层的陶瓷基板的两个相对面的每一面上印刷金属层，在外部喷涂铜合金层的合金层 每个金属层的表面，将销连接到每个合金层，并且用绝缘层包围陶瓷基板，金属层，合金层和每个销的一部分。 随着合金层采用铜合金，制备方法具有生产成本低，可靠性高的优点。
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公开(公告)号：US09449742B2
公开(公告)日：2016-09-20
申请号：US14634823
申请日：2015-02-28
发明人： Jen-Heng Huang
IPC分类号： H01C1/142 , H01C7/102 , H01C17/28 , H01B1/02 , H01G4/232 , H01G4/252 , H01C7/12 , H01C17/06 , H01C1/014 , H01C1/144
CPC分类号： H01C1/142 , H01B1/02 , H01C1/014 , H01C1/144 , H01C7/102 , H01C7/12 , H01C17/06 , H01C17/281 , H01C17/283 , H01G4/232 , H01G4/252
摘要： An electrode component includes a ceramic substrate, two electrode layers formed on two opposite surfaces of the ceramic substrate, two pins respectively connected to the two electrode layers, and an insulating layer enclosing the ceramic substrate, the electrode layers and a portion of each pin. Each electrode layer is formed of two or more base metal materials or alloys thereof, and the concentrations of the base metal materials progressively vary across the electrode layer. Accordingly, the production cost is lowered, environmental pollution caused by evaporation and thermal dissolution of organic solvent can be prevented, risk of separable electrode interface at high-voltage discharge is mitigated, and the fabrication process of the electrode layer is shortened while maintaining bonding strength between the electrode layers and the ceramic substrate and solderability between the electrode layers and the pins.
摘要翻译： 电极部件包括陶瓷基板，形成在陶瓷基板的两个相对表面上的两个电极层，分别连接到两个电极层的两个引脚以及封装陶瓷基板，电极层和每个引脚的一部分的绝缘层。 每个电极层由两种或多种贱金属材料或其合金形成，并且贱金属材料的浓度在电极层上逐渐变化。 因此，可以防止生产成本降低，有机溶剂的蒸发和热溶解引起的环境污染，可以缓解高压放电时的分离电极界面的风险，并且电极层的制造工艺缩短同时保持结合强度 在电极层和陶瓷基板之间以及电极层和引脚之间的可焊性。
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公开(公告)号：US20160183328A1
公开(公告)日：2016-06-23
申请号：US14972840
申请日：2015-12-17
CPC分类号： H05B3/03 , C08G73/101 , C08G73/1039 , C08G73/1042 , C08G73/105 , C08G73/1064 , C08G73/1071 , C08K3/08 , C08K2003/0806 , C08K2003/0812 , C08K2003/0831 , C08K2003/085 , C08K2003/0862 , C09D179/08 , H01C17/06526 , H01C17/06586 , H01C17/283 , H05B3/10 , H05B3/146 , H05B3/24 , H05B3/34 , H05B2203/011 , H05B2203/013
摘要： The present invention relates to the design, construction and manufacture of a novel electrical high temperature heater having a polymer thick film conductor paste with which to form an electrode on resistive film.
摘要翻译： 本发明涉及一种具有聚合物厚膜导体膏的新型电高温加热器的设计，构造和制造，以在电阻膜上形成电极。
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公开(公告)号：US20160086699A1
公开(公告)日：2016-03-24
申请号：US14634823
申请日：2015-02-28
发明人： Jen-Heng Huang
CPC分类号： H01C1/142 , H01B1/02 , H01C1/014 , H01C1/144 , H01C7/102 , H01C7/12 , H01C17/06 , H01C17/281 , H01C17/283 , H01G4/232 , H01G4/252
摘要： An electrode component includes a ceramic substrate, two electrode layers formed on two opposite surfaces of the ceramic substrate, two pins respectively connected to the two electrode layers, and an insulating layer enclosing the ceramic substrate, the electrode layers and a portion of each pin. Each electrode layer is formed of two or more base metal materials or alloys thereof, and the concentrations of the base metal materials progressively vary across the electrode layer. Accordingly, the production cost is lowered, environmental pollution caused by evaporation and thermal dissolution of organic solvent can be prevented, risk of separable electrode interface at high-voltage discharge is mitigated, and the fabrication process of the electrode layer is shortened while maintaining bonding strength between the electrode layers and the ceramic substrate and solderability between the electrode layers and the pins.
摘要翻译： 电极部件包括陶瓷基板，形成在陶瓷基板的两个相对表面上的两个电极层，分别连接到两个电极层的两个引脚以及封装陶瓷基板，电极层和每个引脚的一部分的绝缘层。 每个电极层由两种或多种贱金属材料或其合金形成，并且贱金属材料的浓度在电极层上逐渐变化。 因此，可以防止生产成本降低，有机溶剂的蒸发和热溶解引起的环境污染，可以缓解高压放电时的分离电极界面的风险，并且电极层的制造工艺缩短同时保持结合强度 在电极层和陶瓷基板之间以及电极层和引脚之间的可焊性。
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7.发明申请Apparatus and Method for Establishing an Electrically Conductive and Mechanical Connection 审中-公开用于建立导电和机械连接的装置和方法公开(公告)号：US20160055935A1
公开(公告)日：2016-02-25
申请号：US14784809
申请日：2014-03-24
申请人： EPCOS AG
发明人： Gerald Kloiber , Heinz Strallhofer
CPC分类号： H01B5/02 , B23K20/023 , H01B1/02 , H01C1/1413 , H01C1/144 , H01C7/04 , H01C17/283 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/04042 , H01L2224/05552 , H01L2224/05644 , H01L2224/45144 , H01L2224/45155 , H01L2224/85203
摘要： An apparatus includes a main body having an electrode and a contact element. The contact element is directly mechanically and electrically conductively connected to the electrode in order to form an electrical connection between the main body and the contact element. The electrical and mechanical connection between the electrode and the contact element is free of melting regions of the materials of the electrode and of the contact element that are involved in the connection. Furthermore, the connection is realized in a manner free of connection material, for example, in a manner free of solder material.
摘要翻译： 一种装置包括具有电极和接触元件的主体。 接触元件直接机械地和导电地连接到电极，以便在主体和接触元件之间形成电连接。 电极和接触元件之间的电气和机械连接没有参与连接的电极和接触元件的材料的熔化区域。 此外，连接以不含连接材料的方式实现，例如以不含焊料的方式实现。
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公开(公告)号：US07794628B2
公开(公告)日：2010-09-14
申请号：US12067126
申请日：2006-08-28
IPC分类号： H01B1/06
CPC分类号： H01C1/148 , H01C1/142 , H01C7/003 , H01C17/006 , H01C17/283
摘要： A chip-shaped electronic component includes a substrate and an end face electrode layer provided on an end face of the substrate, in which the end face electrode layer contains a mixed material. The mixed material includes as a conductive particle, a carbon powder, a whisker-like inorganic filler coated with a conductive film, and a flake-like conductive powder. Additionally, an epoxy resin has a weight-average molecular weight between 1,000 and 80,000.
摘要翻译： 片状电子部件包括基板和设置在基板的端面上的端面电极层，其中端面电极层包含混合材料。 混合材料包括作为导电颗粒，碳粉末，涂覆有导电膜的晶须状无机填料和片状导电粉末。 另外，环氧树脂的重均分子量为1,000〜80,000。
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公开(公告)号：US07641817B2
公开(公告)日：2010-01-05
申请号：US11045974
申请日：2005-01-28
申请人： Hiroshi Matsushima , Kozo Ogi
发明人： Hiroshi Matsushima , Kozo Ogi
CPC分类号： H01C17/283 , H05K1/092 , H05K1/167 , H05K3/107 , Y10T74/19456
摘要： There is provided a method for producing a silver powder having excellent dispersibility and capable of forming a paste which do not form suspended matters by phase separation and which is printed on a substrate to form a film having a uniform thickness. In this method, an alkali or a complexing agent is added to an aqueous silver salt containing solution to form a silver oxide containing slurry or an aqueous silver complex salt containing solution. After or before silver particles are deposited by reduction by adding a reducing agent to the silver oxide containing slurry or aqueous silver complex salt containing solution while stirring it, at least one chelating agent selected from the group consisting of compounds having an azole structure, dicarboxylic acids, hydroxy carboxylic acids and salts thereof is added to a silver power containing slurry solution as a dispersing agent.
摘要翻译： 提供了一种制备具有优异分散性并能够形成通过相分离不形成悬浮物的糊状物并且印刷在基材上以形成具有均匀厚度的膜的银粉的方法。 在该方法中，将碱或络合剂加入到含银盐溶液中以形成含有氧化银的浆料或含有银络合盐的水溶液。 通过在搅拌的同时将含有氧化银的浆液或含有银络合盐的溶液中添加还原剂还原而沉积银颗粒之前或之后，至少一种螯合剂选自具有唑结构的化合物，二羧酸 ，将羟基羧酸及其盐加入到含有动力的含有淤浆溶液中作为分散剂。
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公开(公告)号：US20080062614A1
公开(公告)日：2008-03-13
申请号：US11901434
申请日：2007-09-14
申请人： Dan Goia
发明人： Dan Goia
CPC分类号： H01G4/0085 , H01C7/18 , H01C17/283 , H01G4/30 , Y10T428/256 , Y10T428/26 , Y10T428/265
摘要： A method of making multilayer electronic devices, such as capacitors and varistors, is provided, wherein nanosized particles are assembled into a densely packed thin film on a dielectric substrate, and then sintered to form an electrode less than about 700 nm in thickness.
摘要翻译： 提供了一种制造多层电子器件的方法，例如电容器和变阻器，其中将纳米尺寸的颗粒组装成电介质基底上密集填充的薄膜，然后烧结以形成厚度小于约700nm的电极。
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