PREPARATION METHOD FOR ELECTRONIC COMPONENTS WITH AN ALLOY ELECTRODE LAYER
    3.
    发明申请
    PREPARATION METHOD FOR ELECTRONIC COMPONENTS WITH AN ALLOY ELECTRODE LAYER 审中-公开
    具有合金电极层的电子元件的制备方法

    公开(公告)号:US20160293300A1

    公开(公告)日:2016-10-06

    申请号:US14822893

    申请日:2015-08-10

    发明人: Xun Xu Zhiwei Jia

    摘要: A preparation method for an electronic component with an alloy electrode layer includes steps of printing a metal layer on each of the two opposite surfaces of a ceramic substrate with the metal layer made from aluminum, spraying an alloy layer being a copper alloy layer on an outer surface of each metal layer, connecting a pin to each alloy layer, and enclosing the ceramic substrate, the metal layers, the alloy layers and a portion of each pin with an insulating layer. With the adoption of copper alloy for the alloy layer, the preparation method has the advantages of low production cost and high reliability of the electronic component produced by the method.

    摘要翻译: 一种具有合金电极层的电子部件的制备方法,包括以下步骤:在由铝制成的金属层的陶瓷基板的两个相对面的每一面上印刷金属层,在外部喷涂铜合金层的合金层 每个金属层的表面,将销连接到每个合金层,并且用绝缘层包围陶瓷基板,金属层,合金层和每个销的一部分。 随着合金层采用铜合金,制备方法具有生产成本低,可靠性高的优点。

    Electrode component and method for fabricating the same
    4.
    发明授权
    Electrode component and method for fabricating the same 有权
    电极部件及其制造方法

    公开(公告)号:US09449742B2

    公开(公告)日:2016-09-20

    申请号:US14634823

    申请日:2015-02-28

    发明人: Jen-Heng Huang

    摘要: An electrode component includes a ceramic substrate, two electrode layers formed on two opposite surfaces of the ceramic substrate, two pins respectively connected to the two electrode layers, and an insulating layer enclosing the ceramic substrate, the electrode layers and a portion of each pin. Each electrode layer is formed of two or more base metal materials or alloys thereof, and the concentrations of the base metal materials progressively vary across the electrode layer. Accordingly, the production cost is lowered, environmental pollution caused by evaporation and thermal dissolution of organic solvent can be prevented, risk of separable electrode interface at high-voltage discharge is mitigated, and the fabrication process of the electrode layer is shortened while maintaining bonding strength between the electrode layers and the ceramic substrate and solderability between the electrode layers and the pins.

    摘要翻译: 电极部件包括陶瓷基板,形成在陶瓷基板的两个相对表面上的两个电极层,分别连接到两个电极层的两个引脚以及封装陶瓷基板,电极层和每个引脚的一部分的绝缘层。 每个电极层由两种或多种贱金属材料或其合金形成,并且贱金属材料的浓度在电极层上逐渐变化。 因此,可以防止生产成本降低,有机溶剂的蒸发和热溶解引起的环境污染,可以缓解高压放电时的分离电极界面的风险,并且电极层的制造工艺缩短同时保持结合强度 在电极层和陶瓷基板之间以及电极层和引脚之间的可焊性。

    ELECTRODE COMPONENT AND METHOD FOR FABRICATING THE SAME
    6.
    发明申请
    ELECTRODE COMPONENT AND METHOD FOR FABRICATING THE SAME 有权
    电极组件及其制造方法

    公开(公告)号:US20160086699A1

    公开(公告)日:2016-03-24

    申请号:US14634823

    申请日:2015-02-28

    发明人: Jen-Heng Huang

    IPC分类号: H01C7/12 H01C17/06

    摘要: An electrode component includes a ceramic substrate, two electrode layers formed on two opposite surfaces of the ceramic substrate, two pins respectively connected to the two electrode layers, and an insulating layer enclosing the ceramic substrate, the electrode layers and a portion of each pin. Each electrode layer is formed of two or more base metal materials or alloys thereof, and the concentrations of the base metal materials progressively vary across the electrode layer. Accordingly, the production cost is lowered, environmental pollution caused by evaporation and thermal dissolution of organic solvent can be prevented, risk of separable electrode interface at high-voltage discharge is mitigated, and the fabrication process of the electrode layer is shortened while maintaining bonding strength between the electrode layers and the ceramic substrate and solderability between the electrode layers and the pins.

    摘要翻译: 电极部件包括陶瓷基板,形成在陶瓷基板的两个相对表面上的两个电极层,分别连接到两个电极层的两个引脚以及封装陶瓷基板,电极层和每个引脚的一部分的绝缘层。 每个电极层由两种或多种贱金属材料或其合金形成,并且贱金属材料的浓度在电极层上逐渐变化。 因此,可以防止生产成本降低,有机溶剂的蒸发和热溶解引起的环境污染,可以缓解高压放电时的分离电极界面的风险,并且电极层的制造工艺缩短同时保持结合强度 在电极层和陶瓷基板之间以及电极层和引脚之间的可焊性。

    Chip-shaped electronic component
    8.
    发明授权
    Chip-shaped electronic component 有权
    芯片形电子元件

    公开(公告)号:US07794628B2

    公开(公告)日:2010-09-14

    申请号:US12067126

    申请日:2006-08-28

    IPC分类号: H01B1/06

    摘要: A chip-shaped electronic component includes a substrate and an end face electrode layer provided on an end face of the substrate, in which the end face electrode layer contains a mixed material. The mixed material includes as a conductive particle, a carbon powder, a whisker-like inorganic filler coated with a conductive film, and a flake-like conductive powder. Additionally, an epoxy resin has a weight-average molecular weight between 1,000 and 80,000.

    摘要翻译: 片状电子部件包括基板和设置在基板的端面上的端面电极层,其中端面电极层包含混合材料。 混合材料包括作为导电颗粒,碳粉末,涂覆有导电膜的晶须状无机填料和片状导电粉末。 另外,环氧树脂的重均分子量为1,000〜80,000。

    Silver powder and method for producing same
    9.
    发明授权
    Silver powder and method for producing same 有权
    银粉及其制造方法

    公开(公告)号:US07641817B2

    公开(公告)日:2010-01-05

    申请号:US11045974

    申请日:2005-01-28

    IPC分类号: H01B1/02 H01B1/22

    摘要: There is provided a method for producing a silver powder having excellent dispersibility and capable of forming a paste which do not form suspended matters by phase separation and which is printed on a substrate to form a film having a uniform thickness. In this method, an alkali or a complexing agent is added to an aqueous silver salt containing solution to form a silver oxide containing slurry or an aqueous silver complex salt containing solution. After or before silver particles are deposited by reduction by adding a reducing agent to the silver oxide containing slurry or aqueous silver complex salt containing solution while stirring it, at least one chelating agent selected from the group consisting of compounds having an azole structure, dicarboxylic acids, hydroxy carboxylic acids and salts thereof is added to a silver power containing slurry solution as a dispersing agent.

    摘要翻译: 提供了一种制备具有优异分散性并能够形成通过相分离不形成悬浮物的糊状物并且印刷在基材上以形成具有均匀厚度的膜的银粉的方法。 在该方法中,将碱或络合剂加入到含银盐溶液中以形成含有氧化银的浆料或含有银络合盐的水溶液。 通过在搅拌的同时将含有氧化银的浆液或含有银络合盐的溶液中添加还原剂还原而沉积银颗粒之前或之后,至少一种螯合剂选自具有唑结构的化合物,二羧酸 ,将羟基羧酸及其盐加入到含有动力的含有淤浆溶液中作为分散剂。

    Devices with ultrathin structures and method of making same
    10.
    发明申请
    Devices with ultrathin structures and method of making same 审中-公开
    具有超薄结构的器件及其制造方法

    公开(公告)号:US20080062614A1

    公开(公告)日:2008-03-13

    申请号:US11901434

    申请日:2007-09-14

    申请人: Dan Goia

    发明人: Dan Goia

    IPC分类号: H01G4/06 B32B5/16

    摘要: A method of making multilayer electronic devices, such as capacitors and varistors, is provided, wherein nanosized particles are assembled into a densely packed thin film on a dielectric substrate, and then sintered to form an electrode less than about 700 nm in thickness.

    摘要翻译: 提供了一种制造多层电子器件的方法,例如电容器和变阻器,其中将纳米尺寸的颗粒组装成电介质基底上密集填充的薄膜,然后烧结以形成厚度小于约700nm的电极。