公开(公告)号：US12091507B2

公开(公告)日：2024-09-17

申请号：US17042493

申请日：2019-04-01

Applicant: DUPONT ELECTRONICS, INC.

Inventor： Michael Henry Howard, Jr. ,  Nora Sabina Radu ,  Greg A. Hostetler ,  Chai Kit Ngai ,  Brian C. Auman ,  John Donald Summers

IPC: C08G73/10 ,  C08J5/18 ,  C09D179/08 ,  G02F1/1333

CPC classification number: C08G73/1042 ,  C08G73/1085 ,  C08J5/18 ,  C09D179/08 ,  G02F1/133305 ,  C08J2379/08 ,  C09K2323/06

Abstract: Disclosed is a polyimide having a repeat unit structure of Formula III




In Formula III: Ra represents one or more different tetracarboxylic acid component residues; and Rb represents one or more different aromatic diamine residues or aromatic diisocyanate residues. 5-100 mol % of Ra has Formula II





In Formula II: R1 is H, halogen, cyano, hydroxyl, alkyl, heteroalkyl, alkoxy, heteroalkoxy, fluoroalkyl, silyl, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, ally, or vinyl; R2 is halogen, cyano, hydroxyl, alkyl, heteroalkyl, alkoxy, heteroalkoxy, fluoroalkyl, silyl, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, ally, or vinyl; R3 and R4 are the same or different and are alkyl, fluoroalkyl, or silyl; x and y are the same or different and are an integer from 0-2; and * indicates a point of attachment.

公开(公告)号：US20240294710A1

公开(公告)日：2024-09-05

申请号：US18044100

申请日：2022-05-17

Applicant: LG CHEM, LTD.

Inventor： Mi Eun KANG ,  Ye Ji HONG ,  Chan Hyo PARK ,  Hangah PARK ,  Min Wook LEE

IPC: C08G73/10 ,  C08J5/18 ,  C08K5/523 ,  H10K77/10

CPC classification number: C08G73/1071 ,  C08G73/1032 ,  C08G73/1042 ,  C08G73/1067 ,  C08J5/18 ,  C08K5/523 ,  H10K77/111 ,  C08J2379/08

Abstract: The present disclosure relates to a polyimide-based resin film in which a refractive index difference (Δn) obtained by Equation 1 is 0.0068 or less, and a yellow index at a thickness of 10 μm is 5.5 or less, and a substrate for display device, and an optical device using the same.

公开(公告)号：US12049542B2

公开(公告)日：2024-07-30

申请号：US17265905

申请日：2019-08-07

Applicant: DUPONT ELECTRONICS, INC.

Inventor： Brian C. Auman ,  Michael Henry Howard, Jr.

IPC: C08G73/10 ,  G02F1/1333 ,  H05K1/03 ,  G02B5/22 ,  G06F3/041

CPC classification number: C08G73/1078 ,  C08G73/1042 ,  C08G73/1067 ,  G02F1/133305 ,  H05K1/0346 ,  C09K2323/06 ,  G02B5/223 ,  G06F3/041

Abstract: Disclosed is a polyimide having a repeat unit structure of Formula IV




In Formula IV: Ra is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and Rb is the same or different at each occurrence and represents one or more aromatic diamine residues. 30-100 mol % of Rb has Formula II





In Formula II: R1 and R2 are the same or different at each occurrence and are halogen, alkyl, fluoroalkyl, silyl, alkoxy, fluoroalkoxy, or siloxy; a and b are the same or different and are an integer from 0-4; c and d are the same or different and are 1 or 2; and * indicates a point of attachment.

公开(公告)号：US11999823B2

公开(公告)日：2024-06-04

申请号：US17059644

申请日：2020-01-28

Applicant: LG CHEM, LTD.

Inventor： Kyunghwan Kim ,  Jiyeon Sung

IPC: C08G73/10 ,  C08G73/14 ,  C08J5/18 ,  C08L79/08 ,  G02B1/04 ,  G02F1/1333

CPC classification number: C08G73/1067 ,  C08G73/1007 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1078 ,  C08G73/1082 ,  C08G73/14 ,  C08J5/18 ,  C08L79/08 ,  G02B1/04 ,  G02F1/133305 ,  C08J2379/08 ,  C08L2201/08 ,  C08L2203/16 ,  C08L2203/20 ,  C09K2323/00 ,  C09K2323/027 ,  G02F2202/022

Abstract: The present disclosure relates to a polyimide-based resin film which is synthesized by the reaction of an acid anhydride compound and a diamine compound having a specific structure, a substrate for display device, and an optical device using the same.

公开(公告)号：US20240158713A1

公开(公告)日：2024-05-16

申请号：US18079614

申请日：2022-12-12

Applicant: Wuhan Research Institute of Materials Protection

Inventor： HAITAO DUAN ,  CHANGXIN WAN ,  Shengpeng Zhan ,  DAN JIA ,  JIAN LI ,  WULIN ZHANG ,  TIAN YANG ,  YINHUA LI

IPC: C10M111/04 ,  B29C43/00 ,  C08G73/10 ,  C08K3/04 ,  C10M103/02 ,  C10M107/44 ,  C10M177/00

CPC classification number: C10M111/04 ,  B29C43/003 ,  C08G73/1035 ,  C08G73/1042 ,  C08G73/1071 ,  C08K3/042 ,  C08K3/046 ,  C10M103/02 ,  C10M107/44 ,  C10M177/00 ,  C10M2201/0413 ,  C10M2217/0415 ,  C10N2070/00

Abstract: This invention provides a preparation method of solid self-lubricating material with high temperature resistance, including steps described as follows: first, mixing polymer matrix resin and nano lubricating filler to compose a uniform raw material powders; then, placing the raw material powders in the cavity of hot-press die; keeping the temperature for 90-120 min at the first prepressing temperature, controlling the hot-pressing pressure under the third pre-loading pressure, and gradually increasing the temperature to the solid-phase molding temperature of the material; gradually reducing the temperature to the first preloading temperature after the solid-phase molding is completed; next, removing the pressure, finally, obtaining the solid self-lubricating material by naturally cooling to normal temperature and demoulding. This invention adjusts the hot-pressing molding temperature according to the drift value of glass transition temperature, in order to avoid the degradation of tribological properties and mechanical properties caused by uneven plasticization and overheating of composite materials during the compression molding process.

公开(公告)号：US11926704B2

公开(公告)日：2024-03-12

申请号：US17261427

申请日：2020-06-29

Applicant: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.

Inventor： Yamin Wang

IPC: C08G73/10

CPC classification number: C08G73/1042 ,  C08G73/1039 ,  C08G73/1071 ,  C08G73/1085

Abstract: A polyimide substrate, a manufacturing method thereof, and a display substrate having same are disclosed. The method for manufacturing the polyimide substrate comprises steps of: providing a diamine containing a dioxazole structure; polymerizing a fluorine-containing dianhydride with the diamine containing the dioxazole structure to form a polyamic acid containing oxazole and fluorine; and cyclodehydrating the polyamic acid containing oxazole and fluorine to produce a polyimide containing oxazole and fluorine, followed by forming the polyimide substrate by film formation of the polyimide containing oxazole and fluorine. Thus, a light transmission performance of the polyimide substrate is improved.

公开(公告)号：US20240059839A1

公开(公告)日：2024-02-22

申请号：US18265635

申请日：2021-12-06

Applicant: Sumitomo Chemical Company, Limited

Inventor： Kelby Hull ,  Arjan Zoombelt

IPC: C08G73/10 ,  C08J5/18

CPC classification number: C08G73/1021 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1053 ,  C08J5/18 ,  C08J2379/08

Abstract: A polyimide material includes a polyimide of Formula (I)




wherein A1 and A2 for each occasion independently are selected from a group of tetravalent moieties and B for each occasion independently is selected from a group of divalent moieties, wherein x is an integer greater than 1. The polyimide material has desirable optical, structural, thermal, mechanical properties, or combination thereof.

公开(公告)号：US11905372B2

公开(公告)日：2024-02-20

申请号：US17775185

申请日：2019-12-02

Applicant: PI Advanced Materials Co., Ltd.

Inventor： Sung-Yul Back ,  Min-Sang Cho ,  Jin-Seok Jeon ,  Ki-Hoon Kim ,  Kil-Nam Lee

IPC: C08G73/10 ,  B32B27/28 ,  B32B27/08 ,  C08J5/18 ,  B32B15/20 ,  B32B15/08 ,  B32B15/18

CPC classification number: C08G73/1042 ,  B32B27/08 ,  B32B27/281 ,  C08G73/1032 ,  C08G73/1067 ,  C08J5/18 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B2250/24 ,  B32B2307/30 ,  B32B2307/7246 ,  C08J2379/08

Abstract: Disclosed herein is a polyimide film that is obtained by imidizing a polyamic acid solution containing two or more dianhydride components selected from the group consisting of 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA), and a diamine component including m-tolidine and p-phenylenediamine (PPD) and has a glass transition temperature (Tg) of 320° C. or higher, a moisture absorption rate of 0.4% or less, and a dielectric dissipation factor (Df) of 0.004 or less.

公开(公告)号：US20230374344A1

公开(公告)日：2023-11-23

申请号：US18200114

申请日：2023-05-22

Applicant: SK Innovation Co., Ltd.

Inventor： Cheol Min Yun ,  Chun Ho Kim

IPC: C09D179/08 ,  C08G73/10 ,  C08K3/36 ,  C09D183/06 ,  C09D7/61 ,  B32B17/10 ,  C03C17/34

CPC classification number: C09D179/08 ,  C08G73/106 ,  C08G73/1071 ,  C08G73/1042 ,  C08K3/36 ,  C09D183/06 ,  C09D7/61 ,  B32B17/10018 ,  B32B17/10733 ,  B32B17/10807 ,  C03C17/3405 ,  B32B2457/20 ,  B32B2255/20 ,  C03C2217/78 ,  C03C2218/11

Abstract: Provided are polyimide precursor composition including a polyimide precursor including a siloxane structure, and inorganic particles, and an optical multilayer structure including a structure in which a polyimide shatterproof layer formed using the composition is formed on a substrate. The optical multilayer structure according to one implementation is less curled to minimize substrate bending and has significantly improved surface hardness, and thus, has excellent mechanical properties.

公开(公告)号：US11807730B2

公开(公告)日：2023-11-07

申请号：US17841177

申请日：2022-06-15

Applicant: SK Innovation Co., Ltd. ,  SK ie technology Co., Ltd.

Inventor： Cheol Min Yun ,  Hye Jin Park

IPC: B32B27/28 ,  C08G73/10 ,  C08J7/04 ,  C08J5/18

CPC classification number: C08J7/0427 ,  B32B27/281 ,  C08G73/1032 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1064 ,  C08J5/18 ,  B32B2457/20 ,  C08J2379/08 ,  C08L2201/10 ,  C08L2203/16

Abstract: Provided are a composition for forming a polyimide film for a cover window which may satisfy performance required for an advanced cover window, a method for preparing the same, and a use thereof. According to an implementation, a polyimide film for a cover window, which has excellent visibility without optical stain while colorless and transparent optical properties were not deteriorated and has excellent heat resistance and mechanical properties, and thus, is for use in optical applications, may be provided. In addition, a polyimide film for a cover window according to an implementation may be useful in various display devices.