公开(公告)号：US09941036B2

公开(公告)日：2018-04-10

申请号：US15013768

申请日：2016-02-02

Applicant: Raytheon Company

Inventor： Peter D. Morico ,  Bradley S. Jaworski

IPC: H01C1/082 ,  H01C13/02

CPC classification number: H01C1/082 ,  H01C1/014 ,  H01C1/08 ,  H01C1/14 ,  H01C7/18 ,  H01C13/02

Abstract: A resistor includes a first resistor element. The first resistor element is connected to at least a first electrical terminal and a second electrical terminal. The first resistor element is configured to directly contact cooling media on at least two surfaces of the first resistor element in order to transfer heat away from the first resistor element. The resistor may also include a second resistor element connected to at least the first electrical terminal and the second electrical terminal, where the second resistor element is configured to directly contact the cooling media on at least two surfaces of the second resistor element in order to transfer heat away from the second resistor element.

公开(公告)号：US20170011857A1

公开(公告)日：2017-01-12

申请号：US15205124

申请日：2016-07-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Shinichiro KUROIWA

IPC: H01G4/40 ,  H01G4/30 ,  H01C1/148 ,  H01G4/248 ,  H01G4/005

CPC classification number: H01G4/40 ,  H01C1/01 ,  H01C1/014 ,  H01C1/148 ,  H01G2/06 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30

Abstract: A composite electronic component includes an electronic element and a resistance element in a height direction. The electronic element includes an electronic element body, and first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on an upper surface of the base portion, a protective film and first and second upper surface conductors. The first and second upper surface conductors are separated from each other in the length direction and the resistor is between the first and second upper surface conductors. The protective film covers the resistor. Dimensions in the height direction from the upper surface of the base portion to exposed surfaces of a pair of end portions in the length direction of the protective film are smaller than a dimension in the height direction from the upper surface of the base portion to an exposed surface of the protective film in the center portion.

Abstract translation: 复合电子部件包括高度方向的电子元件和电阻元件。 电子元件包括电子元件主体，以及在长度方向上彼此分离的第一和第二外部电极。 电阻元件包括基部，设置在基部的上表面上的电阻器，保护膜和第一和第二上表面导体。 第一和第二上表面导体在长度方向上彼此分离，并且电阻器在第一和第二上表面导体之间。 保护膜覆盖电阻。 从基部的上表面到保护膜的长度方向上的一对端部的露出表面的高度方向的尺寸小于从基部的上表面到露出的高度方向的尺寸 保护膜在中心部分的表面。

公开(公告)号：US20130335874A1

公开(公告)日：2013-12-19

申请号：US13916788

申请日：2013-06-13

Applicant: Jian Chen ,  Changyin Wang ,  Leo Zhong

Inventor： Jian Chen ,  Changyin Wang ,  Leo Zhong

IPC: H02H9/02

CPC classification number: H02H9/026 ,  H01C1/014 ,  H01C1/022 ,  Y10T29/49204

Abstract: The present disclosure presents an electronic device includes:an electronic element with a first electrode and a second electrode disposed on the opposite sides thereof; a first terminal and a second terminal; a first support mounted to and electrically connected with the first terminal, the first support comprising a first contact part contacting and electrically connected with the first electrode; a second support mounted to and electrically connected with the second terminal, the second support comprising a second contact part contacting and electrically connected with the second electrode; a third elastic support comprising a third contact part contacting with one of the first electrode and the second electrode, wherein the third elastic support is provided so as to push the electronic element out of contact with one of the first support and the second support when the electronic element breaks in a failure state.

Abstract translation: 本公开提供一种电子设备，包括：电子元件，其具有设置在其相对侧上的第一电极和第二电极; 第一终端和第二终端; 安装到所述第一端子并与所述第一端子电连接的第一支撑件，所述第一支撑件包括与所述第一电极接触并电连接的第一接触部分; 安装到所述第二端子并与所述第二端子电连接的第二支撑件，所述第二支撑件包括接触并与所述第二电极电连接的第二接触部分; 第三弹性支撑件，包括与第一电极和第二电极中的一个接触的第三接触部分，其中设置第三弹性支撑件，以便当电子元件与第一支撑件和第二支撑件之一脱离接触时， 电子元件处于故障状态。

公开(公告)号：US20130284501A1

公开(公告)日：2013-10-31

申请号：US13870414

申请日：2013-04-25

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： John E. McConnell ,  Alan P. Webster ,  John Bultitude ,  Abhijit Gurav

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/0271 ,  H01C1/014 ,  H01C1/14 ,  H01C7/18 ,  H01G2/06 ,  H01G4/232 ,  H01G4/38 ,  H05K1/181 ,  H05K1/182 ,  H05K3/30 ,  H05K3/301 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10454 ,  Y10T29/49121

Abstract: An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.

Abstract translation: 描述了一种改进的离散电子设备和制造改进的分立电子设备的方法。 分立的电子设备具有带终端和引线框架的电子无源部件。 补偿兼容部件在终端和引线框架之间。 补偿柔性部件具有复合芯和复合芯上的第一导体。 第一个导线与端子电接触。 第二导体也在复合芯上，其中第二导体与引线框架电接触。

公开(公告)号：US20040251117A1

公开(公告)日：2004-12-16

申请号：US10462395

申请日：2003-06-16

Inventor： Marvin Glenn Wong ,  Ling Liu

IPC: H01H029/00

CPC classification number: H01C1/014 ,  H01C17/075 ,  H01C17/288 ,  H01H2029/008

Abstract: A suspended thin-film resistor and methods for producing the same are disclosed. In one embodiment, a device is produced by depositing a first and second contact on a substrate, depositing a sacrificial material on the substrate at a location between the first and second contacts, depositing a thin-film resistor over the first and second contacts and the sacrificial material, and thermally decomposing the sacrificial material.

Abstract translation: 公开了一种悬浮薄膜电阻器及其制造方法。 在一个实施例中，通过在衬底上沉积第一和第二接触而在第一和第二接触之间的位置处在衬底上沉积牺牲材料来生产器件，在第一和第二接触件上沉积薄膜电阻器， 牺牲材料，并且热分解牺牲材料。

公开(公告)号：US06753578B2

公开(公告)日：2004-06-22

申请号：US10209859

申请日：2002-08-02

Applicant: Toshiaki Kanenari ,  Toshihiro Nakajima

Inventor： Toshiaki Kanenari ,  Toshihiro Nakajima

IPC: H01L2701

CPC classification number: H01C1/014 ,  H01C1/028 ,  H01L23/3121 ,  H01L2224/45124 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2924/13055 ,  H01L2924/19105 ,  H01L2924/00

Abstract: A resin-sealed semiconductor device is provided which allows unwanted air to be bled out steadily and readily from the space defined between the resistor of a plate-like shape and the insulating substrate in the resin sealing step. The resin-sealed semiconductor device includes a resistor of a plate-like form anchored at both ends to the upper main surface of a substrate thereof. A space is provided between the resistor and the substrate. The primary components including the resistor mounted on the substrate are sealed with a curing resin material. In particular, the resistor has an aperture provided in a portion thereof, which is opposite to the substrate and defines the space with the substrate, for communication between the space and the upper side of the resistor.

Abstract translation: 提供了一种树脂密封半导体器件，其允许在树脂密封步骤中从板状形状的电阻器和绝缘基板之间限定的空间稳定且容易地排出不需要的空气。 树脂密封型半导体装置包括在其两端的基板的上主表面上固定有板状的电阻体。 在电阻器和衬底之间设置一个空间。 包括安装在基板上的电阻器的主要部件用固化树脂材料密封。 特别地，电阻器具有设置在其与衬底相对的部分中的孔，并且与衬底限定空间，用于在电阻器的空间和上侧之间连通。

公开(公告)号：US06617955B2

公开(公告)日：2003-09-09

申请号：US10050921

申请日：2002-01-22

Applicant: Hiroki Tanaka ,  Yoshinori Kitamura

Inventor： Hiroki Tanaka ,  Yoshinori Kitamura

IPC: H01C710

CPC classification number: H01C1/1406 ,  H01C1/014 ,  H04N5/44 ,  H04N9/29

Abstract: An inexpensive positive temperature coefficient thermistor has metal terminals which have been miniaturized without deteriorating the characteristics or sacrificing the reliability of the device. The metal terminals include supporting members and springs constructed such that a total width of the supporting members is smaller than a total width of the springs. In addition, connecting portions at the upper ends of the metal terminals engage with a case main body or a covering member to be retained at predetermined positions.

公开(公告)号：US20020011918A1

公开(公告)日：2002-01-31

申请号：US09960787

申请日：2001-09-21

Inventor： Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

IPC: H01C007/10

CPC classification number: H01C1/01 ,  H01C1/014 ,  H01C1/1406 ,  H05K1/0201 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/062 ,  H05K2201/10378 ,  H05K2201/10643 ,  H05K2201/10659 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

Abstract translation: 在过电流保护电路中使用的具有正电阻 - 温度特性的热敏电阻具有相互相对的主表面上的电极，并且被安装到具有导电构件的基板上，使得可以控制由于发热引起的耐电压劣化。 与连接到热敏电阻电极之一的焊料之间插入具有比衬底更小的导热性并且被具有小横截面面积的导体片穿透的间隔物。 另一个电极通过细长的连接构件通过其横向于其纵向方向的截面来接触，使得导电的横截面面积减小。

公开(公告)号：US20010054949A1

公开(公告)日：2001-12-27

申请号：US09858684

申请日：2001-05-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norihiro Mochida ,  Toshikazu Nakamura

IPC: H01C007/10 ,  H01C013/00 ,  H01C001/022

CPC classification number: H01C1/1406 ,  H01C1/014

Abstract: A positive thermistor element is supported by being clamped by first and second resilient contact members that are opposed to each other so as to be disposed along a diagonal and first and second positioning protrusions that are opposed to each other so as to be disposed along the other diagonal of the positive thermistor element. The first resilient contact member is located toward the periphery of the positive thermistor element from the second positioning protrusion and the second resilient contact member is positioned toward an inner portion of the positive thermistor element from the first positioning protrusion.

Abstract translation: 正的热敏电阻元件由相互相对的第一和第二弹性接触构件夹持而被支撑，以便沿着彼此相对设置的沿着对角线和第一和第二定位突起设置以沿着另一个布置 正热敏电阻元件的对角线。 第一弹性接触构件从第二定位突起朝着正热敏电阻元件的周边定位，并且第二弹性接触构件从第一定位突起朝着正热敏电阻元件的内部定位。

公开(公告)号：US06242998B1

公开(公告)日：2001-06-05

申请号：US09304705

申请日：1999-05-04

Applicant: Kenjiro Mihara

Inventor： Kenjiro Mihara

IPC: H01C713

CPC classification number: H01C1/1413 ,  H01C1/014 ,  H01C1/022

Abstract: An NTC thermistor is formed with a planar NTC thermistor element, a pair of power-supply terminals and a case which encloses the thermistor element and the terminals inside. The planar NTC thermistor has electrodes formed on a mutually opposite pair of side surfaces and each contacted by one of the power-supply terminals. At least one of the main surfaces of the planar NTC thermistor makes a surface-to-surface contact with an inner wall of the case such that the effective thermal capacity of the thermistor element is increased. Such an NTC thermistor, when inserted in series between an electrical power source and an electrical heat source, say, of an electronic copier, can effectively suppress rush currents when the power source is switched on.

Abstract translation: NTC热敏电阻形成有平面NTC热敏电阻元件，一对电源端子和封装热敏电阻元件和端子的壳体。 平面NTC热敏电阻具有形成在彼此相对的一对侧表面上并且各自与一个电源端子接触的电极。 平面NTC热敏电阻的至少一个主表面与壳体的内壁面对面接触，使得热敏电阻元件的有效热容增加。 这种NTC热敏电阻当串联插入电源和电热源（电子复印机）时，可以有效地抑制电源接通时的冲击电流。