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    Direct application voltage variable material, components thereof and devices employing same
    5.
    发明申请
    Direct application voltage variable material, components thereof and devices employing same 有权
    直接施加电压可变材料，其组件和使用其的装置

    公开(公告)号：US20040201941A1

    公开(公告)日：2004-10-14

    申请号：US10746020

    申请日：2003-12-23

    Inventor： Edwin James Harris ,  Tushar Vyas ,  Stephen J. Whitney

    IPC: H02H001/00

    CPC classification number: H01L23/62 ,  H01C17/06513 ,  H01C17/06553 ,  H01C17/0656 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0298 ,  H05K1/167 ,  H05K2201/0224 ,  H05K2201/0272 ,  H05K2201/0738 ,  H01L2924/00

    Abstract: A voltage variable material (nullVVMnull) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device. In one embodiment, the VVM includes doped semiconductive particles having a core, such which can be silicon, and an inert coating, which can be an oxide. The particles are mixed in the binder with conductive particles.

    Abstract translation: 提供了包括被配制为固有地粘附到导电和非导电表面的绝缘粘合剂的电压可变材料（“VVM”）。 粘合剂，因此VVM是可自我修复的，并且可以在使用前干燥的可涂抹形式使用。 粘合剂消除了将VVM放置在单独的装置中的需要，或者提供用于电连接VVM的单独的印刷电路板焊盘。 粘合剂，因此VVM可以直接应用于许多不同类型的基材，例如刚性（FR-4）层压材料，聚酰亚胺或聚合物。 VVM也可以直接应用于放置在设备内部的不同类型的基板。 在一个实施例中，VVM包括具有芯的掺杂的半导体颗粒，其可以是硅，以及可以是氧化物的惰性涂层。 颗粒在粘合剂中与导电颗粒混合。

    Nickel powder and process for preparing the same
    6.
    发明授权
    Nickel powder and process for preparing the same 失效
    镍粉及其制备方法

    公开(公告)号：US6007743A

    公开(公告)日：1999-12-28

    申请号：US24397

    申请日：1998-02-17

    Applicant: Eiichi Asada ,  Yuji Akimoto ,  Kazuro Nagashima ,  Hiroshi Yoshida ,  Yiyi Ma

    Inventor： Eiichi Asada ,  Yuji Akimoto ,  Kazuro Nagashima ,  Hiroshi Yoshida ,  Yiyi Ma

    IPC: B22F1/02 ,  B22F9/30 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H01C17/065 ,  H01G4/008 ,  H05K1/09 ,  H05K3/46 ,  H01B1/02 ,  B32B5/16 ,  H01B1/06

    CPC classification number: H01G4/0085 ,  B22F1/02 ,  B22F9/30 ,  H01C17/06506 ,  H01C17/06553 ,  B22F2998/00 ,  H05K1/092 ,  Y10T428/2991 ,  Y10T428/2998

    Abstract: A nickel powder having at at least part of the surface thereof a layer of a composite oxide represented by the formula: A.sub.x B.sub.y O.sub.(x+2y), wherein A stands for at least one element selected from the group consisting of Ca, Sr and Ba; B stands for at least one element selected from the group consisting of Ti and Zr; and x and y represent numbers satisfying the formula: 0.5.ltoreq.y/x.ltoreq.4.5). The nickel powder may further contains at least one selected from among boron oxide, aluminum oxide and silicon oxide. The nickel powder is produced by spray pyrolyzing a solution of thermal decomposable starting compounds of nickel and additive elements and the resultant powder is suitable for use in a thick-film conductor paste having a sintering-starting temperature close to that of ceramic layers and a shrinkage behavior close to that of a ceramic without detriment to the conductivity and electric properties thereof.

    Abstract translation: 一种镍粉，其表面的至少一部分具有由下式表示的复合氧化物层：AxByO（x + 2y），其中A代表选自Ca，Sr和Ba中的至少一种元素; B代表选自Ti和Zr中的至少一种元素; 并且x和y表示满足以下公式的数字：0.5≤y/x≤4.5）。 镍粉还可含有选自氧化硼，氧化铝和氧化硅中的至少一种。 通过喷涂热解镍和添加元素的可热分解的起始化合物的溶液来制造镍粉末，所得粉末适用于烧结起始温度接近陶瓷层的收缩率的厚膜导体糊料 接近于陶瓷的行为，而不损害其导电性和电性能。

    Thin-film resistor and resistance material for a thin-film resistor
    7.
    发明授权
    Thin-film resistor and resistance material for a thin-film resistor 失效
    用于薄膜电阻的薄膜电阻和电阻材料

    公开(公告)号：US5994996A

    公开(公告)日：1999-11-30

    申请号：US927878

    申请日：1997-09-11

    Applicant: Jan J. Van Den Broek ,  Richard A. F. Van Der Rijt

    Inventor： Jan J. Van Den Broek ,  Richard A. F. Van Der Rijt

    IPC: H01C7/00 ,  H01C17/00 ,  H01C17/065 ,  H01C1/012

    CPC classification number: H01C17/006 ,  H01C17/06553

    Abstract: A metal alloy having an intrinsically low TCR, and which preferably comprises a metal oxide and forms part of the resistance material in a quantity of 15-60 vol. %. The best results are achieved with a resistance material which comprises an alloy of CuNi as the metal alloy and SiO.sub.2 as the high-ohmic component. The resistors exhibit a relatively high resistance value as well as a relatively low TCR value.

    Abstract translation: 具有本征低TCR的金属合金，其优选包含金属氧化物并形成15-60体积％的电阻材料的一部分。 ％。 使用包含CuNi作为金属合金的合金和作为高欧姆成分的SiO 2的电阻材料实现最好的结果。 电阻器具有相对较高的电阻值以及较低的TCR值。

    Thick film resistor paste and resistors therefrom
    8.
    发明授权
    Thick film resistor paste and resistors therefrom 失效
    厚膜电阻膏和电阻

    公开(公告)号：US4312770A

    公开(公告)日：1982-01-26

    申请号：US55970

    申请日：1979-07-09

    Applicant: Ruey J. Yu ,  Morris Berg

    Inventor： Ruey J. Yu ,  Morris Berg

    IPC: H01C7/00 ,  C03C3/072 ,  C03C3/108 ,  C03C4/16 ,  C03C8/18 ,  H01C17/065 ,  H01B1/02

    CPC classification number: H01C17/06553 ,  C03C3/072 ,  C03C8/10 ,  C03C8/14 ,  C03C8/18

    Abstract: This invention relates to resistor compositions comprising, in % by weight, about 5-24% RuO.sub.2, about 10-20% Ag, about 3-8% Sb.sub.2 O.sub.3, about 8-12% CdO, about 35 to 70% lead-borosilicate glass, up to about 4% Ta.sub.2 O.sub.5 and up to about 2% thermistor powder such as at least one of the transition metals Mn.sub.2 O.sub.3, NiO, CuO, Cr.sub.2 O.sub.3 and ZnO. These resistor compositions are adapted to be dispersed in a liquid vehicle to form a resistor ink or paste that can be applied to a surface of a ceramic substrate and fired to form a resistor having stable electrical and mechanical properties.

    Abstract translation: 本发明涉及电阻组合物，其包含按重量计约5-24％RuO 2，约10-20％Ag，约3-8％Sb2O3，约8-12％CdO，约35-70％铅硼硅酸盐玻璃 ，高达约4％的Ta 2 O 5和至多约2％的热敏电阻粉末，例如过渡金属Mn 2 O 3，NiO，CuO，Cr 2 O 3和ZnO中的至少一种。 这些电阻器组合物适于分散在液体载体中以形成可施加到陶瓷基片的表面并烧制以形成具有稳定的电气和机械性能的电阻器的电阻器墨水或糊料。

    Humidity sensor, material therefor and method
    9.
    发明授权
    Humidity sensor, material therefor and method 失效
    湿度传感器，材料及方法

    公开(公告)号：US4016308A

    公开(公告)日：1977-04-05

    申请号：US566350

    申请日：1975-04-09

    Applicant: Lawrence E. Frazee

    Inventor： Lawrence E. Frazee

    IPC: G01N27/12 ,  H01C17/065 ,  B05D5/12

    CPC classification number: H01C17/06553 ,  G01N27/121

    Abstract: A novel humidity sensor printed and fired on a dielectric substrate comprising an interdigitated pattern of a conductive precious metal with cobalt oxide as the only binder. Sensors according to the invention may be employed as hermeticity detectors in semiconductor packages.

    Abstract translation: 在介电基片上印刷和烧制的新型湿度传感器，其包括导电贵金属的交叉图案，其中氧化钴作为唯一的粘合剂。 根据本发明的传感器可用作半导体封装中的气密性检测器。

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