知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.016 seconds)

    Temperature sensor
    1.
    发明授权
    Temperature sensor 有权

    公开(公告)号：US10983012B2

    公开(公告)日：2021-04-20

    申请号：US15879951

    申请日：2018-01-25

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yasunori Hioki ,  Hiroshi Marusawa ,  Michiru Mikami

    IPC: G01K7/00 ,  G01K7/22 ,  H01C17/065 ,  H01C7/04 ,  H01C7/02 ,  H01C7/00 ,  H01C17/28 ,  H01C1/142

    Abstract: A temperature sensor that includes a first electrode layer, a second electrode layer, and a thermistor layer between the first and second electrode layers. The thermistor layer includes a spinel-type semiconductor ceramic composition powder containing Mn, Ni, and Fe, and an organic polymer component. In the semiconductor ceramic composition powder, the molar ratio of Mn to Ni is 85/15≥Mn/Ni≥65/35, and when the total molar quantity of Mn and Ni is 100 parts by mole, the content of Fe is 30 parts by mole or less, and the semiconductor ceramic composition powder is 2 μm or less in particle size.

    Temperature sensor
    3.
    发明授权
    Temperature sensor 有权

    公开(公告)号：US11209320B2

    公开(公告)日：2021-12-28

    申请号：US16508497

    申请日：2019-07-11

    Applicant: Murata Manufacturing Co., Ltd. ,  OSAKA UNIVERSITY

    Inventor： Yasunori Hioki ,  Tsuyoshi Sekitani ,  Takafumi Uemura ,  Tomoaki Onoue

    IPC: G01K7/22 ,  H01C7/04 ,  G01K1/024 ,  G01K1/02 ,  H01C17/065

    Abstract: A temperature sensor that includes an organic-inorganic composite negative temperature coefficient thermistor and a transistor. The organic-inorganic composite negative temperature coefficient thermistor includes a thermistor layer which includes spinel-type semiconductor ceramic composition powder containing Mn, Ni and Fe and an organic polymer component, and a pair of electrode layers. The semiconductor ceramic composition powder has a molar ratio of Mn to Ni of 85/15≥Mn/Ni≥65/35 and a Fe content of 30 parts by mole or less when a total molar amount of Mn and Ni is regarded as 100 parts by mole, and has a peak with a local maximum value of around 29° to 31° in its X-ray diffraction pattern, a half width of which peak is 0.15 or more. The transistor is electrically connected with either one of the pair of electrode layers.

    TEMPERATURE SENSOR
    5.
    发明申请
    TEMPERATURE SENSOR 审中-公开

    公开(公告)号：US20190331536A1

    公开(公告)日：2019-10-31

    申请号：US16508497

    申请日：2019-07-11

    Applicant: Murata Manufacturing Co., Ltd. ,  OSAKA UNIVERSITY

    Inventor： Yasunori Hioki ,  Tsuyoshi Sekitani ,  Takafumi Uemura ,  Tomoaki Onoue

    IPC: G01K7/22 ,  H01C7/04 ,  G01K1/02

    Abstract: A temperature sensor that includes an organic-inorganic composite negative temperature coefficient thermistor and a transistor. The organic-inorganic composite negative temperature coefficient thermistor includes a thermistor layer which includes spinel-type semiconductor ceramic composition powder containing Mn, Ni and Fe and an organic polymer component, and a pair of electrode layers. The semiconductor ceramic composition powder has a molar ratio of Mn to Ni of 85/15≥Mn/Ni≥65/35 and a Fe content of 30 parts by mole or less when a total molar amount of Mn and Ni is regarded as 100 parts by mole, and has a peak with a local maximum value of around 29° to 31° in its X-ray diffraction pattern, a half width of which peak is 0.15 or more. The transistor is electrically connected with either one of the pair of electrode layers.

    DIELECTRIC RESIN COMPOSITION FOR FILM CAPACITOR AND FILM CAPACITOR
    7.
    发明申请
    DIELECTRIC RESIN COMPOSITION FOR FILM CAPACITOR AND FILM CAPACITOR 有权
    用于薄膜电容器和薄膜电容器的电介质树脂组合物

    公开(公告)号：US20140368970A1

    公开(公告)日：2014-12-18

    申请号：US14472604

    申请日：2014-08-29

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Tomomichi Ichikawa ,  Norihiro Yoshikawa ,  Shinichi Kobayashi ,  Yasunori Hioki ,  Ichiro Nakaso ,  Tomoki Inakura

    IPC: H01G4/18 ,  H01G4/33 ,  H01G4/32

    CPC classification number: H01G4/18 ,  C08G18/4063 ,  C08G18/58 ,  C08G18/6212 ,  C08G18/721 ,  C08G18/7671 ,  C08G18/797 ,  C08G18/8029 ,  C08G2650/56 ,  C08L61/28 ,  C08L63/00 ,  C08L71/00 ,  C08L71/10 ,  H01G4/32 ,  H01G4/33

    Abstract: A resin composition constituting dielectric resin films of a film capacitor includes a first atom group including at least one functional group selected from among a methylene group, an aromatic ring and an ether group and having a relatively small molar polarizability, and a second atom group including at least one functional group selected from among a hydroxyl group, an amino group and a carbonyl group and having a relatively large molar polarizability. The resin composition satisfies the condition that a value calculated from the formula (sum of absorption band intensities of first atom group)/(sum of absorption band intensities of second atom group) is 1.0 or more. Herein, as absorption band intensities of the functional groups, peak intensities detected in specific wavenumber ranges are employed.

    Abstract translation: 构成薄膜电容器的介电树脂薄膜的树脂组合物包括：包含至少一种选自亚甲基，芳香环和醚基并具有相对较小的摩尔极化率的官能团的第一原子团和包含 选自羟基，氨基和羰基中的至少一种官能团，并且具有相对较大的摩尔极化率。 树脂组合物满足从式（第一原子组的吸收带强度之和）/（第二原子团的吸收带强度之和）计算出的值为1.0以上的条件。 这里，作为官能团的吸收带强度，使用在特定波数范围内检测出的峰值强度。

    DIELECTRIC RESIN COMPOSITION FOR FILM CAPACITOR AND FILM CAPACITOR
    8.
    发明申请
    DIELECTRIC RESIN COMPOSITION FOR FILM CAPACITOR AND FILM CAPACITOR 审中-公开
    用于薄膜电容器和薄膜电容器的电介质树脂组合物

    公开(公告)号：US20140226256A1

    公开(公告)日：2014-08-14

    申请号：US14254973

    申请日：2014-04-17

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Tomomichi Ichikawa ,  Norihiro Yoshikawa ,  Ichiro Nakamura ,  Shinichi Kobayashi ,  Ichiro Nakaso ,  Yasunori Hioki ,  Tomoki Inakura

    IPC: H01G4/18

    CPC classification number: H01G4/18 ,  C08L71/12 ,  H01G4/30 ,  H01G4/32 ,  C08L29/14 ,  C08L69/00 ,  C08L59/00 ,  C08L75/04

    Abstract: A dielectric resin composition for a film capacitor is a mixture containing an organic material A and an organic material B. The organic material A includes at least two kinds of organic material components A1, A2, . . . having reactive groups (for example, OH, NCO) that cross-link each other. The organic material B does not have a reactive site capable of reacting with the organic material A and has a dielectric loss tan δ of 0.3% or less at a temperature of 125° C. The mixture has a glass transition temperature of 130° C. or higher and preferably 280° C. or lower.

    Abstract translation: 用于薄膜电容器的电介质树脂组合物是含有有机材料A和有机材料B的混合物。有机材料A包括至少两种有机材料组分A1，A2。 。 。 具有彼此交联的反应性基团（例如OH，NCO）。 有机材料B不具有能够与有机材料A反应的反应性部位，并且在125℃的温度下的介电损耗tanδ为0.3％以下。该混合物的玻璃化转变温度为130℃ 以上，优选为280℃以下。

Patent Agency Ranking