Abstract:
Techniques are provided for managing voltages applied to memory cells in a cross-point array during a write operation (e.g., to transition from a resistive state into a conductive state). The techniques apply to thyristor memory cells and non-thyristor memory cells. Bitlines, connected by a wordline, are preconditioned to a voltage level, by a precondition device, to write data to one or more memory cells at intersections of the bitlines and the wordline. Each bitline is coupled to a high impedance device, a detect device, a precondition device and a clamp device. When a memory cell on a first bitline transitions from a resistive state into a conductive state, it pulls a voltage level of the first-bit line level low. A first clamp device maintains the voltage level at a level to de-bias the first bitline from the wordline, while other memory cells to be written along the wordline remain biased.
Abstract:
An apparatus with a programmable response includes a semi-conductor device with a junction formed thereon, the junction having a built-in potential, a quantum well element proximate to the junction that provides an energy well within a depletion region of the junction. The energy well comprises one or more donor energy states that support electron trapping, and/or one or more acceptor energy states that support hole trapping; thereby modulating the built-in potential of the junction. The semi-conductor device may be a diode, a bipolar diode, a transistor, or the like. A corresponding method is also disclosed herein.
Abstract:
According to various embodiments, a resistive-switching memory element and memory element array that uses a bipolar switching includes a select element comprising only a single diode that is not a Zener diode. The resistive-switching memory elements described herein can switch even when a switching voltage less than the breakdown voltage of the diode is applied in the reverse-bias direction of the diode. The memory elements are able to switch during the very brief period when a transient pulse voltage is visible to the memory element, and therefore can use a single diode per memory cell.
Abstract:
A non-volatile electro-mechanical diode memory cell is described for implementation of compact (4F2) cross-point memory arrays. The electro-mechanical diode memory cells operate with relatively low set/reset voltages and excellent retention characteristics, and are multi-time programmable. Due to its simplicity, this electro-mechanical diode memory cell is attractive for implementation of three-dimensional memory arrays for higher storage density.
Abstract:
A gated diode memory cell is provided, including one or more transistors, such as field effect transistors (“FETs”), and a gated diode in signal communication with the FETs such that the gate of the gated diode is in signal communication with the source of a first FET, wherein the gate of the gated diode forms one terminal of the storage cell and the source of the gated diode forms another terminal of the storage cell, the drain of the first FET being in signal communication with a bitline (“BL”) and the gate of the first FET being in signal communication with a write wordline (“WLw”), and the source of the gated diode being in signal communication with a read wordline (“WLr”).
Abstract:
A method of making a nonvolatile memory device includes forming a first electrode, forming at least one nonvolatile memory cell comprising a silicon, germanium or silicon-germanium diode, doping the diode with at least one of nitrogen or carbon, and forming a second electrode over the at least one nonvolatile memory cell.
Abstract:
A method of programming a non-volatile memory device with memory cells formed of variable resistance elements and disposed between word lines and bit lines, includes: previously charging a selected word line and a selected bit line together with a non-selected word line and a non-selected bit line up to a certain voltage; and further charging the selected word line and the non-selected bit line up to a program voltage higher than the certain voltage and a program-block voltage, respectively, and simultaneously discharging the selected bit line.
Abstract:
A memory integrated circuit has memory arrays that are vertically layered. These memory arrays include word lines and bit lines. Intersections between the word lines and the bit lines include a diode and a memory state storage element. The diode and the memory storage element are connected in between a word line and a bit line. The diode at the intersections includes a first diode node and a second diode node. Various aspects of the memory integrated circuit are electrically interconnected in various ways, such as corresponding word lines, corresponding first diode nodes, or corresponding second diode nodes of different memory arrays being electrically interconnected. Various aspects of the memory integrated circuit are isolated in various ways, such as word lines, first diode nodes, or second diode nodes of different memory arrays being isolated.
Abstract:
A resistance change memory device including: a substrate; cell arrays stacked thereabove, each including a matrix layout of memory cells; a write circuit configured to write a pair cell constituted by two neighboring memory cells; and a read circuit configured to read complementary resistance value states of the pair cell as one bit of data, wherein the memory cell includes a variable resistance element for storing as information a resistance value. The variable resistance element has: a recording layer formed of a composite compound containing at least one transition element and a cavity site for housing a cation ion; and electrodes formed on the opposite sides of the recording layer, one of the electrodes serving as a cation source in a write or erase mode for supplying a cation to the recording layer to be housed in the cavity site therein.
Abstract:
A resistance change memory device including: a substrate; cell arrays stacked thereabove, each including a matrix layout of memory cells; a write circuit configured to write a pair cell constituted by two neighboring memory cells; and a read circuit configured to read complementary resistance value states of the pair cell as one bit of data, wherein the memory cell includes a variable resistance element for storing as information a resistance value, and wherein the variable resistance element has a recording layer formed of a first composite compound expressed by AxMyOz (where “A” and “M” are cation elements different from each other; “O” oxygen; and 0.5≦x≦1.5, 0.5≦y≦2.5 and 1.5≦z≦4.5) and a second composite compound containing at least one transition element and a cavity site for housing a cation ion.
Abstract translation:一种电阻变化存储器件,包括:衬底; 单元阵列堆叠在其上,每个包括存储单元的矩阵布局; 写入电路,被配置为写入由两个相邻存储器单元构成的对单元; 以及读取电路,被配置为读取所述对单元的互补电阻值状态作为数据的一位,其中所述存储单元包括用于存储作为信息的电阻值的可变电阻元件,并且其中所述可变电阻元件具有由 由A M和Y M表示的第一复合化合物(其中“A”和“M”是彼此不同的阳离子元素; “O”氧;和0.5 <= x <= 1.5,0.5 <= y <= 2.5和1.5 <= z <= 4.5)和第二复合化合物,其含有至少一个过渡元素和用于容纳阳离子离子的空腔部位 。