公开(公告)号：US10071538B2

公开(公告)日：2018-09-11

申请号：US15222894

申请日：2016-07-28

申请人： SAMSUNG SDI CO., LTD.

发明人： Eun Hwan Jeong ,  Yi Eun Kim ,  Yoo Jin Suh ,  In Cheon Han

IPC分类号： C08F220/10 ,  C09J133/00 ,  G02B5/30 ,  B32B7/12 ,  C08F220/18 ,  G02F1/1335 ,  C09J133/08 ,  C08G18/62 ,  C09J133/06 ,  C09J175/04 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  C09J7/38 ,  C09J7/22

CPC分类号： B32B7/12 ,  B32B27/08 ,  B32B27/306 ,  B32B27/308 ,  B32B27/325 ,  B32B27/36 ,  B32B27/365 ,  B32B2307/4026 ,  B32B2307/42 ,  B32B2307/514 ,  B32B2405/00 ,  B32B2457/202 ,  C08F220/18 ,  C08G18/6225 ,  C09J7/22 ,  C09J7/38 ,  C09J133/066 ,  C09J133/08 ,  C09J175/04 ,  C09J175/16 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2433/00 ,  G02B5/3025 ,  G02B5/3041 ,  G02F1/133528 ,  G02F2202/28 ,  C08F2220/1825 ,  C08F220/14 ,  C08F220/20 ,  C08F2220/325

摘要： An adhesive film for polarizing plates, a polarizing plate including the same, and an optical display including the same are provided. An adhesive film for polarizing plates is formed of an adhesive composition for polarizing plates, which includes a non-carboxylic acid (meth)acrylic copolymer, an isocyanate curing agent, and an epoxy curing agent, wherein the adhesive film has a modulus at 85° C. of about 0.1 MPa to about 0.8 MPa and a modulus ratio of about 3 or less, as calculated by the equation, Modulus ratio=G′(25° C.)/G′(85° C.), where G′(25° C.) is modulus (unit: MPa) at 25° C. of an adhesive film and G′(85° C.) is modulus (unit: MPa) at 85° C. of the adhesive film.

公开(公告)号：US09994685B2

公开(公告)日：2018-06-12

申请号：US14129426

申请日：2012-06-27

申请人： Takahiro Sakaguchi

发明人： Takahiro Sakaguchi

IPC分类号： C08J5/18 ,  C08F212/08 ,  C08F212/02 ,  C08F220/28 ,  C08F220/32 ,  C08F220/34 ,  C08F220/36 ,  G02B1/04 ,  G02B3/00 ,  C08G59/02 ,  C08L25/04 ,  C08L25/14 ,  C08L63/00

CPC分类号： C08J5/18 ,  C08F212/08 ,  G02B1/041 ,  C08F220/34 ,  C08F2220/282 ,  C08F2220/281 ,  C08F2220/325 ,  C08F220/32 ,  C08F2220/343 ,  C08F220/20 ,  C08F220/58 ,  C08L25/14

摘要： There is provided a resin composition including a copolymer having structural units of Formula (1), Formula (2), and Formula (3), and a solvent; or a resin composition including a copolymer having structural units of Formula (1), Formula (4), and Formula (5), and a solvent.

公开(公告)号：US20180118867A1

公开(公告)日：2018-05-03

申请号：US15571907

申请日：2016-05-02

申请人： Nisshinbo Holdings Inc.

发明人： Kazutoshi Hayakawa ,  Toshifumi Hashiba ,  Erina Matsuzaka

IPC分类号： C08F220/14 ,  C09D133/12 ,  C09D11/107 ,  A61K8/02 ,  A61K8/81 ,  A61Q19/00 ,  C09J133/12 ,  C08F212/08 ,  C09D125/14 ,  C09D11/108 ,  C09J125/14

CPC分类号： C08F220/14 ,  A61K8/0245 ,  A61K8/8152 ,  A61Q1/02 ,  A61Q19/00 ,  C08F212/08 ,  C08F2500/24 ,  C08F2800/20 ,  C08F2810/20 ,  C08L2205/025 ,  C09D11/107 ,  C09D11/108 ,  C09D125/14 ,  C09D129/04 ,  C09D133/12 ,  C09J125/14 ,  C09J133/12 ,  G02B5/0242 ,  C08L33/12 ,  C08F2220/325 ,  C08F2/26 ,  C08F2/20 ,  C08F220/56

摘要： Provided are elliptical, needle-shaped, or rod-shaped crosslinked polymer particles in which 5-100 mol % of all repeating units are repeating units derived from an unsaturated monomer having a functional group selected from an epoxy group, a carboxyl group, an amide group, a hydroxy group an amino group, and a thiol group, wherein (1) the average (LAV) length (L) in a two-dimensional projection diagram obtained by irradiating the particles with light from a direction orthogonal to the longitudinal direction is 0.1-80 μm, (2) the average (DAV) breadth (D) in the two-dimensional projection diagram obtained by irradiating, the particles with light from the direction orthogonal to the longitudinal direction is 0.05-40 μm, and (3) the average (PAV) aspect ratio (L/D) calculated from the length (L) and the breadth (D) is 1.5-30.

公开(公告)号：US09953767B2

公开(公告)日：2018-04-24

申请号：US15284072

申请日：2016-10-03

申请人： TAYCA CORPORATION

发明人： Ryosuke Sugihara ,  Kei Hirota ,  Kazuto Fujihara

IPC分类号： H01B1/00 ,  H01G9/00 ,  C09D5/24 ,  H01G9/028 ,  H01B1/12 ,  C08L65/00 ,  H01G9/15 ,  C08G8/18 ,  H01G11/48 ,  C08F12/30 ,  C08L25/18 ,  C09D125/02 ,  C09D165/00 ,  H01G9/07 ,  C08L61/14

CPC分类号： H01G9/028 ,  C08F12/30 ,  C08G8/18 ,  C08G2261/3223 ,  C08G2261/51 ,  C08G2261/794 ,  C08L25/18 ,  C08L61/14 ,  C08L65/00 ,  C08L2201/10 ,  C08L2201/54 ,  C08L2203/20 ,  C09D5/24 ,  C09D125/02 ,  C09D165/00 ,  H01B1/127 ,  H01G9/0036 ,  H01G9/07 ,  H01G9/15 ,  H01G11/48 ,  Y02E60/13 ,  C08L33/14 ,  C08L33/04 ,  C08F212/14 ,  C08F2220/281 ,  C08F2220/325 ,  C08F2230/085

摘要： There is provided a conductive polymer having high conductivity with excellent heat resistance. Using the conductive polymer, there can be provided solid electrolytic capacitors having low ESR, high reliability, and less leakage current. There can be also provided conductive films having high conductivity and superior heat resistance. There is provided a conductive polymer dispersion liquid obtained by a method in which in the presence of a copolymer from styrenesulfonic acid, and at least one kind of a non-sulfonic acid monomer selected from the group consisting of methacrylate, acrylate, and an unsaturated hydrocarbon containing alkoxysilane compound or its hydrolysate, thiophene or its derivative is polymerized by oxidation polymerization in water, or in an aqueous solution comprising a mixture of water and a water miscible solvent to produce the conductive polymer dispersion liquid. Using the conductive polymer as solid electrolyte, a solid electrolyte capacitor can be provided. Also, using the conductive polymer, a conductive film can be provided.

公开(公告)号：US20180059547A1

公开(公告)日：2018-03-01

申请号：US15254935

申请日：2016-09-01

申请人： Rohm and Haas Electronic Materials LLC

发明人： Charlotte A. Cutler ,  Suzanne M. Coley ,  Owendi Ongayi ,  Christopher P. Sullivan ,  Paul J. LaBeaume ,  Li Cui ,  Shintaro Yamada ,  Mingqi Li ,  James F. Cameron

IPC分类号： G03F7/11 ,  G03F7/16 ,  G03F7/42 ,  G03F7/20 ,  G03F7/30 ,  C08G77/04 ,  C09D5/20 ,  C09D183/04 ,  C08F20/14 ,  C08F24/00 ,  C08G73/12 ,  C08F20/32 ,  C08G67/00 ,  C08F20/28

CPC分类号： G03F7/11 ,  C08F20/10 ,  C08F20/14 ,  C08F20/28 ,  C08F20/32 ,  C08F24/00 ,  C08F220/14 ,  C08F220/20 ,  C08F220/24 ,  C08F222/06 ,  C08F222/40 ,  C08F230/08 ,  C08F2220/1825 ,  C08F2220/1858 ,  C08F2220/1891 ,  C08F2220/282 ,  C08F2220/283 ,  C08F2220/325 ,  C08F2800/10 ,  C08G67/00 ,  C08G73/128 ,  C08G77/04 ,  C09D5/20 ,  C09D183/04 ,  G03F7/0752 ,  G03F7/161 ,  G03F7/20 ,  G03F7/30 ,  G03F7/422 ,  G03F7/423

摘要： Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.

公开(公告)号：US20180030175A1

公开(公告)日：2018-02-01

申请号：US15535606

申请日：2015-12-10

申请人： Sumitomo Chemical Company, Limited

发明人： Yu MIURA ,  Yasutoyo KAWASHIMA ,  Kohei UEDA ,  Yoshinobu NOZUE

IPC分类号： C08F210/02 ,  C08F220/68 ,  C08J9/10 ,  C08L23/08

CPC分类号： C08F210/02 ,  C08F220/68 ,  C08F2810/20 ,  C08F2810/50 ,  C08J9/103 ,  C08J9/107 ,  C08J2203/18 ,  C08J2323/08 ,  C08L23/0869 ,  C08L2205/06 ,  C08L2312/00 ,  C08F220/14 ,  C08F2500/12 ,  C08F2220/325

摘要： A polymer that is capable of affording a heat storage material superior in humidity permeability and shape retention after phase transition and that is superior in molding processability is provided. The polymer includes constitutional units (A) derived from ethylene, constitutional units (B) represented by a specified formula, and optionally includes constitutional units (C) represented by another specified formula. Where the total number of the units (A), the units (B), and the units (C) is 100%, the number of the units (A) accounts for 70% to 99%, the total number of the units (B) and the units (C) accounts for 1% by weight to 30% by weight. Where the total number of the units (B) and the units (C) is 100%, the number of the units (B) accounts for 1% to 100% and the number of the units (C) accounts for 0% to 99%.

公开(公告)号：US09873819B2

公开(公告)日：2018-01-23

申请号：US15321665

申请日：2015-07-17

申请人： TOKUYAMA CORPORATION

发明人： Yasutomo Shimizu ,  Katsuhiro Mori

IPC分类号： G02B5/23 ,  C09D183/14 ,  C08K5/18 ,  C08K5/357 ,  C08K5/1545 ,  C09K9/02 ,  C09D5/32 ,  C08G77/52 ,  G02B5/22 ,  C08G77/00

CPC分类号： C09D183/14 ,  C08F220/20 ,  C08F222/1006 ,  C08F230/08 ,  C08F290/06 ,  C08F290/14 ,  C08F299/08 ,  C08G77/52 ,  C08G77/80 ,  C08K5/1545 ,  C08K5/18 ,  C08K5/357 ,  C09D4/00 ,  C09D5/32 ,  C09K9/02 ,  C09K2211/1007 ,  C09K2211/1033 ,  C09K2211/1088 ,  G02B5/223 ,  G02B5/23 ,  G02B7/10 ,  G02C7/10 ,  G02C7/102 ,  C08F2222/108 ,  C08F2222/1073 ,  C08F2222/1026 ,  C08F2220/325 ,  C08F2230/085 ,  C08F220/36

摘要： A curable composition having excellent storage stability and capable of forming a cured product having excellent scratch resistance.The composition comprises a silsesquioxane monomer having a radically polymerizable group in the molecule and a content of a component having a molecular weight measured by gel permeation chromatography (GPC) of not less than 10,000 of less than 9 mass % and a bifunctional polymerizable monomer represented by the following formula (1). (wherein B and B′ are each an linear or branched alkylene group having 2 to 15 carbon atoms, “c” is an average value of 1 to 20, when a plurality of B's are existent, B's may be the same or different, and R5 and R6 are each a hydrogen atom or methyl group).

公开(公告)号：US20180009955A1

公开(公告)日：2018-01-11

申请号：US15544149

申请日：2016-01-12

申请人： HITACHI, LTD.

发明人： Yuri KAJIHARA ,  Takahito MURAKI ,  Tadashi ARAI ,  Yasuhiko TADA

IPC分类号： C08G81/02 ,  H01F27/32 ,  H01B7/02 ,  C08F220/32 ,  C08F212/08 ,  C09D187/00 ,  C08F220/28 ,  H02K3/30 ,  H01B3/44

CPC分类号： C08G81/027 ,  C08F212/08 ,  C08F220/28 ,  C08F220/32 ,  C08F2220/281 ,  C08F2220/325 ,  C08G59/00 ,  C09D125/14 ,  C09D187/005 ,  H01B3/44 ,  H01B7/02 ,  H01F27/022 ,  H01F27/324 ,  H01L23/293 ,  H01L23/31 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1815 ,  H02K3/30 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A resin produced by a conventional technique has a weak nature in terms of hydrolysis resistance. For example, in a case where the resin produced by a conventional technique is used in an area with a highly humid climate such as Japan for a long period of time, deterioration of the resin due to hydrolysis becomes a concern. A resin composition is described that is optimized in the molecular structure design of the resin and in the catalyst in order to improve the hydrolysis resistance. Specifically, the resin composition contains (1) a copolymer of a vinyl compound having two or more epoxy groups, a carboxylic acid anhydride, and a transesterification reaction catalyst, or (2) a copolymer of a vinyl compound having two or more carboxylic acid anhydride groups, an epoxy, and a transesterification reaction catalyst.

公开(公告)号：US20170335097A1

公开(公告)日：2017-11-23

申请号：US15520337

申请日：2015-10-29

申请人： KANEKA CORPORATION

发明人： Kenji TAKAMIZU

IPC分类号： C08L51/00 ,  C08L27/06

CPC分类号： C08L51/003 ,  C08F220/32 ,  C08L27/06 ,  C08L33/068 ,  C08L51/04 ,  C08L63/00 ,  C08L101/00 ,  C08L2201/08 ,  C08L2205/03 ,  C08L2205/06 ,  C08L2207/53 ,  C08F2220/325 ,  C08F220/14 ,  C08F212/08

摘要： The present invention relates to resin-modifying particles, each of which contains a glycidyl group-containing polymer (B) and a core-shell copolymer (C) at a composite state, and a vinyl chloride resin composition containing a vinyl chloride resin (A) and the resin-modifying particles, and the like.

公开(公告)号：US09822201B2

公开(公告)日：2017-11-21

申请号：US14828128

申请日：2015-08-17

申请人： FUJIFILM Corporation

发明人： Reiko Fukagawa

IPC分类号： G02B26/00 ,  C08F214/16 ,  C08L27/10 ,  G02F1/167 ,  C08L101/00 ,  C08F20/18 ,  C08F30/08

CPC分类号： C08F214/16 ,  C08F20/18 ,  C08F30/08 ,  C08L27/10 ,  C08L101/00 ,  C08L2203/20 ,  G02F1/167 ,  G02F2001/1678 ,  C08F230/08 ,  C08F220/14 ,  C08F2220/325

摘要： The invention relates to reflective particles containing a resin containing a structural unit derived from a compound represented by the following Formula (1), wherein in the formula (1), R represents a polymerizable group except a vinyl group, Ar represents an aromatic group, and W represents a single bond or a divalent linking group. R—W—Ar  Formula (1)