公开(公告)号：US12165990B2

公开(公告)日：2024-12-10

申请号：US18162720

申请日：2023-02-01

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Kuan-Yu Huang ,  Sung-Hui Huang ,  Pai-Yuan Li ,  Shu-Chia Hsu ,  Hsiang-Fan Lee ,  Szu-Po Huang

IPC: H01L23/00 ,  H01L23/04

Abstract: A semiconductor device includes a substrate, an electronic component, a stiffener ring and an adhesive ring. The substrate has a first surface and a second surface opposite to the first surface. The electronic component is over the first surface of the substrate. The stiffener ring is over the first surface of the substrate. The stiffener ring includes a plurality of side parts and a plurality of corner parts coupled to the side parts. Heights of the corner parts are less than heights of the side parts. The adhesive ring is interposed between the first surface of the substrate and the stiffener ring. The adhesive ring includes a plurality of side portions and a plurality of corner portions coupled to the side portions. Thicknesses of the side portions are less than thicknesses of the corner portions.

公开(公告)号：US11764123B2

公开(公告)日：2023-09-19

申请号：US17857166

申请日：2022-07-04

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Sung-Hui Huang ,  Shang-Yun Hou ,  Tien-Yu Huang ,  Heh-Chang Huang ,  Kuan-Yu Huang ,  Shu-Chia Hsu ,  Yu-Shun Lin

IPC: H01L23/31 ,  H01L25/16

CPC classification number: H01L23/3185 ,  H01L25/167

Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.

公开(公告)号：US20230050785A1

公开(公告)日：2023-02-16

申请号：US17401265

申请日：2021-08-12

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ting-Yu Yeh ,  Ching-He Chen ,  Kuo-Chiang Ting ,  Weiming Chris Chen ,  Chia-Hao Hsu ,  Kuan-Yu Huang ,  Shu-Chia Hsu

IPC: H01L23/498 ,  H01L25/065 ,  H01L21/48

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The method includes the following steps. A plurality of conductive balls is placed over a circuit substrate, where each of the conductive balls is placed over a contact area of one of a plurality of contact pads that is accessibly revealed by a patterned mask layer. The conductive balls are reflowed to form a plurality of external terminals with varying heights connected to the contact pads of the circuit substrate, where a first external terminal of the external terminals formed in a first region of the circuit substrate and a second external terminal of the external terminals formed in a second region of the circuit substrate are non-coplanar.

公开(公告)号：US20220336309A1

公开(公告)日：2022-10-20

申请号：US17857166

申请日：2022-07-04

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Sung-Hui Huang ,  Shang-Yun Hou ,  Tien-Yu Huang ,  Heh-Chang Huang ,  Kuan-Yu Huang ,  Shu-Chia Hsu ,  Yu-Shun Lin

IPC: H01L23/31 ,  H01L25/16

Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.

公开(公告)号：US10985125B2

公开(公告)日：2021-04-20

申请号：US17029537

申请日：2020-09-23

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Kuan-Yu Huang ,  Sung-Hui Huang ,  Shu-Chia Hsu ,  Leu-Jen Chen ,  Yi-Wei Liu ,  Shang-Yun Hou ,  Jui-Hsieh Lai ,  Tsung-Yu Chen ,  Chien-Yuan Huang ,  Yu-Wei Chen

IPC: H01L29/40 ,  H01L21/44 ,  H01L23/00 ,  H01L21/56 ,  H01L23/522

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

公开(公告)号：US10340242B2

公开(公告)日：2019-07-02

申请号：US15687943

申请日：2017-08-28

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Kuan-Yu Huang ,  Tzu-Kai Lan ,  Shou-Chih Yin ,  Shu-Chia Hsu ,  Pai-Yuan Li ,  Sung-Hui Huang ,  Hsiang-Fan Lee ,  Ying-Shin Han

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L25/18

Abstract: A semiconductor device includes a substrate, a package, first conductors and second conductors. The substrate includes a first surface and a second surface opposite to the first surface. The package is disposed over the substrate. The first conductors are disposed over the substrate. The second conductors are disposed over the substrate, wherein the first conductors and the second conductors are substantially at a same tier, and a width of the second conductor is larger than a width of the first conductor.

公开(公告)号：US20230386985A1

公开(公告)日：2023-11-30

申请号：US18359864

申请日：2023-07-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ting-Yu Yeh ,  Cing-He Chen ,  Kuo-Chiang Ting ,  Weiming Chris Chen ,  Chia-Hao Hsu ,  Kuan-Yu Huang ,  Shu-Chia Hsu

IPC: H01L23/498 ,  H01L21/48 ,  H01L25/065

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/0655

Abstract: A semiconductor structure includes a solder resist layer disposed on a circuit substrate and partially covering contact pads of the circuit substrate, and external terminals disposed on the solder resist layer and extending through the solder resist layer to land on the contact pads. The external terminals include a first external terminal and a second external terminal which have different heights. A first interface between the first external terminal and corresponding one of the contact pads underlying the first external terminal is less than a second interface between the second external terminal and another corresponding one of the contact pads underlying the second external terminal.

公开(公告)号：US11587886B2

公开(公告)日：2023-02-21

申请号：US16854666

申请日：2020-04-21

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Kuan-Yu Huang ,  Sung-Hui Huang ,  Pai-Yuan Li ,  Shu-Chia Hsu ,  Hsiang-Fan Lee ,  Szu-Po Huang

IPC: H01L23/00 ,  H01L23/04

Abstract: A semiconductor device includes a substrate, an electronic component, a ring structure and an adhesive layer. The substrate has a first surface. The electronic component is over the first surface of the substrate. The ring structure is over the first surface of the substrate, wherein the ring structure includes a first part having a first height, and a second part recessed from the bottom surface and having a second height lower than the first height. The adhesive layer is interposed between the first part of the ring structure and the substrate, and between the second part of the ring structure and the substrate.