公开(公告)号：US08278745B2

公开(公告)日：2012-10-02

申请号：US12543104

申请日：2009-08-18

Applicant: Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

Inventor： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

IPC: H01L23/52

CPC classification number: H05K3/325 ,  H05K2201/0314 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2018

Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

Abstract translation: 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。

公开(公告)号：US20100314094A1

公开(公告)日：2010-12-16

申请号：US12483542

申请日：2009-06-12

Applicant: Shawn A. Hall

Inventor： Shawn A. Hall

IPC: G05D23/00 ,  F28F13/06 ,  F28F13/00 ,  G05D7/00

CPC classification number: G05D23/19 ,  F28D2021/0019 ,  F28F27/00

Abstract: An apparatus for cooling N heat-producing devices, where AT is an integer no smaller than one, using a cooling fluid that may be supplied at a temperature below the dew-point temperature of ambient air. To avoid condensation on the heat-producing devices, the cold fluid is warmed, upstream of the heat-producing devices, to a temperature T0 that is above the dew-point. The warming is accomplished, in a heat exchanger, by the warm fluid returning from the heat-producing devices. The amount of warming is controlled by periodically measuring T0 as well as the N temperatures downstream of the N heat-producing devices, and sending these N+1 temperature measurements to a control element that implements a control algorithm whose purpose is to achieve a set-point value of T0 by regulating, via N control valves, the flow of fluid to the N heat-producing devices. Also provided is a method for cooling the N heat-pro during devices pursuant to the inventive apparatus by a temperature control over the cooling fluid.

Abstract translation: 使用可以在低于环境空气的露点温度的温度下供给的冷却流体来冷却N为不小于1的整数的N个发热装置的装置。 为了避免发热装置上的冷凝，将冷流体在发热装置的上游加热到高于露点的温度T0。 在热交换器中，通过从发热装置返回的温热流体来实现升温。 通过周期性地测量N个发热装置的T0和N温度来控制加热量，并且将这些N + 1温度测量值发送到实现控制算法的控制元件，该控制元件的目的是实现设定值， 通过N个控制阀通过调节流向N个发热装置的流体的流量来调节T0的点值。 还提供了一种通过对冷却流体进行温度控制来根据本发明的装置来冷却N热源的方法。

公开(公告)号：US20090173017A1

公开(公告)日：2009-07-09

申请号：US11969999

申请日：2008-01-07

Applicant: Shawn A. Hall

Inventor： Shawn A. Hall

IPC: E04C2/00

CPC classification number: H05K7/20745 ,  A62C2/241 ,  A62C3/16

Abstract: An arrangement for the cooling of computer data centers. More particularly, the arrangement eliminates the problems present in the uneven or inadequate cooling of computer racks due to unwanted airflows, which are encountered between so-called hot aisles and cold aisles present in a computer data center. Specifically, this problem is solved through the provision of partitions which, under normal circumstances, prevent the unwanted airflows by standing in a vertical orientation, yet which, in the event of a fire, collapse from the vertical orientation to a horizontal orientation, thereby avoiding interference with water sprays from sprinkler heads, and thus complying with fire codes and ordinances. Moreover, also employed is a method of preventing the unwanted air flows by utilization of the novel arrangement comprising the fire-code-compatible, collapsible partitions.

Abstract translation: 一个用于冷却计算机数据中心的安排。 更具体地，该布置消除了由于在计算机数据中心中存在的所谓热通道和冷通道之间遇到的不期望的气流而导致计算机机架的不均匀或不充分的冷却中存在的问题。 具体地说，这个问题是通过提供这样的隔板得以解决的：在正常情况下，通过垂直方向站立来防止不需要的气流，而在发生火灾的情况下，从垂直方向到水平方向就会崩溃，从而避免 干扰洒水头喷水，从而符合消防法规。 此外，还采用了通过利用包括防火码兼容的可折叠隔板的新颖装置来防止不想要的空气流动的方法。

公开(公告)号：US20080123300A1

公开(公告)日：2008-05-29

申请号：US11564353

申请日：2006-11-29

Applicant: Shurong Tian ,  Shawn A. Hall ,  Paul W. Coteus

Inventor： Shurong Tian ,  Shawn A. Hall ,  Paul W. Coteus

IPC: H05K7/20

CPC classification number: H01L23/3672 ,  G11C5/04 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A folded heatsink for cooling heat-producing devices. The folded heatsink includes a substantially planar base having a first end and a second end. The base is intended to be affixed in thermal contact to an exposed, substantially planar surface of one or more heat-producing devices. The folded heatsink also includes two shoulders each having a proximal end and a distal end. The proximal ends of the shoulders project substantially at right angles from the first and second ends of the base. The folded heatsink also includes two arms each having a proximal end and a distal end. The proximal ends of the arms project substantially at right angles from the distal ends of the shoulders such that the base, shoulders and arms from a nearly closed rectangular tube formed from a continuous sheet of metal.

Abstract translation: 用于冷却发热装置的折叠式散热器。 折叠式散热器包括具有第一端和第二端的基本平坦的基座。 底座旨在与一个或多个发热装置的暴露的，基本平坦的表面热接触地固定。 折叠的散热器还包括两个肩部，每个肩部具有近端和远端。 肩部的近端从基座的第一端和第二端基本成直角地突出。 折叠的散热器还包括两个臂，每个臂具有近端和远端。 臂的近端从肩部的远端基本上以直角突出，使得基部，肩部和臂从近似接近的矩形管由连续的金属片形成。

公开(公告)号：US5312224A

公开(公告)日：1994-05-17

申请号：US30984

申请日：1993-03-12

Applicant: John S. Batchelder ,  Shawn A. Hall ,  Robert R. Jackson

Inventor： John S. Batchelder ,  Shawn A. Hall ,  Robert R. Jackson

IPC: F04C2/00 ,  B29C47/38 ,  B29C47/60 ,  F04D3/02 ,  F04D29/18 ,  F04D3/00 ,  B23P15/00

CPC classification number: B29C47/6012 ,  B29C47/38 ,  F04D29/183 ,  F04D3/02 ,  B29C2045/465 ,  B29C47/0014 ,  B29C47/0023 ,  B29C47/60 ,  Y10T29/49236 ,  Y10T29/49245

Abstract: A rotary viscosity pump is provided that has a housing and an impeller. The housing has a conical chamber with an outlet at a narrow end of the chamber. The impeller has a conical section with a logarithmic spiral groove along its exterior. The spacing between the housing and the impeller can have either a constant gap or a gap that decreases along the length of the impeller. The depth of the groove can be constant, increase, or decrease in depth along the length of the impeller.

Abstract translation: 提供一种具有壳体和叶轮的旋转粘度泵。 壳体具有在腔室的窄端处具有出口的锥形室。 叶轮具有沿其外部的对数螺旋槽的圆锥形截面。 壳体和叶轮之间的间隔可以具有沿叶轮的长度减小的恒定间隙或间隙。 槽的深度可以沿叶轮的长度恒定，增加或减小。

公开(公告)号：US07975379B2

公开(公告)日：2011-07-12

申请号：US12462985

申请日：2009-08-11

Applicant: Gareth G. Hougham ,  Brian S. Beaman ,  John S. Corbin ,  Paul Coteus ,  Shawn A. Hall ,  Kathleen C. Hinge ,  Theron L. Lewis ,  Frank R. Libsch ,  Amanda E. E. Mikhail

Inventor： Gareth G. Hougham ,  Brian S. Beaman ,  John S. Corbin ,  Paul Coteus ,  Shawn A. Hall ,  Kathleen C. Hinge ,  Theron L. Lewis ,  Frank R. Libsch ,  Amanda E. E. Mikhail

IPC: H01R9/00

CPC classification number: H05K3/368 ,  H01R12/52 ,  H01R12/714 ,  H05K1/0269 ,  H05K3/325 ,  H05K2201/10378 ,  Y10T29/49117 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces.

Abstract translation: LGA连接器采用预制到不同高度的按钮或弹簧触点制成，以适应特定产品类型的典型模块或PCB的初始形貌。 这是通过测量第一电子装置和第二电子装置的配合表面的形貌来制造的; 制造内插器触点以形成具有用于接触配合表面的相应反向形状的相对非平面侧; 并且将所述插入件夹在所述第一和第二电子设备之间，所述相对侧与相应的配合表面相接触。

公开(公告)号：US20090122483A1

公开(公告)日：2009-05-14

申请号：US11939165

申请日：2007-11-13

Applicant: Shawn A. Hall

Inventor： Shawn A. Hall

IPC: H05K7/20

CPC classification number: H05K7/2079

Abstract: A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end of the row. The cabinets have a space therebetween wherein a heat exchanger is positioned between and adjacent to the cabinets, thereby the cabinets and heat exchangers alternate in the row. Each heat exchanger allows flow of a second fluid therethrough for cooling the first fluid. A fluid-moving device is positioned adjacent the heat-producing devices for encouraging flow of the first fluid through the cabinets' heat-producing devices and through the heat exchangers, thereby encouraging heat transfer in each of the heat exchangers from the first fluid to the second fluid.

Abstract translation: 一种冷却装置和方法，包括多个发热装置，所述多个发热装置定位在排列成一排的多个机柜中，所述多个机柜允许第一流体流过制热装置和机柜，其中流从所述排的上游端引导 到行的下游端。 机柜之间具有空间，其中热交换器位于机柜之间并且与机柜相邻，从而机柜和热交换器在行中交替。 每个热交换器允许第二流体流过其中以冷却第一流体。 流体移动装置邻近发热装置定位，以促使第一流体流过机柜的发热装置并通过热交换器，从而促使每个热交换器中的热传递从第一流体到第 第二流体。

公开(公告)号：US5343548A

公开(公告)日：1994-08-30

申请号：US990865

申请日：1992-12-15

Applicant: Shawn A. Hall ,  Ramon Lane ,  Han-chung Wang

Inventor： Shawn A. Hall ,  Ramon Lane ,  Han-chung Wang

IPC: G02B6/36 ,  G02B6/42 ,  H01S5/00 ,  H01S5/40

CPC classification number: G02B6/4227 ,  G02B6/4249 ,  H01S5/4025 ,  G02B6/4221 ,  G02B6/4225 ,  G02B6/4226

Abstract: An apparatus for aligning a substantially co-linear array of optical devices with a substantially co-linear array of optical fibers comprising; a carrier having a slot for receiving the array of devices and the array of optical fibers; a first support plate having a first holder for holding the array of devices in place with respect to the first support plate, and electrical connections for electrically connecting to selected ones of the devices in the array of devices; a second support plate having a second holder for holding the array of fibers in rough alignment with the array of devices; and a positioner for positioning the carrier with respect to the first holder and the second holder so that when the holders are activated, the array of devices and the array of fibers are held in approximate alignment without the presence of the carrier.

Abstract translation: 一种用于将光学器件的基本上共线的阵列与基本上共线的光纤阵列对准的装置，包括： 具有用于接收器件阵列和光纤阵列的槽的载体; 第一支撑板，其具有第一保持器，用于将装置阵列相对于第一支撑板保持在适当位置，以及用于电连接到装置阵列中的选定装置的电连接; 第二支撑板，具有用于保持与所述装置阵列粗略对准的纤维阵列的第二支架; 以及定位器，用于相对于第一保持器和第二保持器定位托架，使得当保持器被启动时，器件阵列和光纤阵列在不存在载体的情况下保持大致对准。

公开(公告)号：US09081501B2

公开(公告)日：2015-07-14

申请号：US13004007

申请日：2011-01-10

Applicant: Sameh Asaad ,  Ralph E. Bellofatto ,  Michael A. Blocksome ,  Matthias A. Blumrich ,  Peter Boyle ,  Jose R. Brunheroto ,  Dong Chen ,  Chen-Yong Cher ,  George L. Chiu ,  Norman Christ ,  Paul W. Coteus ,  Kristan D. Davis ,  Gabor J. Dozsa ,  Alexandre E. Eichenberger ,  Noel A. Eisley ,  Matthew R. Ellavsky ,  Kahn C. Evans ,  Bruce M. Fleischer ,  Thomas W. Fox ,  Alan Gara ,  Mark E. Giampapa ,  Thomas M. Gooding ,  Michael K. Gschwind ,  John A. Gunnels ,  Shawn A. Hall ,  Rudolf A. Haring ,  Philip Heidelberger ,  Todd A. Inglett ,  Brant L. Knudson ,  Gerard V. Kopcsay ,  Sameer Kumar ,  Amith R. Mamidala ,  James A. Marcella ,  Mark G. Megerian ,  Douglas R. Miller ,  Samuel J. Miller ,  Adam J. Muff ,  Michael B. Mundy ,  John K. O'Brien ,  Kathryn M. O'Brien ,  Martin Ohmacht ,  Jeffrey J. Parker ,  Ruth J. Poole ,  Joseph D. Ratterman ,  Valentina Salapura ,  David L. Satterfield ,  Robert M. Senger ,  Brian Smith ,  Burkhard Steinmacher-Burow ,  William M. Stockdell ,  Craig B. Stunkel ,  Krishnan Sugavanam ,  Yutaka Sugawara ,  Todd E. Takken ,  Barry M. Trager ,  James L. Van Oosten ,  Charles D. Wait ,  Robert E. Walkup ,  Alfred T. Watson ,  Robert W. Wisniewski ,  Peng Wu

Inventor： Sameh Asaad ,  Ralph E. Bellofatto ,  Michael A. Blocksome ,  Matthias A. Blumrich ,  Peter Boyle ,  Jose R. Brunheroto ,  Dong Chen ,  Chen-Yong Cher ,  George L. Chiu ,  Norman Christ ,  Paul W. Coteus ,  Kristan D. Davis ,  Gabor J. Dozsa ,  Alexandre E. Eichenberger ,  Noel A. Eisley ,  Matthew R. Ellavsky ,  Kahn C. Evans ,  Bruce M. Fleischer ,  Thomas W. Fox ,  Alan Gara ,  Mark E. Giampapa ,  Thomas M. Gooding ,  Michael K. Gschwind ,  John A. Gunnels ,  Shawn A. Hall ,  Rudolf A. Haring ,  Philip Heidelberger ,  Todd A. Inglett ,  Brant L. Knudson ,  Gerard V. Kopcsay ,  Sameer Kumar ,  Amith R. Mamidala ,  James A. Marcella ,  Mark G. Megerian ,  Douglas R. Miller ,  Samuel J. Miller ,  Adam J. Muff ,  Michael B. Mundy ,  John K. O'Brien ,  Kathryn M. O'Brien ,  Martin Ohmacht ,  Jeffrey J. Parker ,  Ruth J. Poole ,  Joseph D. Ratterman ,  Valentina Salapura ,  David L. Satterfield ,  Robert M. Senger ,  Brian Smith ,  Burkhard Steinmacher-Burow ,  William M. Stockdell ,  Craig B. Stunkel ,  Krishnan Sugavanam ,  Yutaka Sugawara ,  Todd E. Takken ,  Barry M. Trager ,  James L. Van Oosten ,  Charles D. Wait ,  Robert E. Walkup ,  Alfred T. Watson ,  Robert W. Wisniewski ,  Peng Wu

IPC: G06F15/173 ,  G06F9/06 ,  G06F15/76

CPC classification number: G06F13/287 ,  G06F9/06 ,  G06F9/3004 ,  G06F9/30047 ,  G06F9/3885 ,  G06F12/0811 ,  G06F12/0831 ,  G06F12/0862 ,  G06F12/0864 ,  G06F12/1027 ,  G06F15/17381 ,  G06F15/17387 ,  G06F15/76 ,  G06F15/8069 ,  G06F2212/1016 ,  G06F2212/602 ,  G06F2212/6022 ,  G06F2212/6024 ,  G06F2212/6032 ,  Y02D10/13 ,  Y02D10/14

Abstract: A Multi-Petascale Highly Efficient Parallel Supercomputer of 100 petaOPS-scale computing, at decreased cost, power and footprint, and that allows for a maximum packaging density of processing nodes from an interconnect point of view. The Supercomputer exploits technological advances in VLSI that enables a computing model where many processors can be integrated into a single Application Specific Integrated Circuit (ASIC). Each ASIC computing node comprises a system-on-chip ASIC utilizing four or more processors integrated into one die, with each having full access to all system resources and enabling adaptive partitioning of the processors to functions such as compute or messaging I/O on an application by application basis, and preferably, enable adaptive partitioning of functions in accordance with various algorithmic phases within an application, or if I/O or other processors are underutilized, then can participate in computation or communication nodes are interconnected by a five dimensional torus network with DMA that optimally maximize the throughput of packet communications between nodes and minimize latency.

Abstract translation: 具有100 petaOPS规模计算的多Petascale高效并行超级计算机，其成本，功耗和占地面积都在降低，并且允许从互连角度来看处理节点的最大封装密度。 超级计算机利用了VLSI的技术进步，实现了许多处理器可以集成到单个专用集成电路（ASIC）中的计算模型。 每个ASIC计算节点包括利用集成到一个管芯中的四个或更多个处理器的片上系统ASIC，每个处理器具有对所有系统资源的完全访问，并且使得处理器能够对诸如计算或消息传递I / O 并且优选地，根据应用内的各种算法阶段实现功能的自适应分割，或者如果I / O或其他处理器未被充分利用，则可以参与计算或通信节点通过五维环面网络互连 使用DMA来最大限度地最大化节点之间的分组通信的吞吐量并最小化等待时间。

公开(公告)号：US20080054430A1

公开(公告)日：2008-03-06

申请号：US11511815

申请日：2006-08-29

Applicant: Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

Inventor： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

IPC: H01L23/02

CPC classification number: H05K3/325 ,  H05K2201/0314 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2018

Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

Abstract translation: 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。