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    Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing
    1.
    发明授权
    Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing 失效
    对准结构具有框架结构和桥接连接以联接和对准插座壳体的段

    公开(公告)号：US08267701B2

    公开(公告)日：2012-09-18

    申请号：US12783451

    申请日：2010-05-19

    申请人： Brian S. Beaman ,  William L. Brodsky ,  John L. Colbert ,  Mark K. Hoffmeyer ,  Yuet-Ying Yu

    发明人： Brian S. Beaman ,  William L. Brodsky ,  John L. Colbert ,  Mark K. Hoffmeyer ,  Yuet-Ying Yu

    IPC分类号： H01R12/00

    CPC分类号： H05K7/1069 ,  H01L23/4006 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus is disclosed for aligning socket housing segments for an area array device. Each socket housing segment includes at least a first surface and a second surface, with the second surface opposite the first surface. The second surface of each socket housing segment provides electrical connections for a portion of the area array device. Socket contact pads are disposed on the first surfaces of the plurality of socket housing segments. The socket contact pads correspond to substrate contact pads disposed on a substrate. One or more alignment structures are disposed at a space between the socket housing segments. Each alignment structure is coupled to at least two of the socket housing segments. The one or more alignment structures maintain a predetermined alignment of each socket housing segment so that the socket contact pads align with the substrate contact pads during a surface mount connection process.

    摘要翻译： 公开了一种用于对准用于区域阵列装置的插座壳体段的装置。 每个插座壳体段至少包括第一表面和第二表面，其中第二表面与第一表面相对。 每个插座壳体段的第二表面为区域阵列器件的一部分提供电连接。 插座接触垫设置在多个插座壳体段的第一表面上。 插座接触焊盘对应于设置在衬底上的衬底接触焊盘。 一个或多个对准结构设置在插座壳体段之间的空间处。 每个对准结构联接到插座壳体段中的至少两个。 一个或多个对准结构保持每个插座壳体段的预定对准，使得在表面安装连接过程期间，插座接触垫与衬底接触垫对准。

    A PRINTED CIRCUIT BOARD WITH HOLES WITH CONDUCTORS COMPRESSING COMPLIANT PORTION OF CONTACT POSTS
    3.
    发明申请
    A PRINTED CIRCUIT BOARD WITH HOLES WITH CONDUCTORS COMPRESSING COMPLIANT PORTION OF CONTACT POSTS 失效
    带导体的打印电路板压缩接触点的合规部分

    公开(公告)号：US20110151688A1

    公开(公告)日：2011-06-23

    申请号：US12642066

    申请日：2009-12-18

    申请人： Brian S. Beaman

    发明人： Brian S. Beaman

    IPC分类号： H01R12/00

    CPC分类号： H01R13/2407 ,  H01R12/585

    摘要： An apparatus, system, and method are disclosed for providing electrical connections for an area array device. Each of a plurality of holes in a circuit board has a conductor within it and has an opening on a side of the circuit board. Electrically conductive contact posts extend from the openings of the holes. The contact posts are in a pattern corresponding to contact pads on an area array device. A compliant portion of each contact post is inserted within a hole. The conductor compresses the compliant portion to removably secure the contact post within the hole. The conductors form an electrical connection with the contact post. A spring portion of each contact post extends away from the circuit board. The spring portion is compressible toward the circuit board, and provides an electrical connection between a contact post and a contact pad in response to contact with the contact pad.

    摘要翻译： 公开了一种用于为区域阵列装置提供电连接的装置，系统和方法。 电路板中的多个孔中的每一个在其内具有导体，并且在电路板的一侧具有开口。 导电接触柱从孔的开口延伸。 接触柱是对应于区域阵列装置上的接触焊盘的图案。 每个接触柱的柔顺部分插入孔内。 导体压缩柔顺部分以可拆卸地将接触柱固定在孔内。 导体与接触柱形成电气连接。 每个接触柱的弹簧部分远离电路板延伸。 弹簧部分可朝向电路板压缩，并且响应于与接触垫的接触而在接触柱和接触垫之间提供电连接。