公开(公告)号：US08597032B2

公开(公告)日：2013-12-03

申请号：US13035921

申请日：2011-02-26

Applicant: William L. Brodsky ,  Eric J. McKeever ,  John G. Torok

Inventor： William L. Brodsky ,  Eric J. McKeever ,  John G. Torok

IPC: H01R12/00 ,  H05K1/00

CPC classification number: G06F1/183

Abstract: A system to mate electronic assemblies includes a computer backplane, and a first electronic interconnect carried by the computer backplane configured to operationally mate with a first electronic assembly. The system also includes a second electronic interconnect carried by the computer backplane that is physically separate from the first electronic interconnect, the second electronic interconnect configured to operationally mate with a second electronic assembly where the first electronic assembly and the second electronic assembly mate with the computer backplane at substantially a same time.

Abstract translation: 配合电子组件的系统包括计算机背板和由计算机背板承载的第一电子互连，该第一电子互连被配置为可操作地与第一电子组件配合。 该系统还包括由计算机背板承载的与第一电子互连物理分离的第二电子互连，第二电子互连配置成与第二电子组件可操作地配合，其中第一电子组件和第二电子组件与计算机配合 背板基本相同。

公开(公告)号：US07795724B2

公开(公告)日：2010-09-14

申请号：US11847606

申请日：2007-08-30

Applicant: William L. Brodsky ,  James A. Busby ,  Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  David L. Questad ,  Robin A. Susko

Inventor： William L. Brodsky ,  James A. Busby ,  Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  David L. Questad ,  Robin A. Susko

IPC: H01L23/34

CPC classification number: H01L23/3121 ,  H01L23/4006 ,  H01L23/42 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2023/4081 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/05599

Abstract: An LGA structure is provided having at least one semiconductor device over a substrate and a mechanical load apparatus over the semiconductor device. The structure includes a load-distributing material between the mechanical load apparatus and the substrate. Specifically, the load-distributing material is proximate a first side of the semiconductor device and a second side of the semiconductor device opposite the first side of the semiconductor device. Furthermore, the load-distributing material completely surrounds the semiconductor device and contacts the mechanical load apparatus, the substrate, and the semiconductor device. The load-distributing material can be thermally conductive and comprises an elastomer and/or a liquid. The load-distributing material comprises a LGA interposer adapted to connect the substrate to a PCB below the substrate and/or a second substrate. Moreover, the load-distributing material comprises compressible material layers and rigid material layers. The load-distributing material comprises a rigid material incased in a compressible material.

Abstract translation: 提供LGA结构，其具有在衬底上的至少一个半导体器件和半导体器件上的机械负载设备。 该结构包括在机械负载装置和基板之间的负载分配材料。 具体地，负载分布材料靠近半导体器件的第一侧，并且半导体器件的与半导体器件的第一侧相对的第二侧。 此外，负载分布材料完全围绕半导体器件并接触机械负载装置，衬底和半导体器件。 载荷分布材料可以是导热的并且包括弹性体和/或液体。 负载分配材料包括适于将衬底连接到衬底下面的PCB和/或第二衬底的LGA插入器。 此外，载荷分布材料包括可压缩材料层和刚性材料层。 载荷分配材料包括浸在可压缩材料中的刚性材料。

公开(公告)号：US07709951B2

公开(公告)日：2010-05-04

申请号：US11687037

申请日：2007-03-16

Applicant: William L. Brodsky ,  Peter J. Brofman ,  James A. Busby ,  Bruce J. Chamberlin ,  Scott A. Cummings ,  David L. Edwards ,  Thomas J. Fleischman ,  Michael J. Griffin, IV ,  Sushumna Iruvanti ,  David C. Long ,  Jennifer V. Muncy ,  Robin A. Susko

Inventor： William L. Brodsky ,  Peter J. Brofman ,  James A. Busby ,  Bruce J. Chamberlin ,  Scott A. Cummings ,  David L. Edwards ,  Thomas J. Fleischman ,  Michael J. Griffin, IV ,  Sushumna Iruvanti ,  David C. Long ,  Jennifer V. Muncy ,  Robin A. Susko

IPC: H01L23/34 ,  H01L23/495 ,  H01L23/48

CPC classification number: H01L23/42 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01L2224/0401

Abstract: Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.

Abstract translation: 使用柔性热枕头增强电子部件传热的方法，装置和组件。 柔性热枕头具有密封在顶部和底部导电层之间的导热材料，底层具有位于枕头的中心部分的具有间隙的相对侧上的柔性容器。 枕头可能具有粗糙的内表面以增加枕头内的内表面积，以增强散热。 在电子组件中，枕头的中心部分位于散热器和用于其之间的热耦合的发热部件之间。 在热循环期间，枕头的柔性储存器膨胀以保持从间隙挤出的导热材料，然后收缩以迫使这种挤出的材料回到间隙中。 外部压力源可以接触枕头，以进一步迫使挤出的导热材料回到间隙中。

公开(公告)号：US20100020505A1

公开(公告)日：2010-01-28

申请号：US12180700

申请日：2008-07-28

Applicant: William L. Brodsky ,  Kevin R. Covi

Inventor： William L. Brodsky ,  Kevin R. Covi

IPC: H05K7/20 ,  H05K1/14

CPC classification number: H05K7/1061 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/0271 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/2009

Abstract: A printed circuit board (PCB) assembly is disclosed. The PCB assembly includes a first PCB, a second PCB and a land grid array (LGA). The first PCB includes signal interconnects for transmitting logic signals and power interconnects for transmitting power signals. In contrast, the second PCB includes only power interconnects for transmitting power signals exclusively. The second PCB also has significantly less vias than the first PCB. The second PCB is connected to the first PCB via the LGA.

Abstract translation: 公开了印刷电路板（PCB）组件。 PCB组件包括第一PCB，第二PCB和焊盘格栅阵列（LGA）。 第一个PCB包括用于发送逻辑信号的信号互连和用于发送功率信号的功率互连。 相比之下，第二PCB仅包括仅用于发送功率信号的电力互连。 第二个PCB还具有比第一个PCB显着更少的通孔。 第二个PCB通过LGA连接到第一个PCB。

公开(公告)号：US07436057B2

公开(公告)日：2008-10-14

申请号：US11162389

申请日：2005-09-08

Applicant: David C. Long ,  William L. Brodsky ,  Jason S. Miller ,  John G. Torok ,  Jeffrey A. Zitz

Inventor： David C. Long ,  William L. Brodsky ,  Jason S. Miller ,  John G. Torok ,  Jeffrey A. Zitz

IPC: H01L23/12 ,  H01L21/00 ,  H05K1/14

CPC classification number: H01L23/4093 ,  H01L23/16 ,  H01L2224/16 ,  H01L2224/32014 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/00

Abstract: An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.

Abstract translation: 电子模块和组装电子模块的方法。 电路板通过连接器阵列连接到芯片基板，并且基座部件位于电路板的远离芯片基板和连接器阵列的一侧。 弹性体结构被放置在电路板和基底构件之间。 弹性体结构在邻近电路板的第一限定平面和邻近基底构件的第二限定平面之间具有空隙，空隙适于允许弹性材料在结构中的局部变形。 该方法包括在电路板和基底构件之间施加压缩力以至少部分地压缩弹性体结构以改善电路板上的负载均衡。

公开(公告)号：US20080220634A1

公开(公告)日：2008-09-11

申请号：US12031156

申请日：2008-02-14

Applicant: William L. Brodsky ,  Mark G. Clark ,  Amanda E.E. Mikhail ,  Arvind K. Sinha ,  Scott A. Shurson ,  Jason T. Stoll

Inventor： William L. Brodsky ,  Mark G. Clark ,  Amanda E.E. Mikhail ,  Arvind K. Sinha ,  Scott A. Shurson ,  Jason T. Stoll

IPC: H01R12/00

CPC classification number: H01R12/7011 ,  H01R12/716 ,  H01R12/721 ,  H01R13/514 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10537 ,  H05K2201/209 ,  Y02P70/611

Abstract: An electrical connector includes a first connector body having an interlocking feature extending therefrom. The interlocking feature interlocks the first connector body with a complimentary interlocking feature extending from an adjacent second connector body to distribute a lateral force on either the first or second connector bodies across the adjacent connector body thereby reducing a rotational moment at a base of each electrical connector connected to a printed circuit board (PCB).

Abstract translation: 电连接器包括具有从其延伸的互锁特征的第一连接器主体。 互锁特征将第一连接器主体与相邻的第二连接器主体相互延伸的互补互锁特征互锁，以将第二或第二连接器主体上的横向力分布在相邻的连接器本体上，从而减小每个电连接器的基座处的旋转力矩 连接到印刷电路板（PCB）。

公开(公告)号：US07204697B2

公开(公告)日：2007-04-17

申请号：US11262134

申请日：2005-10-28

Applicant: William L. Brodsky ,  William E. Buchler, Jr. ,  Benson Chan ,  Michael A. Gaynes

Inventor： William L. Brodsky ,  William E. Buchler, Jr. ,  Benson Chan ,  Michael A. Gaynes

IPC: H01R9/09

CPC classification number: H01R13/2414 ,  H01R12/714 ,  H01R13/2407 ,  H05K7/1069

Abstract: A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.

公开(公告)号：US07137826B2

公开(公告)日：2006-11-21

申请号：US10906810

申请日：2005-03-08

Applicant: William L. Brodsky ,  James A. Busby ,  Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  Robin A. Susko ,  James R. Wilcox

Inventor： William L. Brodsky ,  James A. Busby ,  Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  Robin A. Susko ,  James R. Wilcox

IPC: H01R12/00

CPC classification number: H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0501 ,  H01L2224/05011 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R4/01 ,  H01R12/52 ,  H05K3/325 ,  H05K2201/068 ,  H05K2201/209 ,  H05K2203/1105 ,  H01L2224/05099

Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

Abstract translation: 公开了一种用于形成用于半导体封装的可移除互连的方法和结构，其中连接器适于在经受温度变化时从第一形状重复地变为第二形状，并且在不受影响时重复地返回到第一形状 到温度变化。 当连接器处于其第二形状时，连接器可以断开，并且当连接器处于其第一形状时连接器不能断开。

公开(公告)号：US06731012B1

公开(公告)日：2004-05-04

申请号：US09471679

申请日：1999-12-23

Applicant: William L. Brodsky ,  Sanjeev B. Sathe ,  George H. Thiel

Inventor： William L. Brodsky ,  Sanjeev B. Sathe ,  George H. Thiel

IPC: H01L2348

CPC classification number: H01L24/32 ,  H01L21/304 ,  H01L23/42 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2224/32057 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A semiconductor chip package having a non-planar chip therein, to reduce the stress concentrations between the chip and cover plate. In particular, a chip and method of forming a chip having a non-planar or “domed” back surface, wherein the thickness of the non-planar chip is greatest substantially near the center of the chip. Further, a method of rounding the edges or corners of the chip to reduce crack propagation originating at the edges of the chip.

Abstract translation: 一种其中具有非平面芯片的半导体芯片封装，以减小芯片和盖板之间的应力集中。 具体地说，一种形成具有非平面或“半球形”背面的芯片的芯片和方法，其中非平面芯片的厚度基本上在芯片的中心附近最大。 此外，一种使芯片的边缘或角部四舍五入以减少源自芯片边缘的裂纹扩展的方法。

公开(公告)号：US06679707B1

公开(公告)日：2004-01-20

申请号：US10254239

申请日：2002-09-25

Applicant: William L. Brodsky ,  William E. Buchler, Jr. ,  Benson Chan

Inventor： William L. Brodsky ,  William E. Buchler, Jr. ,  Benson Chan

IPC: H05K100

CPC classification number: H05K7/1061 ,  H05K3/325 ,  H05K2201/09972 ,  H05K2201/10378 ,  H05K2201/10719

Abstract: The present invention provides a land grid array (LGA) connector that is formed from a plurality of sections. Specifically, each LGA section includes at least one set of fingers. Each set of fingers interconnects with a set of fingers of another section to form the LGA connector. By forming the LGA connector in this manner a maximum quantity of input/output (I/O) contacts can be provided.

Abstract translation: 本发明提供一种由多个部分形成的焊盘格栅阵列（LGA）连接器。 具体地说，每个LGA部分包括至少一组手指。 每组手指与另一部分的一组手指互连以形成LGA连接器。 通过以这种方式形成LGA连接器，可以提供最大量的输入/输出（I / O）触点。