CLOCK SIGNAL GENERATOR AND OPERATING METHOD THEREOF

    公开(公告)号:US20240267034A1

    公开(公告)日:2024-08-08

    申请号:US18416527

    申请日:2024-01-18

    CPC classification number: H03K3/011 G05F1/468 G05F3/262 H03K3/0233

    Abstract: A method of generating clock signals includes: receiving a bandgap reference voltage from a bandgap reference circuit; generating a first current having a first curvature characteristic based on the bandgap reference voltage; generating a second current having a second curvature characteristic based on the bandgap reference voltage; generating a first complementary to absolute temperature (CTAT) current by adding the first current to the second current; receiving a temperature-variable voltage and a temperature-fixed voltage from a voltage generator; generating an offset current based on the temperature-variable voltage and the temperature-fixed voltage; generating a reference current by adding the first CTAT current to the offset current; and generating the clock signals by alternately discharging a first capacitor and a second capacitor based on the reference current, and charging the first capacitor and the second capacitor based on a power voltage.

    Resistive memory device
    2.
    发明授权

    公开(公告)号:US12029048B2

    公开(公告)日:2024-07-02

    申请号:US17526262

    申请日:2021-11-15

    CPC classification number: H10B63/84 G11C13/0023 H10N70/011 H10N70/882

    Abstract: A resistive memory device includes: memory cells overlapping one another in a vertical direction within a cell array region and each including a switching element and a variable resistive element; first conductive lines each being connected to the switching element; a second conductive line connected to the variable resistive element and conductive pads arranged in a connection region and connected to respective one ends of the first conductive lines, respectively, and having different lengths in the second horizontal direction. A lower conductive pad from among the conductive pads includes a first portion covered by an upper conductive pad, and a second portion not covered by the upper conductive pad, and a thickness of each of the first and second portions in the vertical direction is greater than a thickness of each of the first conductive lines in the vertical direction.

    Memory device and operating method thereof

    公开(公告)号:US11615841B2

    公开(公告)日:2023-03-28

    申请号:US16871481

    申请日:2020-05-11

    Abstract: A memory device includes a plurality of memory cells, each including a switching device and an information storage device connected to the switching device and having a phase change material, the plurality of memory cells connected to a plurality of word lines and a plurality of bit lines, a decoder circuit determining at least one of the plurality of memory cells to be a selected memory cell, and a program circuit configured to input a programming current to the selected memory cell to perform a programming operation and configured to detect a resistance of the selected memory cell to adjust a magnitude of the programming current.

    MEMORY DEVICE AND OPERATING METHOD THEREOF

    公开(公告)号:US20210118502A1

    公开(公告)日:2021-04-22

    申请号:US16871481

    申请日:2020-05-11

    Abstract: A memory device includes a plurality of memory cells, each including a switching device and an information storage device connected to the switching device and having a phase change material, the plurality of memory cells connected to a plurality of word lines and a plurality of bit lines, a decoder circuit determining at least one of the plurality of memory cells to be a selected memory cell, and a program circuit configured to input a programming current to the selected memory cell to perform a programming operation and configured to detect a resistance of the selected memory cell to adjust a magnitude of the programming current.

    THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A VARIABLE RESISTANCE MEMORY

    公开(公告)号:US20220384524A1

    公开(公告)日:2022-12-01

    申请号:US17738366

    申请日:2022-05-06

    Abstract: A three-dimensional memory device includes: a plurality of word line groups including a plurality of word lines; a plurality of bit line groups extending in a vertical direction and including a plurality of bit lines spaced apart from the plurality of word lines; a plurality of memory cells arranged between the plurality of word lines and the plurality of bit lines and including a switching component and a variable resistance memory component; a plurality of global bit line groups connected to the plurality of bit line groups, wherein each of the plurality of global bit line groups includes a plurality of global bit lines electrically connected to a plurality of bit lines included in one bit line group, respectively; and a pad structure including a plurality of connection units and a plurality of pad layers, wherein the plurality of connection units are connected to the plurality of word line groups.

    Resistive memory devices and methods of operating resistive memory devices

    公开(公告)号:US11120872B2

    公开(公告)日:2021-09-14

    申请号:US16848149

    申请日:2020-04-14

    Abstract: A resistive memory device includes a memory cell array of resistive memory cells connected to word and bit lines, each bay of the memory cell array including K tiles; a write/read circuit connected to the memory cell array through a row decoder and a column decoder, the write/read circuit being configured to perform a write operation in a target tile of the memory cell array, the write/read circuit comprising write drivers corresponding to the bays; a control voltage generator configured to generate first and second control voltages based on a reference current; and a control circuit configured to control the write/read circuit and the control voltage generator. A first write driver that corresponds to a first bay of the bays is configured to provide the target tile with a write current corresponding to a physical position of a selected memory cell of the target tile in the memory cell array.

    MEMORY DEVICE AND OPERATING METHOD THEREOF
    9.
    发明公开

    公开(公告)号:US20240242743A1

    公开(公告)日:2024-07-18

    申请号:US18368907

    申请日:2023-09-15

    CPC classification number: G11C7/04 G11C7/08 G11C7/1063 G11C7/14

    Abstract: A memory device includes a memory cell array including a plurality of memory cells connected to a plurality of word lines and a plurality of bit lines, a voltage generator configured to output a first voltage that varies according to temperature of the memory device, a second voltage that is constant regardless of the temperature, and a first reference voltage applied to at least one line among the plurality of word lines and the plurality of bit lines, and a temperature compensation circuit configured to generate a compensation offset voltage based on the first voltage and the second voltage, and output a second reference voltage based on the first reference voltage and the compensation offset voltage.

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