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公开(公告)号：US20210020505A1
公开(公告)日：2021-01-21
申请号：US16797990
申请日：2020-02-21
发明人： Jaegwon Jang , Seokhyun Lee , Jongyoun Kim , Minjun Bae
IPC分类号： H01L21/768 , H01L23/00 , H01L21/56
摘要： A method of manufacturing a semiconductor package is provided including forming a lower redistribution layer. A conductive post is formed on the lower redistribution layer. A semiconductor chip is mounted on the lower redistribution layer. A molding member is formed on the lower redistribution layer. An upper surface of the molding member is at a level lower than an upper surface of the conductive post. An insulating layer is formed on the molding member. An upper surface of the insulating layer is at a level higher than the upper surface of the conductive post. The insulating layer is etched to expose the upper surface of the conductive post. An upper redistribution layer is formed on the insulating layer. The upper redistribution layer is electrically connected to the conductive post.
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公开(公告)号：US08922007B2
公开(公告)日：2014-12-30
申请号：US13770936
申请日：2013-02-19
发明人： YoungLyong Kim , Jaegwon Jang
IPC分类号： H01L23/48 , H01L21/768 , H01L23/00 , H01L23/498 , H01L23/522 , H01L23/31
CPC分类号： H01L23/49827 , H01L21/768 , H01L23/3192 , H01L23/49811 , H01L23/5226 , H01L24/05 , H01L24/13 , H01L2224/02125 , H01L2224/0214 , H01L2224/02145 , H01L2224/0401 , H01L2224/05096 , H01L2224/05124 , H01L2224/05147 , H01L2224/05567 , H01L2224/13021 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16238 , H01L2224/81424 , H01L2224/81447 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
摘要： Provided is a semiconductor package including a circuit substrate including a substrate pad, a semiconductor chip spaced apart from and facing the circuit substrate, the semiconductor chip including a chip pad, and a connection pattern electrically connecting the circuit substrate with the semiconductor chip. The semiconductor chip may include a plurality of first circuit patterns extending substantially perpendicular toward a top surface of the semiconductor chip and at least one first via electrically connecting the chip pad to the first circuit patterns. The chip pad may include a first region in contact with the connection pattern and a second region outside the first region, and the first via may be connected to the second region of the chip pad.
摘要翻译： 提供了一种半导体封装，其包括电路基板，该电路基板包括基板焊盘，与电路基板间隔开并面向电路基板的半导体芯片，所述半导体芯片包括芯片焊盘，以及将电路基板与半导体芯片电连接的连接图案。 半导体芯片可以包括多个基本上垂直于半导体芯片的顶表面延伸的第一电路图案，以及至少一个第一通孔，其将芯片焊盘电连接到第一电路图案。 芯片焊盘可以包括与连接图案接触的第一区域和第一区域外部的第二区域，并且第一通孔可以连接到芯片焊盘的第二区域。
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公开(公告)号：US12014975B2
公开(公告)日：2024-06-18
申请号：US17453243
申请日：2021-11-02
发明人： Jaegwon Jang , Kyoung Lim Suk , Minjun Bae
IPC分类号： H01L23/498 , H01L23/00 , H01L23/31
CPC分类号： H01L23/49816 , H01L23/3128 , H01L23/49822 , H01L23/49838 , H01L24/04 , H01L24/16 , H01L2224/0401 , H01L2224/16227
摘要： A semiconductor package includes a redistribution substrate and a semiconductor chip on a top surface of the redistribution substrate. The redistribution substrate includes an insulating layer, and first, second, and third redistribution patterns disposed in the insulating layer. The first to third redistribution patterns are sequentially stacked in an upward direction and are electrically connected to each other. Each of the first to third redistribution patterns includes a wire portion that extends parallel to the top surface of the redistribution substrate. Each of the first and third redistribution patterns further includes a via portion that extends from the wire portion in a direction perpendicular to the top surface of the redistribution substrate. The second redistribution pattern furthers include first fine wire patterns that are less wide than the wire portion of the second redistribution pattern.
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公开(公告)号：US11887931B2
公开(公告)日：2024-01-30
申请号：US17213506
申请日：2021-03-26
发明人： Inhyung Song , Kyoung Lim Suk , Jaegwon Jang , Wonkyoung Choi
IPC分类号： H01L21/768 , H01L23/522 , H01L23/00 , H01L23/31 , H01L23/495 , H01L23/528 , H01L23/532 , H01L27/08 , H01L23/538
CPC分类号： H01L23/5384 , H01L23/3114 , H01L23/5386 , H01L24/14
摘要： A semiconductor package includes a first semiconductor device on a first redistribution substrate, a first mold layer that covers the first semiconductor device and the first redistribution substrate, and a second redistribution substrate on the first mold layer, the second redistribution substrate including a first opening that exposes a top surface of the first mold layer, a sidewall of the second redistribution substrate that is exposed to the first opening having a stepwise structure.
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公开(公告)号：US11869835B2
公开(公告)日：2024-01-09
申请号：US17892215
申请日：2022-08-22
发明人： Seokhyun Lee , Jongyoun Kim , Yeonho Jang , Jaegwon Jang
IPC分类号： H01L21/00 , H01L23/498 , H01L21/48
CPC分类号： H01L23/49838 , H01L21/4857 , H01L23/49822 , H01L23/49816
摘要： A semiconductor package includes a semiconductor chip, a redistribution structure below the semiconductor chip, a first insulating layer below the redistribution structure, a pad below the first insulating layer, the pad being in contact with the redistribution structure, and a bump below the pad, wherein a horizontal maximum length of an upper portion of the pad is greater than a horizontal maximum length of a lower portion of the pad.
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公开(公告)号：US12087744B2
公开(公告)日：2024-09-10
申请号：US18125170
申请日：2023-03-23
发明人： Dongkyu Kim , Seokhyun Lee , Yeonho Jang , Jaegwon Jang
IPC分类号： H01L25/10 , H01L21/48 , H01L21/56 , H01L21/683 , H01L23/00 , H01L23/31 , H01L23/538 , H01L25/00
CPC分类号： H01L25/105 , H01L21/4853 , H01L21/4857 , H01L21/563 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/3135 , H01L23/5383 , H01L23/5386 , H01L23/5389 , H01L23/562 , H01L24/19 , H01L24/20 , H01L24/48 , H01L25/50 , H01L2221/68372 , H01L2224/214 , H01L2224/215 , H01L2224/48227 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/01028 , H01L2924/01029 , H01L2924/01079 , H01L2924/3511
摘要： A semiconductor package device includes a first semiconductor package, a second semiconductor package, and first connection terminals between the first and second semiconductor packages. The first semiconductor package includes a lower redistribution substrate, a semiconductor chip, and an upper redistribution substrate vertically spaced apart from the lower redistribution substrate across the semiconductor chip. The upper redistribution substrate includes a dielectric layer, redistribution patterns vertically stacked in the dielectric layer and each including line and via parts, and bonding pads on uppermost redistribution patterns. The bonding pads are exposed from the dielectric layer and in contact with the first connection terminals. A diameter of each bonding pad decreases in a first direction from a central portion at a top surface of the upper redistribution substrate to an outer portion at the top surface thereof. A thickness of each bonding pad increases in the first direction.
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公开(公告)号：US12015018B2
公开(公告)日：2024-06-18
申请号：US18060853
申请日：2022-12-01
发明人： Hyeonjeong Hwang , Kyoung Lim Suk , Seokhyun Lee , Jaegwon Jang
IPC分类号： H01L25/10 , H01L21/48 , H01L21/56 , H01L21/683 , H01L21/78 , H01L23/31 , H01L23/538 , H01L25/00
CPC分类号： H01L25/105 , H01L21/4853 , H01L21/4857 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/78 , H01L23/3128 , H01L23/5383 , H01L23/5386 , H01L23/5389 , H01L25/50 , H01L2221/68372 , H01L2225/1035 , H01L2225/1058
摘要： A semiconductor package includes a first redistribution substrate, a first semiconductor chip mounted on the first redistribution substrate, a first molding layer on the first redistribution substrate and covering a top surface and lateral surfaces of the first semiconductor chip, a second redistribution substrate on the first molding layer, and an adhesive film between the second redistribution substrate and the first molding layer. The adhesive film is spaced apart from the first semiconductor chip and covers a top surface of the first molding layer. A lateral surface of the adhesive film is coplanar with a lateral surface of the second redistribution substrate.
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公开(公告)号：US11901276B2
公开(公告)日：2024-02-13
申请号：US18153601
申请日：2023-01-12
发明人： Yeonho Jang , Jongyoun Kim , Jungho Park , Jaegwon Jang
IPC分类号： H01L23/498 , H01L21/48 , H01L23/00
CPC分类号： H01L23/49816 , H01L21/4853 , H01L21/4857 , H01L23/49822 , H01L23/49838 , H01L23/49866 , H01L24/16 , H01L2224/16227
摘要： A semiconductor package includes a semiconductor chip; a redistribution insulating layer including a first opening; an external connection bump including a first part in the first opening; a lower bump pad including a first surface in physical contact with the first part of the external connection bump and a second surface opposite to the first surface, wherein the first surface and the redistribution insulating layer partially overlap; and a redistribution pattern that electrically connects the lower bump pad to the semiconductor chip.
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公开(公告)号：US11810915B2
公开(公告)日：2023-11-07
申请号：US17359110
申请日：2021-06-25
发明人： Kyoung Lim Suk , Seokhyun Lee , Jaegwon Jang
IPC分类号： H01L21/768 , H01L23/522 , H01L23/00 , H01L23/31 , H01L23/495 , H01L23/528 , H01L23/532 , H01L27/08 , H01L23/538 , H01L49/02
CPC分类号： H01L27/0805 , H01L23/5222 , H01L23/5386 , H01L24/14 , H01L28/60
摘要： Disclosed is a semiconductor package including: a redistribution substrate; at least one passive device in the redistribution substrate, the passive device including a first terminal and a second terminal; and a semiconductor chip on a top surface of the redistribution substrate, the semiconductor chip vertically overlapping at least a portion of the passive device, wherein the redistribution substrate includes: a dielectric layer in contact with a first lateral surface, a second lateral surface opposite to the first lateral surface, and a bottom surface of the passive device; a lower conductive pattern on the first terminal; a lower seed pattern provided between the first terminal and the conductive pattern, and directly connected to the first terminal; a first upper conductive pattern on the second terminal and a first upper seed pattern provided between the second terminal and the first upper conductive pattern, and directly connected to the second terminal.
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公开(公告)号：US11804427B2
公开(公告)日：2023-10-31
申请号：US17177305
申请日：2021-02-17
发明人： Dongkyu Kim , Seokhyun Lee , Kyoung Lim Suk , Jaegwon Jang , Gwangjae Jeon
IPC分类号： H01L23/498 , H01L23/00 , H01L25/065
CPC分类号： H01L23/49822 , H01L23/49833 , H01L23/49894 , H01L24/16 , H01L24/32 , H01L25/0657 , H01L2224/16227 , H01L2224/32225
摘要： A semiconductor package may include a redistribution substrate, a connection terminal, and a semiconductor chip sequentially stacked. The redistribution substrate may include an insulating layer, a plurality of redistribution patterns, which are vertically stacked in the insulating layer, and each of which includes interconnection and via portions, and a bonding pad on the interconnection portion of the topmost redistribution pattern. The topmost redistribution pattern and the bonding pad may include different metallic materials. The bonding pad may have first and second surfaces opposite to each other. The first surface of the bonding pad may be in contact with a top surface of the interconnection portion of the topmost redistribution pattern. A portion of the second surface of the bonding pad may be in contact with the connection terminal. The insulating layer may be extended to be in contact with the remaining portion of the second surface.
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