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    Transponder apparatus
    4.
    发明授权
    Transponder apparatus 有权

    公开(公告)号：US10552725B2

    公开(公告)日：2020-02-04

    申请号：US15753557

    申请日：2016-08-17

    Applicant: SMARTRAC TECHNOLOGY GmbH

    Inventor： Lars Klemm ,  Carsten Nieland ,  Sebastian Gallschütz

    IPC: G06K19/06 ,  G06K19/077

    Abstract: A transponder apparatus for a transponder unit has a UHF and HF transponder The UHF transponder has a transponder support, a UHF antenna and a UHF chip. The HF transponder has an HF antenna and an HF chip. The UHF antenna is at the transponder support and is made up of conducting UHF antenna structures in transponder support planes which are spatially separated from one another. The transponder apparatus includes an electrically-insulating attachment layer connecting the UHF transponder to the HF antenna. The transponder apparatus includes an electrically-insulating spacer element connected to the HF transponder and which spatially separates the UHF transponder and the HF transponder relative to a body. The UHF transponder is disposed on the HF antenna. A conducting HF antenna structure of the HF antenna extends beyond a covering surface of the UHF transponder and the HF antenna structure.

    Method for Separating Chips from a Wafer
    5.
    发明申请
    Method for Separating Chips from a Wafer 有权
    从晶片分离芯片的方法

    公开(公告)号：US20160093534A1

    公开(公告)日：2016-03-31

    申请号：US14785554

    申请日：2014-04-24

    Applicant: SMARTRAC TECHNOLOGY GMBH

    Inventor： Frank Kriebel ,  Laurence Singleton ,  Carsten Nieland

    IPC: H01L21/78 ,  B23K26/53 ,  H01L29/34 ,  B23K26/00

    CPC classification number: H01L21/78 ,  B23K26/0006 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50 ,  B23K2103/56 ,  H01L29/34

    Abstract: The invention relates to a method for producing chips (13) by dividing a wafer along dividing lines (11, 12) defining dimensions of the chip, wherein a focus (18) of a preferably pulsed laser radiation (16) is moved along the dividing lines on a first and at least a second path (25, 26) within the wafer body, wherein the laser radiation is applied to the wafer from a rear side (17) of the wafer, and the power density for producing the defects (28) on the first path (25) is lower than the power density for producing the defects (29) on the second path (26), and/or the number of defects on the first path is smaller than the number of defects on the second path.

    Abstract translation: 本发明涉及一种通过沿着限定芯片尺寸的分割线（11,12）分割晶片来制造芯片（13）的方法，其中优选脉冲激光辐射（16）的焦点（18）沿着分割 在晶片体内的第一和至少第二路径（25,26）上的线，其中激光辐射从晶片的后侧（17）施加到晶片，并且用于产生缺陷的功率密度（28 ）比第二路径（26）上产生缺陷（29）的功率密度低，和/或第一路径上的缺陷数小于第二路径（26）上的缺陷数量 路径。

    TRANSPONDER APPARATUS
    7.
    发明申请
    TRANSPONDER APPARATUS 审中-公开

    公开(公告)号：US20180240005A1

    公开(公告)日：2018-08-23

    申请号：US15753557

    申请日：2016-08-17

    Applicant: SMARTRAC TECHNOLOGY GmbH

    Inventor： Lars Klemm ,  Carsten Nieland ,  Sebastian Gallschütz

    IPC: G06K19/077

    Abstract: The invention relates to a transponder apparatus (10) for a transponder unit which can be worn on a human or animal body, such as a collar, band or the like, comprising a UHF transponder and an HF transponder (12), wherein the UHF transponder is made up of a transponder support (11), a UHF antenna and a UHF chip, wherein the HF transponder is made up of an HF antenna (16) and an HF chip (15), wherein the UHF antenna is disposed at the transponder support and is made up of conducting UHF antenna structures in transponder support planes which are spatially separated from one another, wherein the transponder apparatus comprises an electrically-insulating attachment layer (13) which connects the UHF transponder to the HF antenna, wherein the transponder apparatus comprises an electrically-insulating spacer element (14) which is connected to the HF transponder and which spatially separates the UHF transponder and the HF transponder relative to a body (20), wherein the UHF transponder is disposed on the HF antenna, wherein a conducting HF antenna structure (17) of the HF antenna extends beyond a covering surface f the UHF transponder and the HF antenna structure. The invention relates also to a transponder apparatus which comprises an electrically-insulating attachment layer and an electrically-insulating spacer element, wherein the spacer element is connected to the UHF transponder by way of the attachment layer and spatially separates the UHF transponder and the HF transponder from a body (20) relative thereto, wherein the upper UHF antenna structure at least partially surrounds the HF antenna structure or the upper UHF antenna structure and the HF antenna structure are disposed in opposing sections of the common plane, respectively.

    Contact bump connection and contact bump and method for producing a contact bump connection
    8.
    发明授权
    Contact bump connection and contact bump and method for producing a contact bump connection 有权

    公开(公告)号：US10292270B2

    公开(公告)日：2019-05-14

    申请号：US14420730

    申请日：2013-08-09

    Applicant: SMARTRAC TECHNOLOGY GMBH

    Inventor： Carsten Nieland ,  Frank Kriebel

    IPC: H05K1/18 ,  H05K3/30 ,  H01L23/00 ,  H01L21/768 ,  H01L23/498 ,  H05K3/34

    Abstract: The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face (11) and a contact substrate (26) being contacted with the component and having at least one second terminal face (25), wherein the first terminal face is provided with a contact bump (10), which has a raised edge (15) and has at least one displacement pin (16) in a displacement compartment (18) being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region (31) with the first terminal face, the second terminal face has a contact bead (30), which is formed by displacement of a contact material (29) of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown (33) which is oriented to a bottom (17) of the displacement compartment and is raised relative to a level contact surface (32) of the second terminal face surrounding the contact region.

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